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FGH75T65SHDT-F155

Onsemi

FGH75T65SHDT-F155 by Onsemi

FGH75T65SHDT-F155 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.1V and IC of 150A, ideal for POWER CONTROL applications. Featuring a package style of FLANGE MOUNT, it has a max operating temperature of 175°C and turn-off time (toff) of 109ns.

Median Price

$7.100

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 435 parts In-Stock

1+ parts

$6.110

100+ parts

$3.230

1k+ parts

$2.880

10k+ parts

-

435

$6.110

$3.230

$2.880

-

DigiKey

USA . 1,182 parts In-Stock

1+ parts

$7.100

100+ parts

$4.082

1k+ parts

$2.932

10k+ parts

$2.926

1,182

$7.100

$4.082

$2.932

$2.926

Mouser Electronics

USA . 645 parts In-Stock

1+ parts

$7.100

100+ parts

$3.420

1k+ parts

$3.390

10k+ parts

-

645

$7.100

$3.420

$3.390

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Newark

USA . 425 parts In-Stock

1+ parts

$8.500

100+ parts

$5.150

1k+ parts

$4.820

10k+ parts

-

425

$8.500

$5.150

$4.820

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Element14

Singapore . 435 parts In-Stock

1+ parts

$10.270

100+ parts

$4.930

1k+ parts

$4.760

10k+ parts

-

435

$10.270

$4.930

$4.760

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Chip1Stop

Japan . 350 parts In-Stock

1+ parts

$18.800

100+ parts

$8.310

1k+ parts

-

10k+ parts

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350

$18.800

$8.310

-

-

Rochester

USA . 2,458 parts In-Stock

1+ parts

-

100+ parts

$2.930

1k+ parts

$2.620

10k+ parts

$2.460

2,458

-

$2.930

$2.620

$2.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 534 parts In-Stock

1+ parts

$3.088

100+ parts

-

1k+ parts

-

10k+ parts

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534

$3.088

-

-

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Vyrian

USA . 2,723 parts In-Stock

1+ parts

$3.250

100+ parts

-

1k+ parts

-

10k+ parts

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2,723

$3.250

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,800 parts In-Stock

1+ parts

$2.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

$2.925

-

-

-

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$3.250

100+ parts

-

1k+ parts

-

10k+ parts

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260

$3.250

-

-

-

Microchip USA

USA . 3,316 parts In-Stock

1+ parts

$23.296

100+ parts

-

1k+ parts

-

10k+ parts

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3,316

$23.296

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-

-

Native Components

USA . 29 parts In-Stock

1+ parts

$65.625

100+ parts

-

1k+ parts

-

10k+ parts

$63.000

29

$65.625

-

-

$63.000

Northwest PG Solutions

USA . 1,807 parts In-Stock

1+ parts

$72.188

100+ parts

-

1k+ parts

-

10k+ parts

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1,807

$72.188

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-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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-

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SupplyDigital Components

Austria . 7,830 parts In-Stock

1+ parts

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7,830

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Lixinc

USA . 7,756 parts In-Stock

1+ parts

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7,756

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Kulean Microsystems

USA . 2,381 parts In-Stock

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2,381

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Supply Digital

USA . 1,447 parts In-Stock

1+ parts

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1,447

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Problanco Electronics

Mexico . 1,398 parts In-Stock

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1,398

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Perfect Parts

USA . 918 parts In-Stock

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918

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TANS Electronics

Latvia . 604 parts In-Stock

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604

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UHIMA Technologies

Türkiye . 167 parts In-Stock

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167

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Overview

Elevate your power control game with the FGH75T65SHDT-F155 IGBT from Onsemi. Known for their high-quality components, Onsemi delivers reliability and performance in every product. This N-CHANNEL transistor with a built-in diode is perfect for applications requiring maximum power dissipation and efficient operation. With a maximum VCEsat of 2.1V and a collector current of 150A, this IGBT offers unparalleled value and benefits to customers looking for superior power control solutions. Invest in the best with Onsemi's FGH75T65SHDT-F155 and experience the difference in performance and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides high electrical insulation and robust protection for the components inside, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs often have lower ON-state voltage drop and faster switching speed compared to P-channel, making this product efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient control of current flow, reducing the need for external components and simplifying circuit design.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in managing high power levels.

Maximum VCEsat: 2.1 V

Low VCEsat ensures minimal power dissipation and heat generation, increasing the overall efficiency of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy and efficient mounting in various applications, saving space and enhancing overall design flexibility.

Nominal Turn Off Time (toff): 109 ns

Fast turn-off time allows for precise control of power output, reducing switching losses and improving overall performance.

No. of Terminals: 3

Simple and straightforward terminal configuration for easy installation and connection in circuits.

Maximum Power Dissipation (Abs): 455 W

High power dissipation capability allows the product to handle large power loads without compromising performance or reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure and stable mounting in various applications, ensuring long-term reliability and stability.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making the product suitable for diverse applications.

Maximum Collector-Emitter Voltage: 650 V

High collector-emitter voltage rating allows the product to handle high voltage applications with ease, ensuring safety and reliability.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability, making the product suitable for demanding power control applications.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating ensures proper control and gate triggering, enhancing the overall efficiency and reliability of the product.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows the product to perform effectively in extreme cold conditions, ensuring reliable operation in various environments.

Maximum Collector Current (IC): 150 A

High collector current rating allows the product to handle large current flows, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7.5 V

Low gate-emitter threshold voltage ensures efficient gate control and triggering, enhancing the overall performance of the product.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making the product user-friendly and easy to integrate into circuits.

Case Connection: COLLECTOR

Collector case connection provides a secure and stable connection point, ensuring reliable operation and minimizing the risk of circuit failure.

Nominal Turn On Time (ton): 89 ns

Fast turn-on time allows for quick and efficient switching, improving overall performance and efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH75T65SHDT-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

109 ns

Nominal Turn On Time (ton):

89 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGH75T65SHDT-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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