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CY14B101Q2-LHXIT

Infineon Technologies

CY14B101Q2-LHXIT by Infineon Technologies

Infineon's CY14B101Q2-LHXIT is a 128Kx8 non-volatile SRAM with synchronous operation and 3-state output. Operating at 3V, it offers a clock frequency of up to 40MHz for industrial applications. With a compact package style and low standby current, it suits various devices requiring reliable memory storage.

Median Price

$17.920

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,120 parts In-Stock

1+ parts

$17.920

100+ parts

$15.330

1k+ parts

$14.020

10k+ parts

$13.710

3,120

$17.920

$15.330

$14.020

$13.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$11.710

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$11.710

-

-

-

Digiode

USA . 352 parts In-Stock

1+ parts

$12.588

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$12.588

-

-

-

Chip Stock

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

-

-

-

-

Vyrian

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 5,516 parts In-Stock

1+ parts

$3.605

100+ parts

$3.461

1k+ parts

$3.317

10k+ parts

-

5,516

$3.605

$3.461

$3.317

-

Aztec Data Supply Inc.

USA . 3,959 parts In-Stock

1+ parts

$4.462

100+ parts

-

1k+ parts

-

10k+ parts

-

3,959

$4.462

-

-

-

Corohmni

South Africa . 1,216 parts In-Stock

1+ parts

$5.967

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

$5.967

-

-

-

Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$11.260

100+ parts

-

1k+ parts

-

10k+ parts

-

14

$11.260

-

-

-

Semicontronic

India . 14 parts In-Stock

1+ parts

$11.260

100+ parts

$10.978

1k+ parts

$10.922

10k+ parts

-

14

$11.260

$10.978

$10.922

-

Corphita

USA . 34 parts In-Stock

1+ parts

$11.925

100+ parts

-

1k+ parts

-

10k+ parts

-

34

$11.925

-

-

-

Lixinc

USA . 19,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,468

-

-

-

-

Argo Parts USA

USA . 3,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,766

-

-

-

-

Continental Prestige Electronics

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,119

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$11.476

1k+ parts

$11.125

10k+ parts

$10.890

1,000

-

$11.476

$11.125

$10.890

Authorized Procurement Solutions

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

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-

Overview

Unlock the power of reliable and high-quality memory solutions with the CY14B101Q2-LHXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies has crafted this Serial SRAM with precision and expertise, ensuring top-notch performance in various industrial applications. Experience seamless operation and fast data access with this innovative product, offering customers unmatched value, benefits, and advantages. Trust in Infineon Technologies to deliver cutting-edge technology that meets your memory needs with excellence and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this SRAM lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the SRAM onto circuit boards, saving time and effort in production.

Package Shape: RECTANGULAR

The rectangular package shape makes this SRAM easy to integrate into a variety of electronic designs, providing flexibility in layout.

Operating Mode: SYNCHRONOUS

The synchronous operation of this SRAM ensures precise and synchronized data transfer, improving overall system performance.

Input/Output Type: COMMON

The common input/output type simplifies the connection and communication with other components, making integration seamless and straightforward.

Nominal Supply Voltage / Vsup (V): 3

The 3V nominal supply voltage makes this SRAM energy efficient and suitable for low-power applications, helping to extend battery life.

Power Supplies (V): 3/3.3

The availability of multiple power supply voltages provides flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 8

With 8 terminals, this SRAM offers a sufficient number of connections for data transfer, ensuring smooth operation in complex electronic systems.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style makes this SRAM compact and space-saving, ideal for designs with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliability and stability in environments with elevated temperatures.

Technical Specifications

SRAM CY14B101Q2-LHXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

40 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

6 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Standby Current:

.005 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

10 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

CY14B101Q2-LHXIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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