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CY14B108N-ZSP25XI

Cypress Semiconductor

CY14B108N-ZSP25XI by Cypress Semiconductor

NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Qualification: Not Qualified;

Median Price

$75.070

Lifecycle Status

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Farnell

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$50.780

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$40.630

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Newark

USA . 109 parts In-Stock

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$70.670

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$60.810

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Chip1Stop

Japan . 20 parts In-Stock

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$74.900

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Arrow

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$75.070

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$61.220

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Verical

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$75.070

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$61.220

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Mouser Electronics

USA . 496 parts In-Stock

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$75.830

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$64.170

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DigiKey

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$66.022

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$64.165

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Element14

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$6,866.710

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$5,229.150

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Rochester

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$48.550

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$43.440

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$40.880

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Digiode

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$46.712

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Nova Conductors

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Flip Electronics

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Vyrian

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Modulus Dynamics

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$2.648

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$2.542

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$2.436

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Corohmni

South Africa . 48 parts In-Stock

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Aztec Data Supply Inc.

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Semicontronic

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$42.081

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$41.865

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Corphita

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Continental Prestige Electronics

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Component Stockers USA

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Lixinc

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Argo Parts USA

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iodParts Technologies Inc.

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Netroflash

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$53.436

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$52.311

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Perfect Parts

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Technical Specifications

SRAM CY14B108N-ZSP25XI attributes and parameters. Explore more SRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

54

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

75 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

CY14B108N-ZSP25XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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