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IS61WV10248BLL-10TLI

Integrated Silicon Solution

IS61WV10248BLL-10TLI by Integrated Silicon Solution

IS61WV10248BLL-10TLI by Integrated Silicon Solution is a 1MX8 SRAM with 3-STATE output, operating at 3.6V max supply voltage and 10ns access time. Ideal for industrial applications requiring fast and reliable memory storage in a small outline package.

Median Price

$15.579

Lifecycle Status

Suppliers In-Stock

19

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1k+

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Farnell

UK . 132 parts In-Stock

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$12.560

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$10.320

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Arrow

USA . 10 parts In-Stock

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$15.202

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$12.085

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$11.068

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$15.202

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$11.068

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Verical

USA . 10 parts In-Stock

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$15.202

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$12.085

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$11.068

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10

$15.202

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$11.068

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Chip1Stop

Japan . 2 parts In-Stock

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$15.579

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Element14

Singapore . 55 parts In-Stock

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$21.590

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$17.440

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Mouser Electronics

USA . 110 parts In-Stock

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$27.540

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$23.210

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Newark

USA . 29 parts In-Stock

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$32.030

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EBV Elektronik

Germany . 135 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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$14.366

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Chip Stock

USA . 14,000 parts In-Stock

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Vyrian

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Lantek

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Sensible Micro Corp

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J2 Sourcing AB

Sweden . 79 parts In-Stock

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NAC Semi

USA . 71 parts In-Stock

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ComSIT Distribution GmbH

Germany . 64 parts In-Stock

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North Shore Components

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Cogito LLC

Ukraine . 17 parts In-Stock

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Goldney Electronics S.L.

Spain . 7 parts In-Stock

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Corohmni

South Africa . 168 parts In-Stock

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$2.134

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Aztec Data Supply Inc.

USA . 108 parts In-Stock

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$4.722

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Netroflash

USA . 1,000 parts In-Stock

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$14.366

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$13.648

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$13.360

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$14.366

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$13.360

AZTECH Wire

Italy . 266 parts In-Stock

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$16.460

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Continental Prestige Electronics

USA . 68 parts In-Stock

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$16.510

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$9.900

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Perfect Parts

USA . 4,553 parts In-Stock

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Kepictronics

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Argo Parts USA

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Eastek

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GreenTree Electronics

Israel . 63 parts In-Stock

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Overview

Experience the next level of performance and reliability with the IS61WV10248BLL-10TLI by Integrated Silicon Solution. As a leading manufacturer in the industry, ISS delivers cutting-edge SRAM technology that guarantees seamless operation in various applications. With a focus on quality and innovation, this product offers exceptional value to customers looking for high-speed memory solutions. Trust ISS to provide you with the competitive edge you need to stay ahead in today's fast-paced world. Upgrade to ISS for unparalleled performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the SRAM, making it a reliable choice.

Surface Mount: YES

Being a surface mount device, this SRAM is easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on the board, optimizing space utilization.

Operating Mode: ASYNCHRONOUS

The asynchronous operation of this SRAM allows for fast and flexible data access, enhancing performance.

Input/Output Type: COMMON

With a common input/output type, this SRAM simplifies the interface design and integration process.

Nominal Supply Voltage: 3V

Operating at a nominal voltage of 3V, this SRAM is compatible with a wide range of systems and applications.

Power Supplies: 2.5/3.3V

With multiple power supply options, this SRAM can be tailored to meet specific voltage requirements.

No. of Terminals: 44

The 44 terminals provide ample connectivity options, facilitating seamless integration with other components.

Package Style: SMALL OUTLINE, THIN PROFILE

The small outline and thin profile of the package make this SRAM suitable for compact designs with limited space.

Maximum Operating Temperature: 85 °C

With a high operating temperature tolerance, this SRAM can withstand harsh environmental conditions.

Technical Specifications

SRAM IS61WV10248BLL-10TLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.025 Amp

Minimum Standby Voltage:

1.2 V

Sub-Category:

SRAMs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width:

10.16 mm

Trade Compliance

IS61WV10248BLL-10TLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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