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NGTB60N65FL2WG

Onsemi

NGTB60N65FL2WG by Onsemi

NGTB60N65FL2WG by Onsemi is an N-CHANNEL IGBT with 650V VCEsat, 100A IC, and 595W power dissipation. Ideal for power control applications, it features a built-in diode and operates b/w -55 to 175 °C. The transistor has a turn-off time of 278ns and turn-on time of 168ns in a rectangular package with through-hole terminals.

Median Price

$6.360

Lifecycle Status

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10

In-Stock Inventory

1k+

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DigiKey

USA . 120 parts In-Stock

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$6.360

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Farnell

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$7.330

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$7.330

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Rochester

USA . 53 parts In-Stock

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$6.250

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$5.590

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$5.260

53

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$6.250

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$5.260

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Digiode

USA . 487 parts In-Stock

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$6.612

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Nova Conductors

Japan . 200 parts In-Stock

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Vyrian

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Chip Stock

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ComSIT Distribution GmbH

Germany . 270 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,917 parts In-Stock

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$1.690

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$1.690

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Modulus Dynamics

Lithuania . 4,200 parts In-Stock

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$1.857

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$1.857

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$1.857

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$1.857

$1.857

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Ampacity Inc.

Singapore . 94 parts In-Stock

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$5.410

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Semicontronic

India . 94 parts In-Stock

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$5.410

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$5.275

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$5.248

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AZTECH Wire

Italy . 753 parts In-Stock

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$5.543

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Corphita

USA . 1,268 parts In-Stock

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$6.264

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Corohmni

South Africa . 277 parts In-Stock

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$6.360

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Continental Prestige Electronics

USA . 4,148 parts In-Stock

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$8.120

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$7.958

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$7.958

Netroflash

USA . 2,000 parts In-Stock

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$8.120

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$7.714

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$7.552

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$8.120

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$7.552

Lixinc

USA . 17,475 parts In-Stock

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Problanco Electronics

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RC Electronics

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A-Z Elektronik GmbH

Germany . 6,248 parts In-Stock

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Kulean Microsystems

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TANS Electronics

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Argo Parts USA

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UHIMA Technologies

Türkiye . 524 parts In-Stock

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SupplyDigital Components

Austria . 338 parts In-Stock

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Overview

Unlock the power of innovation with the NGTB60N65FL2WG by Onsemi, a high-quality Insulated Gate Bipolar Transistor designed for efficient power control applications. Manufactured by Onsemi, known for their superior products, this N-CHANNEL transistor offers a single configuration with a built-in diode for added convenience. With a maximum VCEsat of 2V and a maximum collector-emitter voltage of 650V, this transistor provides exceptional performance and reliability. Whether you're in need of reliable power control solutions for your project, the NGTB60N65FL2WG is the perfect choice for delivering outstanding results.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type - N-CHANNEL

Offers efficient power control capabilities suitable for a wide range of applications.

Configuration - SINGLE WITH BUILT-IN DIODE

Simplified design and integration due to the presence of built-in diode, reducing the need for additional components.

Terminal Form - THROUGH-HOLE

Easy to solder onto circuit boards for secure connections and stable operation.

Maximum Power Dissipation (Abs) - 595 W

High power dissipation capability allows for handling of large loads and high-current applications.

Maximum Operating Temperature - 175 °C

Can operate in high-temperature environments without performance degradation, ensuring reliability in challenging conditions.

Maximum Collector-Emitter Voltage - 650 V

Suitable for high-voltage applications, providing versatility in power control operations.

Maximum Gate-Emitter Voltage - 20 V

Provides efficient gate control for optimal performance and reliability.

Maximum Collector Current (IC) - 100 A

Capable of handling high currents, making it suitable for power control applications where heavy loads are involved.

Nominal Turn On Time (ton) - 168 ns

Fast turn-on time ensures quick response and efficient power switching capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB60N65FL2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

278 ns

Nominal Turn On Time (ton):

168 ns

Maximum VCEsat:

2 V

Trade Compliance

NGTB60N65FL2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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