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NGTB50N60FWG

Onsemi

NGTB50N60FWG by Onsemi

NGTB50N60FWG by Onsemi is an N-CHANNEL IGBT with 223W power dissipation, 600V collector-emitter voltage, and 100A collector current. It operates up to 150 °C and has a gate-emitter threshold voltage of 6.5V. Ideal for high-power applications like motor drives and inverters due to its robust specifications.

Median Price

$3.164

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49 parts In-Stock

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$3.164

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Rochester

USA . 10,950 parts In-Stock

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$2.980

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$2.670

10k+ parts

$2.510

10,950

-

$2.980

$2.670

$2.510

Verical

USA . 10,020 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.337

10k+ parts

$3.138

10,020

-

$3.925

$3.337

$3.138

Flip Electronics (Authorized)

USA . 60 parts In-Stock

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Digiode

USA . 2,097 parts In-Stock

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$3.006

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Vyrian

USA . 8,286 parts In-Stock

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Flip Electronics

USA . 60 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.717

100+ parts

$0.652

1k+ parts

$0.588

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20

$0.717

$0.652

$0.588

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Corphita

USA . 853 parts In-Stock

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$2.848

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853

$2.848

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Corohmni

South Africa . 218 parts In-Stock

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$3.164

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Component Stockers USA

USA . 12,527 parts In-Stock

1+ parts

$3.260

100+ parts

$3.200

1k+ parts

$2.890

10k+ parts

$2.890

12,527

$3.260

$3.200

$2.890

$2.890

AZTECH Wire

Italy . 216 parts In-Stock

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$8.210

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Microchip USA

USA . 11,149 parts In-Stock

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Continental Prestige Electronics

USA . 10,950 parts In-Stock

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$3.030

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A-Z Elektronik GmbH

Germany . 7,287 parts In-Stock

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SupplyDigital Components

Austria . 6,433 parts In-Stock

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Kulean Microsystems

USA . 5,279 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,522 parts In-Stock

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TANS Electronics

Latvia . 2,327 parts In-Stock

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2,327

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UHIMA Technologies

Türkiye . 935 parts In-Stock

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Perfect Parts

USA . 235 parts In-Stock

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Overview

Discover the NGTB50N60FWG by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor (IGBT) that sets the standard for performance and reliability in the industry. With a maximum power dissipation of 223W and a collector-emitter voltage of 600V, this N-CHANNEL transistor is perfect for a wide range of applications. Whether you're looking to improve efficiency in power electronics, motor drives, or renewable energy systems, this product offers unparalleled value and benefits. Trust Onsemi's reputation for quality and innovation, and experience the advantages of the NGTB50N60FWG for yourself.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their superior performance and efficiency compared to P-CHANNEL IGBTs. They are a popular choice for various applications due to their high switching speeds and low conduction losses.

Maximum Power Dissipation (Abs): 223 W

With a high maximum power dissipation of 223 W, this IGBT can handle high power loads effectively without overheating, ensuring reliable operation in demanding conditions.

Maximum Operating Temperature: 150 °C

The IGBT's maximum operating temperature of 150 °C allows it to withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage of 600 V makes this IGBT suitable for applications that require high voltage switching, such as in power electronics and motor control.

Maximum Gate-Emitter Voltage: 20 V

The 20 V maximum gate-emitter voltage ensures safe operation and reliable switching performance, providing protection against overvoltage conditions.

Maximum Collector Current (IC): 100 A

With a high maximum collector current of 100 A, this IGBT can handle high current loads effectively, making it ideal for power electronics applications that require efficient power switching.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The 6.5 V maximum gate-emitter threshold voltage ensures precise control over the IGBT's switching behavior, allowing for smooth and efficient operation in various applications.

Terminal Finish: TIN

The TIN terminal finish provides corrosion resistance and ensures good electrical conductivity, resulting in reliable connections and extended lifespan of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB50N60FWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Trade Compliance

NGTB50N60FWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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