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CY62167EV18LL-55BVXIT

Infineon Technologies

CY62167EV18LL-55BVXIT by Infineon Technologies

CY62167EV18LL-55BVXIT by Infineon Technologies is a 1MX16 SRAM with 55ns access time and operates at 1.8V. It features a very thin profile, fine pitch grid array package style suitable for industrial applications. This CMOS memory IC offers common I/O type and 3-state output characteristics in a compact form factor ideal for high-speed parallel data processing.

Median Price

$10.519

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,818 parts In-Stock

1+ parts

-

100+ parts

$9.350

1k+ parts

$8.360

10k+ parts

$7.870

2,818

-

$9.350

$8.360

$7.870

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$11.688

1k+ parts

$10.450

10k+ parts

$9.838

2,000

-

$11.688

$10.450

$9.838

Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

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2,000

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Distributors (In-Stock)

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Digiode

USA . 765 parts In-Stock

1+ parts

$10.478

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765

$10.478

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Chip Stock

USA . 3,955 parts In-Stock

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3,955

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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Vyrian

USA . 1,979 parts In-Stock

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1,979

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ACDS - Activité Composants Distribution Service

France . 133 parts In-Stock

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133

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

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Corohmni

South Africa . 540 parts In-Stock

1+ parts

$3.540

100+ parts

-

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540

$3.540

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Aztec Data Supply Inc.

USA . 4,424 parts In-Stock

1+ parts

$4.506

100+ parts

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4,424

$4.506

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Modulus Dynamics

Lithuania . 6,356 parts In-Stock

1+ parts

$5.491

100+ parts

$5.271

1k+ parts

$5.052

10k+ parts

-

6,356

$5.491

$5.271

$5.052

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Ampacity Inc.

Singapore . 1,921 parts In-Stock

1+ parts

$9.380

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1,921

$9.380

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Semicontronic

India . 1,536 parts In-Stock

1+ parts

$9.380

100+ parts

$9.146

1k+ parts

$9.099

10k+ parts

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1,536

$9.380

$9.146

$9.099

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Corphita

USA . 497 parts In-Stock

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$9.927

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497

$9.927

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Component Stockers USA

USA . 1,338 parts In-Stock

1+ parts

$11.370

100+ parts

$10.690

1k+ parts

$9.660

10k+ parts

-

1,338

$11.370

$10.690

$9.660

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Lixinc

USA . 8,442 parts In-Stock

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8,442

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Continental Prestige Electronics

USA . 4,529 parts In-Stock

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4,529

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Argo Parts USA

USA . 2,454 parts In-Stock

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2,454

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Authorized Procurement Solutions

USA . 1,375 parts In-Stock

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1,375

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the cutting-edge CY62167EV18LL-55BVXIT by Infineon Technologies, a top-tier manufacturer in the SRAM category. This innovative product offers unparalleled quality and reliability for a wide range of applications. With a nominal supply voltage of 1.8V and maximum operating temperature of 85°C, this memory IC boasts a memory density of 16777216 bits. Experience lightning-fast access times of just 55 ns and low standby current of 0.00001 Amp. Elevate your projects with the value and performance that only Infineon Technologies can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the SRAM, making it suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal supply voltage for efficient operation and performance of the SRAM.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent read/write operations, enhancing the versatility of the SRAM.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures, ensuring reliable performance in demanding environments.

Organization: 1MX16

Offers a high memory organization of 1 megabit by 16 bits, providing ample storage capacity for data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the SRAM energy-efficient and fast.

Maximum Access Time: 55 ns

Fast access time ensures quick data retrieval and processing, enhancing the overall performance of the SRAM.

Technical Specifications

SRAM CY62167EV18LL-55BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

2.25 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62167EV18LL-55BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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