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5962-8685909LA

Pyramid Semiconductor

5962-8685909LA by Pyramid Semiconductor

OTHER SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;

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5962-8685909LA by Pyramid Semiconductor
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Technical Specifications

SRAM 5962-8685909LA attributes and parameters. Explore more SRAM devices from Pyramid Semiconductor

Specs

Maximum Access Time:

35 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

32.004 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

24

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16KX4

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Standby Current:

.025 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

140 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8685909LA Memory ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Pyramid Semiconductor

Pyramid Semiconductor Corporation is a manufacturer of semiconductor integrated circuits including MIL-STD-1750A Processors, Static RAMs, EEPROMs and FCT/FCT-T Logic. Pyramid Semiconductor Corporation is a fabless semiconductor manufacturer where wafers are manufactured in the USA and TAIWAN at outside wafer foundries. Based on our proprietary high performance semiconductor designs, our devices are offered in a variety of different plastic and hermetic ceramic packages. Pyramid Semiconductor supports SMD with more than 100 Standard Military drawings (SMDs) available and recommended for high longevity military applications. The Company occupies a 10,000 square foot facility where die design, wafer testing, assembly of products, environmental testing, electrical testing, burn-in, marking and QA on devices are all performed prior to delivery of products worldwide to various Military, Industrial and Commercial customers. It also gives us the capability to develop custom solutions on demand (logic functions, packages, …) with short lead times. Headquartered in Sunnyvale, California, USA, the Company was formed in January 2003 through the acquisition of all the product lines from Performance Semiconductor. All products previously supported by Performance Semiconductor are being supported by Pyramid Semiconductor. The Pyramid Semiconductor part numbering scheme is identical to the part numbers previously used by Performance Semiconductor. On March 8, 2021, HEICO Corporation Electronic Technologies Group acquired Pyramid Semiconductor LLC. The business continues to operate as a part of HEICO/3D PLUS USA, which is also located in the Silicon Valley area. Together, leveraging on their area of expertise, the two businesses will seek to provide customers additional products and capabilities.

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