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N01S818HAT22I

Onsemi

N01S818HAT22I by Onsemi

N01S818HAT22I by Onsemi is a 128KX8 SRAM with synchronous operation. It features a small outline, thin profile package and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed memory access in compact electronic devices.

Median Price

$3.842

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 177 parts In-Stock

1+ parts

$3.037

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$3.037

-

-

-

Chip1Stop

Japan . 177 parts In-Stock

1+ parts

$3.710

100+ parts

$3.280

1k+ parts

-

10k+ parts

-

177

$3.710

$3.280

-

-

DigiKey

USA . 604 parts In-Stock

1+ parts

$4.810

100+ parts

$4.147

1k+ parts

$3.816

10k+ parts

-

604

$4.810

$4.147

$3.816

-

Mouser Electronics

USA . 189 parts In-Stock

1+ parts

$4.810

100+ parts

$4.140

1k+ parts

$3.800

10k+ parts

$3.750

189

$4.810

$4.140

$3.800

$3.750

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$3.975

1k+ parts

$3.563

10k+ parts

$3.350

3,000

-

$3.975

$3.563

$3.350

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

$2.850

10k+ parts

$2.680

3,000

-

$3.180

$2.850

$2.680

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,367 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

1,367

$3.080

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.069

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.069

-

-

-

Bristol Electronics

USA . 200 parts In-Stock

1+ parts

$5.394

100+ parts

$2.517

1k+ parts

$2.337

10k+ parts

-

200

$5.394

$2.517

$2.337

-

Vyrian

USA . 3,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,637

-

-

-

-

Dan-Mar Components

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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200

-

-

-

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Cogito LLC

Ukraine . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 418 parts In-Stock

1+ parts

$2.600

100+ parts

-

1k+ parts

-

10k+ parts

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418

$2.600

-

-

-

Corphita

USA . 1,926 parts In-Stock

1+ parts

$2.918

100+ parts

-

1k+ parts

-

10k+ parts

-

1,926

$2.918

-

-

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$3.055

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$3.055

-

-

-

Continental Prestige Electronics

USA . 6,579 parts In-Stock

1+ parts

$4.069

100+ parts

-

1k+ parts

-

10k+ parts

$3.988

6,579

$4.069

-

-

$3.988

Argo Parts USA

USA . 3,408 parts In-Stock

1+ parts

$4.069

100+ parts

-

1k+ parts

-

10k+ parts

-

3,408

$4.069

-

-

-

SupplyDigital Components

Austria . 7,986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,986

-

-

-

-

TANS Electronics

Latvia . 5,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,693

-

-

-

-

Problanco Electronics

Mexico . 1,794 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,794

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.988

1k+ parts

$3.865

10k+ parts

$3.784

1,000

-

$3.988

$3.865

$3.784

Kulean Microsystems

USA . 844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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844

-

-

-

-

UHIMA Technologies

Türkiye . 333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

333

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Onsemi with the N01S818HAT22I, a top-of-the-line SRAM memory chip designed for industrial applications. With its small outline, thin profile, and synchronous operation, this memory chip offers exceptional performance in a compact package. Whether you're looking to enhance the efficiency of your industrial equipment or improve the processing speed of your devices, the N01S818HAT22I delivers the value and benefits you need. Trust Onsemi to provide cutting-edge technology that meets your demands for speed, reliability, and durability. Elevate your products with the N01S818HAT22I from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the product.

Surface Mount: YES

Allows for easy installation and saves space on the PCB.

Operating Mode: SYNCHRONOUS

Ensures precise communication and data transfer within the device.

Memory Density: 1048576 bit

Offers ample storage capacity for data and information.

Technology: CMOS

Utilizes low power consumption and provides high speed performance.

Operating Temperature Range: -40°C to 85°C

Suitable for industrial environments with varying temperature conditions.

Terminal Pitch: 0.65 mm

Enables precise connections and improves signal integrity.

Technical Specifications

SRAM N01S818HAT22I attributes and parameters. Explore more SRAM devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

2.2 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

N01S818HAT22I Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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