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M68AF031AL55MS1

STMicroelectronics

M68AF031AL55MS1 by STMicroelectronics

M68AF031AL55MS1 from STMicroelectronics is a 32Kx8 CMOS SRAM with asynchronous operation and a max access time of 55 ns. It operates at a nominal voltage of 5V, suitable for commercial applications. Its compact SO package ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,444 parts In-Stock

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4,444

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Anansix

USA . 1,380 parts In-Stock

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1,380

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Digiode

USA . 1,233 parts In-Stock

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1,233

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$5.466

100+ parts

-

1k+ parts

$4.919

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407

$5.466

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$4.919

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MKK Technologies

India . 622 parts In-Stock

1+ parts

$10.278

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622

$10.278

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DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

$10.278

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622

$10.278

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Corphita

USA . 4,637 parts In-Stock

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4,637

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Parana Technologies

USA . 465 parts In-Stock

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$6.535

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465

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$6.535

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Overview

Unlock unparalleled performance with the M68AF031AL55MS1 SRAM from STMicroelectronics—a name synonymous with innovation and reliability. This compact and efficient asynchronous memory solution is perfect for a range of applications, from consumer electronics to industrial systems. Enjoy faster data access and lower power consumption, ensuring your designs thrive in any environment. Choose quality and expertise with STMicroelectronics for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable packaging material enhances reliability and ensures protection against environmental factors.

Surface Mount: YES

Allows for efficient PCB space utilization and simplifies the assembly process.

Package Shape: RECTANGULAR

Standard shape that facilitates easy integration into various designs.

Operating Mode: ASYNCHRONOUS

Enables quick and direct access to data, enhancing performance in applications requiring instant data retrieval.

Input/Output Type: COMMON

Flexibility in connecting to various systems, making it versatile for multiple applications.

Nominal Supply Voltage / Vsup (V): 5

Standard operating voltage, ensuring compatibility with common electronic designs.

Power Supplies (V): 5

Single voltage power supply simplifies design and reduces components needed.

No. of Terminals: 28

Adequate number of connections for robust interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Compact design provides space-saving benefits on the PCB.

Maximum Operating Temperature: 70 °C

Suitable for commercial environments, ensuring long-lasting operation under typical conditions.

Organization: 32KX8

Offers a structured memory organization allowing efficient data access and management.

Output Characteristics: 3-STATE

Supports multiple devices sharing the same bus, which enhances system flexibility.

Minimum Standby Voltage: 2 V

Allows for operation in low-power modes, saving energy when the device is not in use.

Minimum Operating Temperature: 0 °C

Operates effectively in varied thermal conditions, making it suitable for a wide range of environments.

Terminal Finish: MATTE TIN

Enhances solderability, ensuring reliable connections during assembly.

Terminal Position: DUAL

Facilitates symmetrical mounting, which can simplify PCB layout considerations.

Maximum Seated Height: 2.79 mm

Low-profile design helps in space-constrained applications, maintaining a sleek profile.

Width: 7.505 mm

Compact width suitable for various board layouts and designs.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation with a slightly lower voltage, giving flexibility in powering the device.

Length: 18.22 mm

Standard length that is compatible with a wide range of PCB sizes.

Temperature Grade: COMMERCIAL

Designed for typical conditions, ensuring reliability and performance in various applications.

Technology: CMOS

Low power consumption while providing high-speed operation, making it efficient for modern devices.

Parallel or Serial: PARALLEL

Facilitates simultaneous data access, improving speed and efficiency in data-intensive applications.

Terminal Form: GULL WING

Optimal design for surface mount technology, aiding in easier soldering and assembly.

Maximum Supply Current: 50 mA

Sufficient current capacity for substantial data processing without performance degradation.

No. of Words: 32768 words

Generous memory size suitable for a diverse range of applications requiring moderate data storage.

Memory Width: 8

Offers good data bus width, enhancing data throughput and performance.

Terminal Pitch: 1.27 mm

Standard pitch size allows for easy PCB layout and design.

No. of Words Code: 32K

Denotes a substantial memory capacity for various applications, from memory caching to data storage.

Maximum Supply Voltage (Vsup): 5.5 V

Provides flexibility in power requirements and compatibility with various systems.

Memory Density: 262144 bit

High density meets the demands for memory in compact and powerful devices.

Memory IC Type: STANDARD SRAM

Ideal for general-purpose applications, offering reliability and ease of use.

Maximum Standby Current: 0.000006 Amp

Very low standby current minimizes power consumption significantly in idle states.

Maximum Access Time: 55 ns

Fast access time suitable for high-speed operations, improving system performance.

Technical Specifications

SRAM M68AF031AL55MS1 attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

18.22 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.505 mm

Trade Compliance

M68AF031AL55MS1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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