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CY62147EV30LL-45B2XI

Infineon Technologies

CY62147EV30LL-45B2XI by Infineon Technologies

Infineon's CY62147EV30LL-45B2XI is a 256Kx16 SRAM with 3.3V nominal voltage, operating at -40 to 85°C. It features a very thin profile grid array package, 0.75mm terminal pitch, and 45ns access time. Ideal for industrial applications requiring fast and reliable parallel memory storage.

Median Price

$3.938

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,139 parts In-Stock

1+ parts

$5.160

100+ parts

$4.446

1k+ parts

$4.099

10k+ parts

$4.038

1,139

$5.160

$4.446

$4.099

$4.038

Mouser Electronics

USA . 206 parts In-Stock

1+ parts

$5.700

100+ parts

$4.910

1k+ parts

$4.520

10k+ parts

-

206

$5.700

$4.910

$4.520

-

Flip Electronics (Authorized)

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

-

-

-

-

Rochester

USA . 1,734 parts In-Stock

1+ parts

-

100+ parts

$2.990

1k+ parts

$2.680

10k+ parts

$2.520

1,734

-

$2.990

$2.680

$2.520

Verical

USA . 836 parts In-Stock

1+ parts

-

100+ parts

$3.938

1k+ parts

$3.350

10k+ parts

$3.150

836

-

$3.938

$3.350

$3.150

Future Electronics

Canada . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.710

10k+ parts

-

480

-

-

$2.710

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 217 parts In-Stock

1+ parts

$4.436

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$4.436

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$5.310

-

-

-

Flip Electronics

USA . 6,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,340

-

-

-

-

Vyrian

USA . 761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

761

-

-

-

-

IBS Electronics

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.759

10k+ parts

$3.703

480

-

-

$3.759

$3.703

Euro-Tech

UK . 348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

348

-

-

-

-

Classic Components Corporation

USA . 132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

132

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$2.813

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$2.813

-

-

-

Aztec Data Supply Inc.

USA . 2,635 parts In-Stock

1+ parts

$3.944

100+ parts

-

1k+ parts

-

10k+ parts

-

2,635

$3.944

-

-

-

Semicontronic

India . 1,223 parts In-Stock

1+ parts

$3.970

100+ parts

$3.871

1k+ parts

$3.851

10k+ parts

-

1,223

$3.970

$3.871

$3.851

-

Ampacity Inc.

Singapore . 1,194 parts In-Stock

1+ parts

$3.970

100+ parts

-

1k+ parts

-

10k+ parts

-

1,194

$3.970

-

-

-

Corphita

USA . 105 parts In-Stock

1+ parts

$4.203

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$4.203

-

-

-

Component Stockers USA

USA . 1,179 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$4.800

-

-

-

Continental Prestige Electronics

USA . 4,974 parts In-Stock

1+ parts

$5.310

100+ parts

-

1k+ parts

-

10k+ parts

$5.204

4,974

$5.310

-

-

$5.204

Bastille Electronics

Australia . 750 parts In-Stock

1+ parts

$5.310

100+ parts

$5.044

1k+ parts

$4.792

10k+ parts

$4.726

750

$5.310

$5.044

$4.792

$4.726

Modulus Dynamics

Lithuania . 2,530 parts In-Stock

1+ parts

$5.918

100+ parts

$5.681

1k+ parts

$5.445

10k+ parts

-

2,530

$5.918

$5.681

$5.445

-

Argo Parts USA

USA . 3,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,461

-

-

-

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Perfect Parts

USA . 1,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,636

-

-

-

-

Overview

Unlock the potential of your devices with the CY62147EV30LL-45B2XI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies brings you high-quality SRAM memory solutions that are perfect for a wide range of applications. With a focus on reliability and performance, this product offers seamless integration, fast data access, and low power consumption. Elevate your projects with the value and benefits that only Infineon Technologies can provide. Choose CY62147EV30LL-45B2XI and experience innovation at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation in a variety of electronic devices.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures efficient use of space on a circuit board.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides flexibility and fast access times, making this product ideal for high-speed applications.

Input/Output Type: COMMON

The common input/output type simplifies integration with other components, reducing complexity in system design.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this product offers efficient power consumption without compromising performance.

Power Supplies (V): 2.5/3.3

With multiple power supply options, this product can be adapted to different voltage requirements in various systems.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity and expanded functionality in electronic circuits.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch design provides high component density and superior thermal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can reliably operate in harsh environments without sacrificing performance.

Technical Specifications

SRAM CY62147EV30LL-45B2XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62147EV30LL-45B2XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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