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CY62167G30-45ZXIT

Infineon Technologies

CY62167G30-45ZXIT by Infineon Technologies

Infineon's CY62167G30-45ZXIT is a 1MX16 SRAM with 3-STATE output, operating at -40 to 85°C. It has a supply voltage range of 2.2V to 3.6V and max access time of 45ns. Ideal for industrial applications requiring high-speed parallel memory with low standby current consumption.

Median Price

$10.400

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 740 parts In-Stock

1+ parts

$15.210

100+ parts

$13.019

1k+ parts

$11.961

10k+ parts

-

740

$15.210

$13.019

$11.961

-

Flip Electronics (Authorized)

USA . 4,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,985

-

-

-

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Verical

USA . 613 parts In-Stock

1+ parts

-

100+ parts

$10.400

1k+ parts

$9.313

10k+ parts

$8.762

613

-

$10.400

$9.313

$8.762

Rochester

USA . 613 parts In-Stock

1+ parts

-

100+ parts

$8.320

1k+ parts

$7.450

10k+ parts

$7.010

613

-

$8.320

$7.450

$7.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 23,505 parts In-Stock

1+ parts

-

100+ parts

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23,505

-

-

-

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Vyrian

USA . 4,900 parts In-Stock

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-

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4,900

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-

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Chip Stock

USA . 3,100 parts In-Stock

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3,100

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Digiode

USA . 338 parts In-Stock

1+ parts

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338

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ACDS - Activité Composants Distribution Service

France . 24 parts In-Stock

1+ parts

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24

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 577 parts In-Stock

1+ parts

$4.695

100+ parts

-

1k+ parts

-

10k+ parts

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577

$4.695

-

-

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Ampacity Inc.

Singapore . 4,983 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

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4,983

$19.000

-

-

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Modulus Dynamics

Lithuania . 1,548 parts In-Stock

1+ parts

$19.305

100+ parts

$18.533

1k+ parts

$17.761

10k+ parts

-

1,548

$19.305

$18.533

$17.761

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Corohmni

South Africa . 203 parts In-Stock

1+ parts

$19.305

100+ parts

-

1k+ parts

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10k+ parts

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203

$19.305

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Semicontronic

India . 4,596 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

10k+ parts

-

4,596

$21.000

$20.475

$20.370

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Argo Parts USA

USA . 2,930 parts In-Stock

1+ parts

-

100+ parts

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2,930

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Continental Prestige Electronics

USA . 1,871 parts In-Stock

1+ parts

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1,871

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Corphita

USA . 176 parts In-Stock

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176

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Perfect Parts

USA . 54 parts In-Stock

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54

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Cyclops Electronics Ltd (Excess)

UK . 24 parts In-Stock

1+ parts

-

100+ parts

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24

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Overview

Unlock the power of high-quality SRAM technology with the CY62167G30-45ZXIT by Infineon Technologies. This cutting-edge memory solution offers unparalleled reliability and performance for a wide range of industrial applications. With Infineon's reputation for excellence in semiconductor manufacturing, you can trust that this SRAM module will deliver superior results. Experience seamless operation, fast access times, and low standby current draw with the CY62167G30-45ZXIT, making it the ideal choice for demanding projects where precision and efficiency are paramount. Elevate your designs with this top-of-the-line memory solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, ensuring a longer lifespan.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Package Shape: RECTANGULAR

Standard shape for easy integration into various electronic systems.

Operating Mode: ASYNCHRONOUS

Allows for independent operation and access to memory locations, increasing efficiency.

Nominal Supply Voltage / Vsup (V): 3

Common voltage requirement for compatibility with many systems.

No. of Terminals: 48

Adequate number of terminals for connectivity and integration within a circuit.

Terminal Finish: PURE TIN

Provides a reliable and conductive finish for the terminals, ensuring good electrical connections.

Temperature Grade: INDUSTRIAL

Suitable for a wide range of temperature conditions, making it versatile for different applications.

Technology: CMOS

Low power consumption and high noise immunity, enhancing the efficiency of the product.

Terminal Form: GULL WING

Easy soldering process for efficient manufacturing and assembly.

Technical Specifications

SRAM CY62167G30-45ZXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP48,47,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000016 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

36 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

12 mm

Trade Compliance

CY62167G30-45ZXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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