Loading...

CY62167G30-45BVXI

Infineon Technologies

CY62167G30-45BVXI by Infineon Technologies

Infineon's CY62167G30-45BVXI is a 1MX16 SRAM with 45ns access time, operating at 3.6V. It features a very thin profile grid array package and offers 1048576 words of memory. Ideal for industrial applications requiring fast and reliable data storage with common I/O type and output enable functionality.

Median Price

$13.330

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 459 parts In-Stock

1+ parts

$13.330

100+ parts

$11.640

1k+ parts

-

10k+ parts

-

459

$13.330

$11.640

-

-

DigiKey

USA . 4,733 parts In-Stock

1+ parts

$15.360

100+ parts

$13.145

1k+ parts

$12.411

10k+ parts

-

4,733

$15.360

$13.145

$12.411

-

Chip1Stop

Japan . 50 parts In-Stock

1+ parts

$25.700

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$25.700

-

-

-

Flip Electronics (Authorized)

USA . 35,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,317

-

-

-

-

Verical

USA . 29,638 parts In-Stock

1+ parts

-

100+ parts

$12.656

1k+ parts

-

10k+ parts

-

29,638

-

$12.656

-

-

Rochester

USA . 2,806 parts In-Stock

1+ parts

-

100+ parts

$8.410

1k+ parts

$7.520

10k+ parts

$7.080

2,806

-

$8.410

$7.520

$7.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$18.580

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$18.580

-

-

-

Digiode

USA . 697 parts In-Stock

1+ parts

$19.431

100+ parts

-

1k+ parts

-

10k+ parts

-

697

$19.431

-

-

-

ACDS - Activité Composants Distribution Service

France . 21,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,740

-

-

-

-

Flip Electronics

USA . 19,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,138

-

-

-

-

Vyrian

USA . 6,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,636

-

-

-

-

IBS Electronics

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

$10.491

1k+ parts

$10.252

10k+ parts

$12.216

4,800

-

$10.491

$10.252

$12.216

Chip Stock

USA . 277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

277

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,066 parts In-Stock

1+ parts

$4.504

100+ parts

$4.324

1k+ parts

$4.144

10k+ parts

-

3,066

$4.504

$4.324

$4.144

-

Corohmni

South Africa . 751 parts In-Stock

1+ parts

$5.848

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$5.848

-

-

-

Ampacity Inc.

Singapore . 6,752 parts In-Stock

1+ parts

$13.110

100+ parts

-

1k+ parts

-

10k+ parts

-

6,752

$13.110

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$18.208

100+ parts

-

1k+ parts

$17.480

10k+ parts

-

2,000

$18.208

-

$17.480

-

Corphita

USA . 875 parts In-Stock

1+ parts

$18.409

100+ parts

-

1k+ parts

-

10k+ parts

-

875

$18.409

-

-

-

Continental Prestige Electronics

USA . 2,910 parts In-Stock

1+ parts

$18.580

100+ parts

-

1k+ parts

-

10k+ parts

$18.208

2,910

$18.580

-

-

$18.208

Component Stockers USA

USA . 3,469 parts In-Stock

1+ parts

$23.170

100+ parts

$19.120

1k+ parts

$18.930

10k+ parts

-

3,469

$23.170

$19.120

$18.930

-

A-Z Elektronik GmbH

Germany . 5,037 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,037

-

-

-

-

Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Alle Elektronik GmbH

Germany . 3,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,358

-

-

-

-

Argo Parts USA

USA . 766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

766

-

-

-

-

Perfect Parts

USA . 538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

538

-

-

-

-

Futuretech Components

Singapore . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

247

-

-

-

-

Kepictronics

USA . 98 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the CY62167G30-45BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and cutting-edge technology. This SRAM memory module is perfect for a wide range of applications, offering lightning-fast data access speeds and low power consumption. Experience seamless operation and improved efficiency with this versatile product, designed to meet all your memory needs. Elevate your projects to the next level with the CY62167G30-45BVXI from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this SRAM lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape of the package maximizes space efficiency on the circuit board, making it suitable for compact electronic applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures fast and efficient data processing without the need for a clock signal, enhancing system performance.

Input/Output Type: COMMON

The common input/output type simplifies connections and compatibility with other components, allowing for seamless integration into various systems.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V offers a balance between power consumption and performance, making it suitable for a wide range of applications.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options and flexibility in designing complex electronic circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting of the SRAM, saving valuable space on the PCB.

Alternate Memory Width: 8

With an alternate memory width of 8, this SRAM can cater to specific memory requirements in different applications, offering versatility in memory storage.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

SRAM CY62167G30-45BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Standby Current:

.000016 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

36 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CY62167G30-45BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20