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MT58L64L18FT-8.5

Micron Technology

MT58L64L18FT-8.5 by Micron Technology

CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Organization: 64KX18;

Median Price

$5.930

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,087 parts In-Stock

1+ parts

-

100+ parts

$5.120

1k+ parts

$4.580

10k+ parts

$4.310

12,087

-

$5.120

$4.580

$4.310

DigiKey

USA . 12,087 parts In-Stock

1+ parts

-

100+ parts

$6.740

1k+ parts

-

10k+ parts

-

12,087

-

$6.740

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$5.153

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$5.153

-

-

-

Digiode

USA . 1,564 parts In-Stock

1+ parts

$5.406

100+ parts

-

1k+ parts

-

10k+ parts

-

1,564

$5.406

-

-

-

Chip Stock

USA . 23,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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23,000

-

-

-

-

DigiKey Marketplace

USA . 12,087 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,087

-

-

-

-

Vyrian

USA . 11,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,666

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,410

-

-

-

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Connector Distribution Corp

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

-

-

-

-

Right Parts Inc.

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

-

-

-

-

Semtec, LLC

USA . 132 parts In-Stock

1+ parts

-

100+ parts

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132

-

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North Shore Components

USA . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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107

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 11,963 parts In-Stock

1+ parts

$4.840

100+ parts

$4.719

1k+ parts

$4.695

10k+ parts

-

11,963

$4.840

$4.719

$4.695

-

Ampacity Inc.

Singapore . 11,877 parts In-Stock

1+ parts

$4.840

100+ parts

-

1k+ parts

-

10k+ parts

-

11,877

$4.840

-

-

-

Corphita

USA . 2,098 parts In-Stock

1+ parts

$5.121

100+ parts

-

1k+ parts

-

10k+ parts

-

2,098

$5.121

-

-

-

Continental Prestige Electronics

USA . 521 parts In-Stock

1+ parts

$5.153

100+ parts

-

1k+ parts

-

10k+ parts

$5.050

521

$5.153

-

-

$5.050

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.153

100+ parts

$5.050

1k+ parts

-

10k+ parts

-

100

$5.153

$5.050

-

-

Andel Nordic

Denmark . 3,344 parts In-Stock

1+ parts

$10.201

100+ parts

-

1k+ parts

$9.793

10k+ parts

$9.793

3,344

$10.201

-

$9.793

$9.793

Argo Parts USA

USA . 4,185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,185

-

-

-

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Kepictronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Technical Specifications

SRAM MT58L64L18FT-8.5 attributes and parameters. Explore more SRAM devices from Micron Technology

Specs

Maximum Access Time:

8.5 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e0

Length:

20 mm

Memory Density:

1179648 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

100

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX18

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63X.87

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.01 Amp

Minimum Standby Voltage:

3.14 V

Sub-Category:

SRAMs

Maximum Supply Current:

225 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

MT58L64L18FT-8.5 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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