Loading...

CY62168EV30LL-45BVXIT

Infineon Technologies

CY62168EV30LL-45BVXIT by Infineon Technologies

Infineon's CY62168EV30LL-45BVXIT is a 2MX8 SRAM with 3.3V supply, 45ns access time, and 85°C operating temp. Ideal for industrial applications requiring fast, common I/O asynchronous memory in a compact grid array package.

Median Price

$9.832

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 586 parts In-Stock

1+ parts

-

100+ parts

$8.740

1k+ parts

$7.820

10k+ parts

$7.360

586

-

$8.740

$7.820

$7.360

Verical

USA . 586 parts In-Stock

1+ parts

-

100+ parts

$10.925

1k+ parts

$9.775

10k+ parts

$9.200

586

-

$10.925

$9.775

$9.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

836

-

-

-

-

Flip Electronics

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Vyrian

USA . 435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

435

-

-

-

-

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

76

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 128 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$3.280

-

-

-

Modulus Dynamics

Lithuania . 1,681 parts In-Stock

1+ parts

$4.440

100+ parts

$4.262

1k+ parts

$4.085

10k+ parts

-

1,681

$4.440

$4.262

$4.085

-

Corohmni

South Africa . 721 parts In-Stock

1+ parts

$4.624

100+ parts

-

1k+ parts

-

10k+ parts

-

721

$4.624

-

-

-

Semicontronic

India . 1,375 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

1,375

$5.000

$4.875

$4.850

-

AZTECH Wire

Italy . 435 parts In-Stock

1+ parts

$15.527

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$15.527

-

-

-

Ampacity Inc.

Singapore . 895 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$20.000

-

-

-

Component Stockers USA

USA . 545 parts In-Stock

1+ parts

$117.440

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$117.440

-

-

-

Argo Parts USA

USA . 2,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,883

-

-

-

-

Advanced Electronics

New Zealand . 2,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,624

-

-

-

-

Continental Prestige Electronics

USA . 1,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,704

-

-

-

-

Corphita

USA . 557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

557

-

-

-

-

Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

550

-

-

-

-

Overview

Enhance your electronic devices with the CY62168EV30LL-45BVXIT from Infineon Technologies, a leading manufacturer known for top-quality SRAM products. This versatile memory solution offers reliable performance in various applications, delivering value and benefits to customers seeking efficient data storage solutions. With its advanced technology and industrial-grade reliability, this SRAM module provides a seamless user experience while optimizing device functionality. Upgrade your electronics with the CY62168EV30LL-45BVXIT and experience enhanced performance like never before.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy in the package body makes this SRAM durable and lightweight, ideal for various applications.

Surface Mount:

YES - The surface mount capability of this SRAM makes it easy to integrate into circuit boards, saving time and effort during assembly.

Package Shape:

RECTANGULAR - The rectangular package shape allows for efficient use of space on a PCB, making this SRAM suitable for compact designs.

Operating Mode:

ASYNCHRONOUS - The asynchronous operating mode of this SRAM provides flexibility and compatibility with different systems and architectures.

Input/Output Type:

COMMON - The common input/output type simplifies the interface of this SRAM with other components, reducing integration complexities.

Nominal Supply Voltage / Vsup (V):

3 - The 3V nominal supply voltage ensures efficient power consumption, making this SRAM energy-efficient.

Power Supplies (V):

2.5/3.3 - The availability of 2.5V and 3.3V power supplies gives users flexibility in voltage selection, catering to various system requirements.

No. of Terminals:

48 - With 48 terminals, this SRAM offers ample connectivity options, making it suitable for diverse applications.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - The grid array style with a thin profile and fine pitch allows for high-density mounting, maximizing board space utilization.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature of 85°C ensures the reliability and performance of this SRAM in demanding environmental conditions.

Organization:

2MX8 - The 2MX8 organization provides a balance between capacity and speed, meeting the needs of various memory-intensive applications.

Output Characteristics:

3-STATE - The 3-state output characteristics offer flexibility in controlling the output signals, enhancing the versatility of this SRAM.

Minimum Standby Voltage:

1.5 V - The low minimum standby voltage of 1.5V contributes to power efficiency, prolonging battery life in portable devices.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature of -40°C ensures reliable performance even in sub-zero environments, making this SRAM suitable for industrial applications.

Technical Specifications

SRAM CY62168EV30LL-45BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62168EV30LL-45BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20