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M68AF031AL55MS1E

STMicroelectronics

M68AF031AL55MS1E by STMicroelectronics

M68AF031AL55MS1E by STMicroelectronics is a 32Kx8 CMOS SRAM with asynchronous operation and a max access time of 55 ns. It operates at a nominal voltage of 5V, suitable for various electronic applications. Its compact SO package ensures efficient surface mounting in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,054 parts In-Stock

1+ parts

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4,054

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Anansix

USA . 1,605 parts In-Stock

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1,605

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Vyrian

USA . 1,019 parts In-Stock

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1,019

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 358 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

$2.137

10k+ parts

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358

$2.375

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$2.137

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MKK Technologies

India . 1,319 parts In-Stock

1+ parts

$4.465

100+ parts

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1,319

$4.465

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DigiPath Technology Company

USA . 1,319 parts In-Stock

1+ parts

$4.465

100+ parts

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1,319

$4.465

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

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$2.839

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1,670

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$2.839

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Corphita

USA . 1,367 parts In-Stock

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1,367

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Overview

Unlock superior performance with the M68AF031AL55MS1E SRAM from STMicroelectronics. Known for their commitment to quality and innovation, STMicroelectronics delivers a reliable solution perfect for a wide range of applications—from consumer electronics to industrial systems. Experience rapid data access and low power consumption, enhancing your designs while ensuring longevity and efficiency. Elevate your projects with this industry-leading memory solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package ensures reliability and protection from environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for a compact design, enabling efficient use of board space in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides a standard footprint that is compatible with various circuit board layouts.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies timing requirements, allowing for easier integration into systems without complex timing management.

Input/Output Type: COMMON

Common I/O type facilitates simpler circuit design and ease of integration with other components.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal supply voltage of 5V makes this SRAM compatible with many standard digital circuits.

Power Supplies (V): 5

A single power supply requirement simplifies the design and reduces overall system complexity.

No. of Terminals: 28

The 28-terminal design provides necessary I/O interfaces while keeping the package compact.

Package Style (Meter): SMALL OUTLINE

The small outline style is ideal for space-constrained applications where board real estate is at a premium.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this SRAM is suitable for commercial applications with environmental considerations.

Organization: 32KX8

This memory organization offers a good balance of performance and storage capacity, suitable for many embedded applications.

Output Characteristics: 3-STATE

3-state output characteristics enable multiple devices to connect to the same bus, improving system efficiency.

Minimum Standby Voltage: 2V

Low standby voltage requirements help reduce power consumption during idle periods, contributing to energy efficiency.

Minimum Operating Temperature: 0 °C

Operating from 0 °C ensures functionality in moderate environments, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal positioning enhances soldering and PCB layout options, ensuring versatile use in design.

Maximum Seated Height: 2.79 mm

A low maximum seated height allows for a slimmer profile in devices, suitable for compact electronics.

Width: 7.505 mm

The width of 7.505 mm allows for easy fitting in standard PCB layouts, optimizing space utilization.

Minimum Supply Voltage (Vsup): 4.5V

This range of supply voltage ensures compatibility with various power supply designs.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures compatibility with modern soldering processes.

Length: 18.22 mm

A length of 18.22 mm fits well in various applications while maintaining adequate thermal performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes it suitable for consistent use in various consumer electronics.

Technology: CMOS

CMOS technology provides lower power consumption and higher density, enhancing efficiency and performance.

Parallel or Serial: PARALLEL

Parallel operation allows for higher data throughput, making it ideal for applications requiring fast access times.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and enhance mechanical stability on PCBs.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA indicates a suitable power requirement for many low to moderate power applications.

No. of Words: 32768 words

32K words of memory provides a generous storage capacity for moderate applications, balancing space and performance.

Memory Width: 8

An 8-bit memory width is compatible with standard microcontroller interfaces, enhancing integration options.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports standard PCB hole dimensions, simplifying layout design.

No. of Words Code: 32K

32K words code represents a versatile memory size suitable for various computing tasks.

Maximum Supply Voltage (Vsup): 5.5V

Higher maximum supply voltage provides design flexibility for applications across different voltage levels.

Memory Density: 262144 bit

A density of 262144 bits offers a compact solution that still meets the demands for moderate data storage.

Memory IC Type: STANDARD SRAM

As a standard SRAM type, it ensures compatibility with a wide range of devices and systems.

Maximum Standby Current: 0.000006 Amp

Extremely low maximum standby current contributes to overall system efficiency, especially in battery-powered devices.

Maximum Access Time: 55 ns

With a maximum access time of 55 ns, it provides quick response times crucial for performance-sensitive applications.

Technical Specifications

SRAM M68AF031AL55MS1E attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Length:

18.22 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.505 mm

Trade Compliance

M68AF031AL55MS1E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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