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M68AF031AL55MS6F

STMicroelectronics

M68AF031AL55MS6F by STMicroelectronics

M68AF031AL55MS6F from STMicroelectronics is a 32Kx8 CMOS SRAM with asynchronous operation and a max access time of 55 ns. It operates at a nominal voltage of 5V, suitable for industrial applications. Its compact SO package ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,199 parts In-Stock

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Vyrian

USA . 2,152 parts In-Stock

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Anansix

USA . 1,749 parts In-Stock

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1,749

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IDEA Electronic Components Group

UK . 886 parts In-Stock

1+ parts

$2.684

100+ parts

-

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$2.415

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886

$2.684

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MKK Technologies

India . 371 parts In-Stock

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$5.046

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DigiPath Technology Company

USA . 371 parts In-Stock

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$5.046

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371

$5.046

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Corphita

USA . 3,748 parts In-Stock

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Parana Technologies

USA . 1,011 parts In-Stock

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$3.209

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Overview

Unlock superior performance and reliability with the M68AF031AL55MS6F SRAM from STMicroelectronics. Renowned for exceptional quality, STMicroelectronics delivers cutting-edge technology perfect for diverse applications, from industrial control systems to telecommunications. Experience quick access times, low power consumption, and robust operation in extreme temperatures, empowering your designs with efficiency and durability. Elevate your projects today with a trusted partner in innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mounting allows for a compact design and efficient use of board space, ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into PCB layouts, enhancing design flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for straightforward read and write access, improving performance in certain applications.

Input/Output Type: COMMON

Common I/O type enhances compatibility with various systems and simplifies circuit design.

Nominal Supply Voltage / Vsup: 5V

Operates at standard 5V supply, making it easily adaptable for a wide range of devices.

Power Supplies (V): 5

Single 5V power supply simplifies power management and integration into existing systems.

No. of Terminals: 28

28 terminals provide ample connectivity options while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes footprint, allowing for high-density PCB designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it can function reliably in industrial applications.

Organization: 32KX8

This organization allows for efficient data management, suitable for various applications requiring quick access.

Output Characteristics: 3-STATE

3-state outputs enable better bus management in multi-device environments, improving functionality.

Minimum Standby Voltage: 2V

The capability to operate at low standby voltage helps in power conservation during idle times.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this SRAM suitable for extreme environments.

Terminal Position: DUAL

Dual terminal positioning enhances circuit design flexibility and improves electrical performance.

Maximum Seated Height: 2.79 mm

A low seated height facilitates compact designs without sacrificing performance.

Width: 7.505 mm

A narrow width allows for high-density placements on PCBs, maximizing space usage.

Minimum Supply Voltage (Vsup): 4.5V

The ability to operate at a minimum supply voltage of 4.5V increases versatility in different power designs.

Peak Reflow Temperature: 260 °C

High peak reflow temperature tolerance ensures compatibility with advanced soldering techniques.

Length: 18.22 mm

Compact length makes it a suitable choice for space-limited applications in consumer electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh operating conditions, ideal for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it efficient for various applications.

Parallel or Serial: PARALLEL

Parallel interfacing allows for faster data throughput, providing improved performance in high-speed applications.

Terminal Form: GULL WING

Gull wing terminals improve solder joint reliability, enhancing overall device performance.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA provides adequate performance for a variety of memory-intensive applications.

No. of Words: 32768 words

This memory capacity meets the requirements of various applications needing substantial data storage.

Memory Width: 8

An 8-bit memory width enables efficient storage and retrieval of data, essential for many computing applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard, ensuring compatibility with most PCB designs.

No. of Words Code: 32K

The 32K word capacity provides substantial memory resources for various applications, particularly in embedded systems.

Maximum Supply Voltage (Vsup): 5.5V

The ability to accommodate up to 5.5V allows flexibility in power supply design.

Memory Density: 262144 bit

High memory density makes it suitable for applications requiring significant data storage in limited space.

Memory IC Type: STANDARD SRAM

As a standard SRAM, it ensures reliable and rapid access to data, crucial for performance-sensitive applications.

Maximum Standby Current: 0.000006 Amp

Ultra-low standby current minimizes power consumption when not in use, making it energy-efficient.

Maximum Access Time: 55 ns

A fast access time of 55 ns speeds up system performance, ideal for high-speed applications.

Technical Specifications

SRAM M68AF031AL55MS6F attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

Length:

18.22 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.5

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.505 mm

Trade Compliance

M68AF031AL55MS6F Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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