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CY14B256LA-SP25XI

Infineon Technologies

CY14B256LA-SP25XI by Infineon Technologies

Infineon's CY14B256LA-SP25XI is a 32Kx8 SRAM with 3V nominal voltage, operating in industrial temperature range. It features parallel interface, 25ns access time, and non-volatile memory type. Widely used in applications requiring fast and reliable data storage with low standby current consumption.

Median Price

$18.732

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 180 parts In-Stock

1+ parts

$14.513

100+ parts

$13.269

1k+ parts

$12.992

10k+ parts

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180

$14.513

$13.269

$12.992

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Chip1Stop

Japan . 275 parts In-Stock

1+ parts

$20.700

100+ parts

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275

$20.700

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Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$22.680

100+ parts

$19.360

1k+ parts

$18.710

10k+ parts

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27

$22.680

$19.360

$18.710

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DigiKey

USA . 157 parts In-Stock

1+ parts

$22.760

100+ parts

$19.801

1k+ parts

$18.303

10k+ parts

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157

$22.760

$19.801

$18.303

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Verical

USA . 6,000 parts In-Stock

1+ parts

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$16.763

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6,000

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$16.763

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Flip Electronics (Authorized)

USA . 4,504 parts In-Stock

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4,504

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Rochester

USA . 120 parts In-Stock

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-

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$12.640

1k+ parts

$11.310

10k+ parts

$10.650

120

-

$12.640

$11.310

$10.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 237 parts In-Stock

1+ parts

$11.115

100+ parts

-

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237

$11.115

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Vyrian

USA . 315 parts In-Stock

1+ parts

$11.700

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315

$11.700

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Bristol Electronics

USA . 114 parts In-Stock

1+ parts

$12.317

100+ parts

$11.368

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114

$12.317

$11.368

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Flip Electronics

USA . 8,704 parts In-Stock

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Chip Stock

USA . 8,100 parts In-Stock

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Prism Electronics

USA . 158 parts In-Stock

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158

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Dan-Mar Components

USA . 114 parts In-Stock

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114

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ACDS - Activité Composants Distribution Service

France . 54 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Sensible Micro Corp

USA . 6 parts In-Stock

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6

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LWI Electronics Inc

India . 4 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,672 parts In-Stock

1+ parts

$4.140

100+ parts

$3.974

1k+ parts

$3.809

10k+ parts

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4,672

$4.140

$3.974

$3.809

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Ampacity Inc.

Singapore . 622 parts In-Stock

1+ parts

$10.330

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622

$10.330

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Corphita

USA . 194 parts In-Stock

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$10.530

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194

$10.530

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Continental Prestige Electronics

USA . 4,554 parts In-Stock

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4,554

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Argo Parts USA

USA . 4,037 parts In-Stock

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4,037

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Aranea Global

USA . 100 parts In-Stock

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Perfect Parts

USA . 97 parts In-Stock

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Overview

Unlock the power of reliable and high-performance memory solutions with Infineon Technologies' CY14B256LA-SP25XI SRAM. Designed for industrial applications, this non-volatile SRAM offers exceptional durability and efficiency with a maximum operating temperature of 85°C and a minimum supply voltage of 2.7V. With a memory density of 262144 bit and a fast access time of 25 ns, this memory IC is perfect for demanding environments where speed and reliability are essential. Trust in Infineon's expertise and innovation to elevate your projects to new heights with the CY14B256LA-SP25XI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the SRAM chip, making it suitable for various environments.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexibility in timing and communication, making it easier to integrate into different systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options and allows for versatile usage in different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this SRAM chip can withstand harsh conditions and maintain optimal performance.

Memory IC Type: NON-VOLATILE SRAM

Being non-volatile ensures that data is retained even when power is removed, making it ideal for applications where data persistence is crucial.

Technical Specifications

SRAM CY14B256LA-SP25XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.794 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5057 mm

Trade Compliance

CY14B256LA-SP25XI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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