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23LC512-I/ST

Microchip Technology

23LC512-I/ST by Microchip Technology

23LC512-I/ST by Microchip Technology is a small outline, thin profile, shrink pitch SRAM with an organization of 64KX8. It operates synchronously at a max clock frequency of 20 MHz and has a memory density of 524288 bits. This memory IC is commonly used in industrial applications requiring reliable and fast data storage.

Median Price

$1.870

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 594 parts In-Stock

1+ parts

$1.860

100+ parts

$1.730

1k+ parts

$1.560

10k+ parts

$1.470

594

$1.860

$1.730

$1.560

$1.470

Mouser Electronics

USA . 3,583 parts In-Stock

1+ parts

$1.870

100+ parts

$1.770

1k+ parts

$1.760

10k+ parts

-

3,583

$1.870

$1.770

$1.760

-

Microchip Technology

USA . 100 parts In-Stock

1+ parts

$1.870

100+ parts

$1.720

1k+ parts

$1.640

10k+ parts

$1.530

100

$1.870

$1.720

$1.640

$1.530

DigiKey

USA . 23 parts In-Stock

1+ parts

$1.870

100+ parts

$1.820

1k+ parts

-

10k+ parts

-

23

$1.870

$1.820

-

-

Newark

USA . 1,361 parts In-Stock

1+ parts

$1.930

100+ parts

$1.770

1k+ parts

-

10k+ parts

-

1,361

$1.930

$1.770

-

-

Farnell

UK . 1,888 parts In-Stock

1+ parts

$2.075

100+ parts

$1.920

1k+ parts

$1.894

10k+ parts

-

1,888

$2.075

$1.920

$1.894

-

Element14

Singapore . 1,888 parts In-Stock

1+ parts

$2.091

100+ parts

$1.920

1k+ parts

-

10k+ parts

-

1,888

$2.091

$1.920

-

-

Master Electronics

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$1.824

1k+ parts

$1.776

10k+ parts

$1.758

900

-

$1.824

$1.776

$1.758

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$2.141

1k+ parts

$2.106

10k+ parts

-

900

-

$2.141

$2.106

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$1.830

-

-

-

NAC Semi

USA . 200 parts In-Stock

1+ parts

$2.000

100+ parts

$1.810

1k+ parts

$1.630

10k+ parts

-

200

$2.000

$1.810

$1.630

-

Vyrian

USA . 1,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

-

-

-

-

VNN

France . 919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

919

-

-

-

-

IBS Electronics

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$2.558

1k+ parts

$2.491

10k+ parts

$2.466

900

-

$2.558

$2.491

$2.466

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,934 parts In-Stock

1+ parts

$1.350

100+ parts

$1.240

1k+ parts

-

10k+ parts

-

1,934

$1.350

$1.240

-

-

Ampacity Inc.

Singapore . 1,936 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,936

$1.420

-

-

-

Argo Parts USA

USA . 1,242 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1,242

$1.830

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.830

100+ parts

-

1k+ parts

$1.739

10k+ parts

$1.702

1,000

$1.830

-

$1.739

$1.702

Corohmni

South Africa . 939 parts In-Stock

1+ parts

$5.235

100+ parts

-

1k+ parts

-

10k+ parts

-

939

$5.235

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,063

-

-

-

-

Fulton Briggs Corp.

USA . 5,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,442

-

-

-

-

Lixinc

USA . 606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

606

-

-

-

-

Perfect Parts

USA . 428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

428

-

-

-

-

Eastek

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.949

1k+ parts

-

10k+ parts

-

100

-

$2.949

-

-

Overview

Experience the next level of performance and reliability with the 23LC512-I/ST by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology ensures top-quality products that meet the highest standards. This SRAM device is perfect for a wide range of applications, offering seamless operation and advanced features. With its compact design and efficient power supply, it provides excellent value and benefits to our customers. Unlock the full potential of your projects with the 23LC512-I/ST and enjoy unparalleled performance and reliability like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material provides durability and protection, making it suitable for various environments and applications.

Surface Mount: YES

With surface mount capability, this product can be easily mounted on PCBs, offering convenience and space-saving benefits during assembly.

No. of Functions: 1

This product features a single function, simplifying circuit designs and reducing complexities.

Screening Level: TS 16949

Meeting TS 16949 screening level ensures high-quality manufacturing processes, making this product reliable and suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient PCB layout and utilization of space.

Operating Mode: SYNCHRONOUS

The synchronous operating mode of this product ensures synchronized data transfers, enhancing system performance and efficiency.

Input/Output Type: SEPARATE

This product has separate input/output functionality, enabling flexible interfacing with other components and systems.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with commonly used power supply systems.

Power Supplies (V): 3/5

Supporting both 3V and 5V power supplies, this product offers versatility and compatibility with different operating environments.

No. of Terminals: 8

With 8 terminals, this product provides easy connectivity and integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product suitable for space-constrained applications requiring compact and efficient designs.

Maximum Operating Temperature: 85 °C

This product can operate efficiently at temperatures up to 85°C, ensuring reliable performance even in demanding thermal conditions.

Organization: 64KX8

The organization of 64Kx8 enables a large storage capacity of 64K words with each word having 8 bits, making this product suitable for various memory-intensive applications.

Output Characteristics: 3-STATE

With 3-state output characteristics, this product allows for efficient and flexible bus sharing among multiple devices, enhancing system design flexibility.

Minimum Standby Voltage: 2.5 V

The low minimum standby voltage of 2.5V ensures power-saving capabilities when the device is in standby mode, contributing to energy efficiency.

Minimum Operating Temperature: -40 °C

This product can operate reliably at temperatures as low as -40°C, making it suitable for harsh operating environments and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and excellent solderability, ensuring reliable electrical connections during assembly and throughout the product's lifespan.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in terms of PCB layout and alignment, allowing for efficient integration in various designs.

No. of Ports: 1

Featuring a single port, this product simplifies the connection and interface requirements, streamlining system design and implementation.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm ensures compatibility with low-profile applications and provides flexibility in physical design constraints.

Maximum Clock Frequency (fCLK): 20 MHz

This product supports a maximum clock frequency of 20MHz, enabling fast data transfer rates and efficient operation in time-sensitive applications.

Width: 3 mm

With a compact width of 3mm, this product offers space-saving benefits, allowing for efficient utilization of board space in compact electronic devices.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V enables compatibility with low-power and energy-efficient systems, contributing to overall power savings.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, this product ensures proper soldering and reliable connections during assembly processes.

Peak Reflow Temperature °C: 260

This product can withstand peak reflow temperature of 260°C, ensuring reliable soldering and assembly during manufacturing processes.

Length: 4.4 mm

With a length of 4.4mm, this product maintains a compact footprint, suitable for space-constrained applications and compact electronic designs.

Temperature Grade: INDUSTRIAL

The temperature grade of "Industrial" indicates that this product is designed to operate reliably under extended temperature ranges, making it suitable for industrial environments.

Technology: CMOS

Based on complimentary metal-oxide-semiconductor (CMOS) technology, this product offers low power consumption, fast access times, and high noise immunity, enhancing overall performance and efficiency.

Parallel or Serial: SERIAL

This product operates in a serial mode, enabling efficient data transfer and compatible with serial interface protocols commonly used in various applications.

Terminal Form: GULL WING

Featuring a gull wing terminal form, this product provides convenient soldering and robust mechanical connections, ensuring stable and reliable electrical contact.

Maximum Supply Current: 10 mA

The maximum supply current of 10mA indicates low power consumption, making this product suitable for battery-powered and energy-efficient applications.

No. of Words: 65536 words

With a large storage capacity of 65,536 words, this product can store a significant amount of data, making it suitable for memory-intensive applications.

Memory Width: 8

The memory width of 8 bits allows for efficient data storage and retrieval, accommodating various data formats and enhancing system compatibility.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product offers easy integration and compatibility with standard PCB manufacturing processes and designs.

No. of Words Code: 64K

The word code of "64K" indicates a memory capacity of 64K words, providing substantial storage capabilities for data-intensive applications.

Moisture Sensitivity Level (MSL): 1

With an MSL level of 1, this product has excellent moisture resistance and can withstand standard moisture exposure levels, ensuring long-term reliability in various environments.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for compatibility with a wide range of power supply systems, offering flexibility in different operating conditions.

Memory Density: 524288 bit

With a memory density of 524,288 bits, this product provides ample storage capacity, accommodating extensive data requirements in memory-centric applications.

Memory IC Type: STANDARD SRAM

This product belongs to the standard SRAM memory IC type, offering reliable and high-speed data storage capabilities, suitable for a wide range of applications.

Maximum Standby Current: 0.00001 Amp

The ultra-low maximum standby current of 0.00001 Amp ensures minimal power consumption during idle periods, contributing to energy efficiency and prolonged battery life.

Technical Specifications

SRAM 23LC512-I/ST attributes and parameters. Explore more SRAM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Input/Output Type:

SEPARATE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

2.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

23LC512-I/ST Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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