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CY7C1049G30-10ZSXI

Infineon Technologies

CY7C1049G30-10ZSXI by Infineon Technologies

Infineon's CY7C1049G30-10ZSXI is a 512Kx8 SRAM with 10ns access time, operating at 3V. It features a small outline package suitable for industrial applications. With parallel technology and 524288 words, it offers high memory density in a compact form factor.

Median Price

$7.140

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,340 parts In-Stock

1+ parts

$7.140

100+ parts

-

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1,340

$7.140

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Mouser Electronics

USA . 712 parts In-Stock

1+ parts

$7.160

100+ parts

$6.070

1k+ parts

$5.260

10k+ parts

-

712

$7.160

$6.070

$5.260

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DigiKey

USA . 137 parts In-Stock

1+ parts

$7.160

100+ parts

$6.313

1k+ parts

$5.797

10k+ parts

$5.651

137

$7.160

$6.313

$5.797

$5.651

Rochester

USA . 8,264 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$3.770

10k+ parts

$3.540

8,264

-

$4.210

$3.770

$3.540

Verical

USA . 5,657 parts In-Stock

1+ parts

-

100+ parts

$5.263

1k+ parts

$4.713

10k+ parts

$4.425

5,657

-

$5.263

$4.713

$4.425

Flip Electronics (Authorized)

USA . 690 parts In-Stock

1+ parts

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690

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Future Electronics

Canada . 675 parts In-Stock

1+ parts

-

100+ parts

$3.890

1k+ parts

$3.820

10k+ parts

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675

-

$3.890

$3.820

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RS (Exports)

UK . 43 parts In-Stock

1+ parts

-

100+ parts

$7.796

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43

-

$7.796

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 579 parts In-Stock

1+ parts

$5.158

100+ parts

-

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579

$5.158

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Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$8.260

100+ parts

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550

$8.260

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Vyrian

USA . 1,853 parts In-Stock

1+ parts

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1,853

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Flip Electronics

USA . 690 parts In-Stock

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690

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ACDS - Activité Composants Distribution Service

France . 688 parts In-Stock

1+ parts

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688

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IBS Electronics

USA . 675 parts In-Stock

1+ parts

-

100+ parts

$5.091

1k+ parts

$4.909

10k+ parts

-

675

-

$5.091

$4.909

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Schukat

Germany . 110 parts In-Stock

1+ parts

-

100+ parts

$5.173

1k+ parts

$4.934

10k+ parts

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110

-

$5.173

$4.934

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$2.542

100+ parts

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282

$2.542

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Modulus Dynamics

Lithuania . 5,235 parts In-Stock

1+ parts

$3.863

100+ parts

$3.708

1k+ parts

$3.554

10k+ parts

-

5,235

$3.863

$3.708

$3.554

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$4.168

100+ parts

$3.793

1k+ parts

$3.418

10k+ parts

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300

$4.168

$3.793

$3.418

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Aztec Data Supply Inc.

USA . 157 parts In-Stock

1+ parts

$4.255

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157

$4.255

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Ampacity Inc.

Singapore . 1,607 parts In-Stock

1+ parts

$4.450

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1,607

$4.450

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Semicontronic

India . 1,400 parts In-Stock

1+ parts

$4.510

100+ parts

$4.397

1k+ parts

$4.375

10k+ parts

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1,400

$4.510

$4.397

$4.375

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Corphita

USA . 56 parts In-Stock

1+ parts

$4.887

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56

$4.887

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Continental Prestige Electronics

USA . 4,958 parts In-Stock

1+ parts

$8.260

100+ parts

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10k+ parts

$8.095

4,958

$8.260

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$8.095

Netroflash

USA . 500 parts In-Stock

1+ parts

$8.260

100+ parts

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500

$8.260

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Component Stockers USA

USA . 31 parts In-Stock

1+ parts

$8.950

100+ parts

$8.040

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31

$8.950

$8.040

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,983 parts In-Stock

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4,983

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Argo Parts USA

USA . 3,626 parts In-Stock

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3,626

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A-Z Elektronik GmbH

Germany . 1,325 parts In-Stock

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1,325

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Overview

Unlock exceptional performance and reliability with the CY7C1049G30-10ZSXI SRAM from Infineon Technologies. Crafted with precision and cutting-edge technology, this memory module is designed to meet the demands of industrial applications with its robust construction and superior functionality. Whether you're looking to enhance data processing speed or streamline your system's performance, this SRAM offers unmatched value and efficiency. Experience seamless operations and optimal results with the CY7C1049G30-10ZSXI SRAM - a game-changer in memory solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and efficient data transfer.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage of 3V for compatibility with various systems.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options for integration into different circuits.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications.

Memory IC Type: STANDARD SRAM

Being a standard SRAM ensures compatibility and proven performance in memory operations.

Maximum Access Time: 10 ns

Fast access time ensures quick retrieval of data, enhancing overall system performance.

Technical Specifications

SRAM CY7C1049G30-10ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.194 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

CY7C1049G30-10ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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