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CY14B101Q2A-SXIT

Infineon Technologies

CY14B101Q2A-SXIT by Infineon Technologies

Infineon's CY14B101Q2A-SXIT is a 128Kx8 non-volatile SRAM with synchronous operation and 3V nominal voltage. It features a small outline package, industrial temperature grade, and serial interface. Ideal for applications requiring reliable memory storage in harsh environments.

Median Price

$8.336

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 18,597 parts In-Stock

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Future Electronics

Canada . 2,500 parts In-Stock

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$8.550

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$8.550

Avnet

USA . 2,500 parts In-Stock

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$8.122

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$8.122

Distributors (In-Stock)

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Flip Electronics

USA . 27,130 parts In-Stock

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Vyrian

USA . 18,155 parts In-Stock

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Digiode

USA . 316 parts In-Stock

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Nova Conductors

Japan . 34 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 18,355 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

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-

18,355

$1.000

$0.975

$0.970

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Aztec Data Supply Inc.

USA . 1,890 parts In-Stock

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$4.552

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$4.552

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Corohmni

South Africa . 1,152 parts In-Stock

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$4.881

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$4.881

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Modulus Dynamics

Lithuania . 2,845 parts In-Stock

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$5.620

100+ parts

$5.395

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$5.170

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Ampacity Inc.

Singapore . 18,553 parts In-Stock

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$7.000

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Component Stockers USA

USA . 866 parts In-Stock

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$110.200

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Perfect Parts

USA . 5,600 parts In-Stock

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Continental Prestige Electronics

USA . 3,586 parts In-Stock

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Argo Parts USA

USA . 2,282 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Corphita

USA . 862 parts In-Stock

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Infinite Electronics LLP (Excess)

. 589 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the CY14B101Q2A-SXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products that are perfect for a wide range of applications. With its advanced technology and industrial-grade design, this non-volatile SRAM offers customers exceptional value and benefits. Trust in the CY14B101Q2A-SXIT to provide you with the memory density and efficiency you need for your projects, all while ensuring maximum reliability and performance. Elevate your electronics with Infineon Technologies!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes it easy to integrate into electronic circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination in data transfer.

Nominal Supply Voltage / Vsup (V): 3

Compatible with a common supply voltage, making it easy to incorporate into existing systems.

No. of Terminals: 8

Simple and straightforward interface with a low terminal count.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, ideal for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Memory IC Type: NON-VOLATILE SRAM

Non-volatile memory ensures data retention even when power is lost, critical for certain applications.

Technical Specifications

SRAM CY14B101Q2A-SXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.889 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.727 mm

Maximum Standby Current:

.00015 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.8985 mm

Trade Compliance

CY14B101Q2A-SXIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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