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CY7C1061G30-10ZSXI

Infineon Technologies

CY7C1061G30-10ZSXI by Infineon Technologies

CY7C1061G30-10ZSXI by Infineon is a 1MX16 SRAM with 10ns access time, operating at 3V. It features asynchronous mode, industrial temperature grade, and parallel interface. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$50.170

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 632 parts In-Stock

1+ parts

$39.900

100+ parts

$33.770

1k+ parts

-

10k+ parts

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632

$39.900

$33.770

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-

Future Electronics

Canada . 1,397 parts In-Stock

1+ parts

$40.040

100+ parts

$38.140

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-

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1,397

$40.040

$38.140

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Newark

USA . 511 parts In-Stock

1+ parts

$50.170

100+ parts

$42.550

1k+ parts

-

10k+ parts

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511

$50.170

$42.550

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-

Element14

Singapore . 560 parts In-Stock

1+ parts

$58.520

100+ parts

$57.430

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-

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560

$58.520

$57.430

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Mouser Electronics

USA . 1,531 parts In-Stock

1+ parts

$60.230

100+ parts

$51.460

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-

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1,531

$60.230

$51.460

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Chip1Stop

Japan . 594 parts In-Stock

1+ parts

$60.800

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594

$60.800

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DigiKey

USA . 688 parts In-Stock

1+ parts

$61.910

100+ parts

$53.951

1k+ parts

$52.437

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688

$61.910

$53.951

$52.437

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Rochester

USA . 17,276 parts In-Stock

1+ parts

-

100+ parts

$35.760

1k+ parts

$31.990

10k+ parts

$30.110

17,276

-

$35.760

$31.990

$30.110

Verical

USA . 11,716 parts In-Stock

1+ parts

-

100+ parts

$44.700

1k+ parts

$39.987

10k+ parts

$37.638

11,716

-

$44.700

$39.987

$37.638

Flip Electronics (Authorized)

USA . 3,372 parts In-Stock

1+ parts

-

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3,372

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 429 parts In-Stock

1+ parts

$34.865

100+ parts

-

1k+ parts

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429

$34.865

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$39.417

100+ parts

-

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100

$39.417

-

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IBS Electronics

USA . 1,709 parts In-Stock

1+ parts

$60.055

100+ parts

-

1k+ parts

$46.114

10k+ parts

$57.194

1,709

$60.055

-

$46.114

$57.194

Chip Stock

USA . 14,191 parts In-Stock

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14,191

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Flip Electronics

USA . 4,020 parts In-Stock

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Vyrian

USA . 1,736 parts In-Stock

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1,736

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Rutronik

Germany . 1,080 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$53.120

10k+ parts

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1,080

-

-

$53.120

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Velocity Electronics

USA . 80 parts In-Stock

1+ parts

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 930 parts In-Stock

1+ parts

$4.467

100+ parts

-

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10k+ parts

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930

$4.467

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Aztec Data Supply Inc.

USA . 225 parts In-Stock

1+ parts

$5.320

100+ parts

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225

$5.320

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Modulus Dynamics

Lithuania . 4,415 parts In-Stock

1+ parts

$5.656

100+ parts

$5.430

1k+ parts

$5.204

10k+ parts

-

4,415

$5.656

$5.430

$5.204

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Continental Prestige Electronics

USA . 950 parts In-Stock

1+ parts

$28.150

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950

$28.150

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Ampacity Inc.

Singapore . 1,820 parts In-Stock

1+ parts

$31.200

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1,820

$31.200

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Semicontronic

India . 1,716 parts In-Stock

1+ parts

$31.200

100+ parts

$30.420

1k+ parts

$30.264

10k+ parts

-

1,716

$31.200

$30.420

$30.264

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Corphita

USA . 416 parts In-Stock

1+ parts

$33.030

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416

$33.030

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Netroflash

USA . 100 parts In-Stock

1+ parts

$39.417

100+ parts

$38.629

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100

$39.417

$38.629

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Lixinc

USA . 14,134 parts In-Stock

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14,134

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A-Z Elektronik GmbH

Germany . 6,434 parts In-Stock

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6,434

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Alle Elektronik GmbH

Germany . 4,289 parts In-Stock

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4,289

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GreenTree Electronics

Israel . 3,500 parts In-Stock

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Perfect Parts

USA . 2,298 parts In-Stock

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2,298

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Argo Parts USA

USA . 1,249 parts In-Stock

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1,249

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Futuretech Components

Singapore . 1,080 parts In-Stock

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1,080

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RC Electronics

USA . 344 parts In-Stock

1+ parts

-

100+ parts

$47.400

1k+ parts

$43.260

10k+ parts

$41.970

344

-

$47.400

$43.260

$41.970

Formix International (Excess)

India . 4 parts In-Stock

1+ parts

-

100+ parts

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4

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Overview

Discover the cutting-edge CY7C1061G30-10ZSXI by Infineon Technologies, a top-quality SRAM memory IC that offers unparalleled performance and reliability. With a wide range of applications in industrial settings, this memory chip is the perfect solution for demanding environments. Infineon Technologies, known for their superior manufacturing standards, delivers a product that exceeds expectations. Experience lightning-fast access times and seamless operation with this high-density memory IC. Upgrade your systems today with Infineon's CY7C1061G30-10ZSXI and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring long-term performance of the product.

Surface Mount: YES

Allows for easy and efficient installation onto PCBs, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Enables fast and independent read and write operations, increasing efficiency in data processing.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for stable and consistent performance of the SRAM.

No. of Terminals: 54

Sufficient number of terminals for connecting the SRAM to other components in the circuit.

Maximum Operating Temperature: 85 °C

Wide temperature range allows for reliable operation in various environmental conditions.

Memory IC Type: STANDARD SRAM

Reliable and proven memory IC type for high-speed data storage and retrieval.

Technical Specifications

SRAM CY7C1061G30-10ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PDSO-G54

Length:

22.415 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

54

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY7C1061G30-10ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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