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CY62157EV30LL-45ZXI

Infineon Technologies

CY62157EV30LL-45ZXI by Infineon Technologies

Infineon's CY62157EV30LL-45ZXI is a 512Kx16 SRAM with 3.3V supply, 45ns access time, and operates in industrial temperature range. Ideal for applications requiring fast and reliable data storage in compact systems. Features include asynchronous operation, common I/O type, and 3-state output characteristics.

Median Price

$5.808

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 715 parts In-Stock

1+ parts

$4.469

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$4.242

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715

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Chip1Stop

Japan . 319 parts In-Stock

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$8.150

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Mouser Electronics

USA . 631 parts In-Stock

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$10.820

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$9.280

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$8.230

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Farnell

UK . 38 parts In-Stock

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$12.870

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$7.720

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Flip Electronics (Authorized)

USA . 16,296 parts In-Stock

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Rochester

USA . 9,257 parts In-Stock

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$4.730

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DigiKey

USA . 8,533 parts In-Stock

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$5.200

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Verical

USA . 4,800 parts In-Stock

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Future Electronics

Canada . 134 parts In-Stock

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$5.150

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 2 parts In-Stock

1+ parts

$7.690

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$5.770

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$5.000

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2

$7.690

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Digiode

USA . 243 parts In-Stock

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$8.797

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Nova Conductors

Japan . 450 parts In-Stock

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$10.696

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Flip Electronics

USA . 8,533 parts In-Stock

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DigiKey Marketplace

USA . 8,126 parts In-Stock

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$8.883

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Chip Stock

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Vyrian

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MRC Electronics

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Bristol Electronics

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IBS Electronics

USA . 134 parts In-Stock

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$7.279

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$5.736

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$5.736

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ComSIT Distribution GmbH

Germany . 98 parts In-Stock

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R&J Components

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ACDS - Activité Composants Distribution Service

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Goldney Electronics S.L.

Spain . 11 parts In-Stock

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Semi Source

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Microfarads

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Atlantic Semiconductor

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Prism Electronics

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Sunrise Surplus Inc.

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 49 parts In-Stock

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$3.355

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$3.355

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Ampacity Inc.

Singapore . 4,651 parts In-Stock

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$3.840

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$3.840

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Semicontronic

India . 4,627 parts In-Stock

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$3.840

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$3.744

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$3.725

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$3.840

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Aztec Data Supply Inc.

USA . 39 parts In-Stock

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$3.966

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Modulus Dynamics

Lithuania . 1,343 parts In-Stock

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$4.558

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$4.376

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$4.193

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Corphita

USA . 525 parts In-Stock

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$8.334

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525

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Component Stockers USA

USA . 10,757 parts In-Stock

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$9.440

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$6.270

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$6.270

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10,757

$9.440

$6.270

$6.270

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Netroflash

USA . 1,000 parts In-Stock

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$10.696

100+ parts

$10.482

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$10.696

$10.482

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Continental Prestige Electronics

USA . 781 parts In-Stock

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$10.696

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$10.482

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$10.482

QUARKTWIN TECHNOLOGY LTD

USA . 14,261 parts In-Stock

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Lixinc

USA . 13,729 parts In-Stock

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Perfect Parts

USA . 11,693 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,519 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,346 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 1,489 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 960 parts In-Stock

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GreenTree Electronics

Israel . 768 parts In-Stock

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Metaverse IC Inc.

Canada . 501 parts In-Stock

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ChipstoGo Electronic ltd

UK . 311 parts In-Stock

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Emar International I/E

Canada . 200 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 18 parts In-Stock

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Overview

Experience seamless and reliable performance with the CY62157EV30LL-45ZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-quality products that meet the highest standards. This SRAM device offers unparalleled speed and efficiency for a wide range of applications, ensuring optimal performance in any setting. Trust in the value and benefits that this product provides, delivering exceptional results and reliability to customers seeking the best in memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Operating Mode: ASYNCHRONOUS

Provides flexibility and efficient operation in asynchronous mode.

Nominal Supply Voltage / Vsup (V): 3

Compatible with standard voltage requirements for easy integration.

No. of Terminals: 48

Sufficient terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Organization: 512KX16

Optimal organization for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Operational in low-temperature environments for versatile use.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Maximum Access Time: 45 ns

Fast access time for quick data processing.

Technical Specifications

SRAM CY62157EV30LL-45ZXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000008 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62157EV30LL-45ZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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