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N01S830BAT22IT

Onsemi

N01S830BAT22IT by Onsemi

N01S830BAT22IT by Onsemi is a small outline, thin profile SRAM with 128Kx8 organization. Operating in synchronous mode, it has a memory density of 1048576 bits and operates b/w -40 to 85°C. Ideal for industrial applications requiring reliable serial memory with a supply voltage range of 2.5V to 5.5V.

Median Price

$4.672

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$5.470

100+ parts

$4.700

1k+ parts

$4.340

10k+ parts

$3.220

40

$5.470

$4.700

$4.340

$3.220

DigiKey

USA . 18 parts In-Stock

1+ parts

$5.580

100+ parts

$4.809

1k+ parts

$4.426

10k+ parts

$3.399

18

$5.580

$4.809

$4.426

$3.399

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

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Rochester

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.480

5,000

-

$2.950

$2.640

$2.480

Verical

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

$3.875

1k+ parts

$3.300

10k+ parts

$3.100

5,000

-

$3.875

$3.300

$3.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,180 parts In-Stock

1+ parts

$3.116

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$3.116

-

-

-

Vyrian

USA . 304 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$3.280

-

-

-

Chip Stock

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Flip Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,390 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

$2.952

-

-

-

Corohmni

South Africa . 223 parts In-Stock

1+ parts

$3.280

100+ parts

-

1k+ parts

-

10k+ parts

-

223

$3.280

-

-

-

Microchip USA

USA . 4,266 parts In-Stock

1+ parts

$23.245

100+ parts

-

1k+ parts

-

10k+ parts

-

4,266

$23.245

-

-

-

Problanco Electronics

Mexico . 7,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,166

-

-

-

-

Perfect Parts

USA . 6,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,707

-

-

-

-

Kulean Microsystems

USA . 6,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,602

-

-

-

-

TANS Electronics

Latvia . 3,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,550

-

-

-

-

SupplyDigital Components

Austria . 3,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,327

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UHIMA Technologies

Türkiye . 368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

368

-

-

-

-

Overview

Experience unparalleled quality and reliability with the N01S830BAT22IT by Onsemi, a leading manufacturer in the industry. This SRAM memory device offers exceptional performance in a compact package, making it ideal for a wide range of applications. Whether you're in need of fast, synchronous memory for industrial-grade systems or high-density storage solutions, this product delivers on all fronts. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the N01S830BAT22IT and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the SRAM, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, improving efficiency and performance of the SRAM.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments, making it suitable for industrial applications.

Memory Width: 8

Provides a wide memory width, allowing for the storage and retrieval of large amounts of data efficiently.

Technical Specifications

SRAM N01S830BAT22IT attributes and parameters. Explore more SRAM devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

N01S830BAT22IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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