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M68AF031AL55MS6T

STMicroelectronics

M68AF031AL55MS6T by STMicroelectronics

M68AF031AL55MS6T from STMicroelectronics is a 32Kx8 CMOS SRAM with asynchronous operation and a max access time of 55 ns. It operates at a nominal voltage of 5V, suitable for industrial applications. Its compact SO package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,712 parts In-Stock

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4,712

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Digiode

USA . 3,560 parts In-Stock

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3,560

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Anansix

USA . 1,181 parts In-Stock

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1,181

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$3.014

100+ parts

-

1k+ parts

$2.713

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1,040

$3.014

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$2.713

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MKK Technologies

India . 568 parts In-Stock

1+ parts

$5.667

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568

$5.667

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DigiPath Technology Company

USA . 568 parts In-Stock

1+ parts

$5.667

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568

$5.667

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Corphita

USA . 4,444 parts In-Stock

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4,444

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Parana Technologies

USA . 1,543 parts In-Stock

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$3.604

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1,543

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$3.604

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Overview

Unlock unparalleled performance with the M68AF031AL55MS6T SRAM from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics ensures that this industrial-grade memory solution meets your most demanding applications, from automotive systems to telecommunications. With its efficient power consumption and robust design, this SRAM not only enhances system responsiveness but also provides long-lasting durability—making it an invaluable asset for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures excellent protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for higher density mounting on PCBs, saving space and improving efficiency in design.

Package Shape: RECTANGULAR

The rectangular shape provides a compact footprint, facilitating easier PCB layout.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler control logic, enhancing design flexibility in applications.

Input/Output Type: COMMON

Common I/O type offers flexibility in interfacing with various circuits and makes integration easier.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage of 5V ensures compatibility with many existing systems, simplifying integration.

Power Supplies (V): 5

The use of a single 5V power supply streamlines system design and reduces complexity in power management.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on PCB, allowing more components within a limited area.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this SRAM is suitable for industrial applications with high thermal demands.

Organization: 32KX8

The 32K x 8 organization allows efficient data storage and retrieval, making it ideal for a range of high-speed applications.

Output Characteristics: 3-STATE

3-state output enables high flexibility in bus systems, allowing multiple devices to share the same data lines.

Minimum Standby Voltage: 2 V

A low minimum standby voltage helps in energy conservation during inactive periods, benefiting power-sensitive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range supports cold environments, making it suitable for outdoor or harsh settings.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and reduces the risk of oxidation over time.

Terminal Position: DUAL

Dual terminal positioning enhances stability and makes the component easier to mount on PCBs.

Maximum Seated Height: 2.79 mm

A low seated height allows for space-saving designs and better integration in compact systems.

Width: 7.505 mm

A narrow width allows for tighter layouts in PCB design, contributing to more compact electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows operation in various power conditions, adding to design flexibility.

Length: 18.22 mm

The length fits well in standard PCB layouts, ensuring compatibility with existing designs.

Temperature Grade: INDUSTRIAL

Rated for industrial use means it can reliably operate in demanding conditions without performance degradation.

Technology: CMOS

CMOS technology delivers low power consumption along with high speed, making it energy-efficient and fast.

Parallel or Serial: PARALLEL

Parallel access allows for faster data transfers, critical for high-performance computing applications.

Terminal Form: GULL WING

Gull wing terminals facilitate better soldering and mechanical stability, enhancing overall reliability.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA supports high-speed operations while remaining energy efficient.

No. of Words: 32768 words

With 32,768 words, it provides ample memory for applications requiring moderate data storage.

Memory Width: 8

An 8-bit memory width fits well in common data bus architectures, simplifying integration with microcontrollers and CPUs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compatibility with standard PCB layouts, making it easy to implement.

No. of Words Code: 32K

The 32K word code signifies a significant amount of memory for various applications, providing good value.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V accommodates various system voltage levels, supporting diverse circuit designs.

Memory Density: 262144 bit

A memory density of 262,144 bits allows for efficient usage in applications requiring quick and reliable data access.

Memory IC Type: STANDARD SRAM

Standard SRAM is well-known for its speed and reliability, making it a trusted choice for memory solutions.

Maximum Standby Current: 0.000006 Amp

A very low maximum standby current helps in minimizing energy use, particularly in battery-powered applications.

Maximum Access Time: 55 ns

With a maximum access time of 55 ns, this SRAM is fast enough for a wide range of high-speed applications.

Technical Specifications

SRAM M68AF031AL55MS6T attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

18.22 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.505 mm

Trade Compliance

M68AF031AL55MS6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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