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FGH75T65SHDTLN4

Onsemi

FGH75T65SHDTLN4 by Onsemi

FGH75T65SHDTLN4 by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 2.1V and a max collector-emitter voltage of 650V. It is designed for power control applications, offering a max power dissipation of 455W and a max operating temperature of 175°C.

Median Price

$3.860

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 18 parts In-Stock

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$3.080

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18

$3.080

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Arrow

USA . 18 parts In-Stock

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$3.579

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18

$3.579

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Mouser Electronics

USA . 309 parts In-Stock

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$5.120

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$3.950

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$3.810

309

$5.120

-

$3.950

$3.810

Element14

Singapore . 450 parts In-Stock

1+ parts

$11.550

100+ parts

$8.640

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$6.550

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450

$11.550

$8.640

$6.550

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DigiKey

USA . 4,249 parts In-Stock

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$2.920

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4,249

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$2.920

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Flip Electronics (Authorized)

USA . 4,249 parts In-Stock

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4,249

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Rochester

USA . 37 parts In-Stock

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$4.140

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$3.710

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$3.490

37

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$4.140

$3.710

$3.490

Verical

USA . 18 parts In-Stock

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18

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Distributors (In-Stock)

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Digiode

USA . 866 parts In-Stock

1+ parts

$1.836

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866

$1.836

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Nova Conductors

Japan . 650 parts In-Stock

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$4.246

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650

$4.246

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Flip Electronics

USA . 4,249 parts In-Stock

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4,249

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DigiKey Marketplace

USA . 4,249 parts In-Stock

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Vyrian

USA . 1,068 parts In-Stock

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1,068

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ACDS - Activité Composants Distribution Service

France . 395 parts In-Stock

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395

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Bristol Electronics

USA . 395 parts In-Stock

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395

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Dan-Mar Components

USA . 395 parts In-Stock

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395

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Distributors (Availability)

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Semicontronic

India . 1,059 parts In-Stock

1+ parts

$1.640

100+ parts

$1.599

1k+ parts

$1.591

10k+ parts

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1,059

$1.640

$1.599

$1.591

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Ampacity Inc.

Singapore . 924 parts In-Stock

1+ parts

$1.640

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924

$1.640

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Corphita

USA . 2,014 parts In-Stock

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$1.740

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2,014

$1.740

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Aztec Data Supply Inc.

USA . 14,088 parts In-Stock

1+ parts

$1.910

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14,088

$1.910

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Corohmni

South Africa . 179 parts In-Stock

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$1.933

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179

$1.933

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Aranea Global

USA . 100 parts In-Stock

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$4.161

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$3.995

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100

$4.161

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$3.995

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Argo Parts USA

USA . 3,280 parts In-Stock

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$4.246

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3,280

$4.246

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$4.331

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$4.331

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$4.331

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350

$4.331

$4.331

$4.331

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Microchip USA

USA . 391 parts In-Stock

1+ parts

$28.730

100+ parts

$28.550

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$28.460

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$28.380

391

$28.730

$28.550

$28.460

$28.380

Lixinc

USA . 19,123 parts In-Stock

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Kulean Microsystems

USA . 7,329 parts In-Stock

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Problanco Electronics

Mexico . 7,114 parts In-Stock

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SupplyDigital Components

Austria . 5,023 parts In-Stock

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TANS Electronics

Latvia . 4,495 parts In-Stock

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UHIMA Technologies

Türkiye . 922 parts In-Stock

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922

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Continental Prestige Electronics

USA . 100 parts In-Stock

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$4.400

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100

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$4.400

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Overview

Experience the power and reliability of the FGH75T65SHDTLN4 by Onsemi, a top-quality Insulated Gate Bipolar Transistor designed for power control applications. With a maximum collector-emitter voltage of 650V and a maximum collector current of 150A, this N-CHANNEL transistor offers outstanding performance and efficiency. Its robust construction, single configuration with built-in diode, and high power dissipation make it ideal for demanding industrial environments. Trust Onsemi's reputation for excellence and choose the FGH75T65SHDTLN4 for your next project to experience unmatched quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs typically have lower on-state voltage drops and higher efficiency compared to P-Channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing damage due to reverse current flow, making it ideal for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in controlling high power devices.

Maximum VCEsat: 2.1 V

Low VCEsat value indicates low on-state voltage drop, leading to higher efficiency and reduced power losses.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement in electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering onto circuit boards.

No. of Terminals: 4

Sufficient number of terminals for connecting to external circuits and components.

Maximum Power Dissipation (Abs): 455 W

High power dissipation capability allows for handling high power levels without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides easy and secure mounting onto heat sinks for improved thermal management.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows for reliable operation even in harsh environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating enables the IGBT to be used in applications with higher voltage requirements.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance and reliability in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating allows for efficient and precise control of the IGBT.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable operation in cold environments.

Maximum Collector Current (IC): 150 A

High collector current rating allows for handling high current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Low gate-emitter threshold voltage ensures easy triggering and control of the IGBT.

Terminal Position: SINGLE

Single terminal position simplifies the connection process and reduces the chances of wiring errors.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75T65SHDTLN4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Maximum VCEsat:

2.1 V

Trade Compliance

FGH75T65SHDTLN4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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