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NGTB20N120IHRWG

Onsemi

NGTB20N120IHRWG by Onsemi

NGTB20N120IHRWG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 40A IC, and 384W Pd. It operates up to 175°C making it ideal for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$3.030

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 143 parts In-Stock

1+ parts

-

100+ parts

$2.860

1k+ parts

$2.560

10k+ parts

$2.410

143

-

$2.860

$2.560

$2.410

Verical

USA . 143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.200

10k+ parts

$3.013

143

-

-

$3.200

$3.013

Flip Electronics (Authorized)

USA . 58 parts In-Stock

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-

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-

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58

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Distributors (In-Stock)

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Digiode

USA . 135 parts In-Stock

1+ parts

$3.040

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-

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135

$3.040

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$3.785

100+ parts

-

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50

$3.785

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Vyrian

USA . 2,290 parts In-Stock

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2,290

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Flip Electronics

USA . 58 parts In-Stock

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58

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Distributors (Availability)

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$0.453

100+ parts

$0.412

1k+ parts

$0.371

10k+ parts

-

60

$0.453

$0.412

$0.371

-

Ampacity Inc.

Singapore . 101 parts In-Stock

1+ parts

$2.720

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-

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101

$2.720

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Corphita

USA . 1,905 parts In-Stock

1+ parts

$2.880

100+ parts

-

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1,905

$2.880

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$3.200

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478

$3.200

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Continental Prestige Electronics

USA . 1,624 parts In-Stock

1+ parts

$3.785

100+ parts

-

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10k+ parts

$3.709

1,624

$3.785

-

-

$3.709

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.785

100+ parts

-

1k+ parts

$3.596

10k+ parts

$3.520

1,000

$3.785

-

$3.596

$3.520

Argo Parts USA

USA . 918 parts In-Stock

1+ parts

$3.785

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-

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918

$3.785

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AZTECH Wire

Italy . 585 parts In-Stock

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$15.645

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585

$15.645

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Microchip USA

USA . 7,811 parts In-Stock

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$16.296

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7,811

$16.296

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Perfect Parts

USA . 15,004 parts In-Stock

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15,004

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Lixinc

USA . 11,525 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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9,000

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Problanco Electronics

Mexico . 6,875 parts In-Stock

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6,875

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SupplyDigital Components

Austria . 5,714 parts In-Stock

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5,714

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A-Z Elektronik GmbH

Germany . 5,612 parts In-Stock

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5,612

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Kulean Microsystems

USA . 5,141 parts In-Stock

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5,141

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TANS Electronics

Latvia . 3,784 parts In-Stock

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3,784

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UHIMA Technologies

Türkiye . 70 parts In-Stock

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70

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Overview

Unlock the power of innovation with the NGTB20N120IHRWG by Onsemi. As a leader in manufacturing high-quality Insulated Gate Bipolar Transistors (IGBT), Onsemi delivers unmatched reliability and performance. Designed for N-channel applications, this IGBT boasts a maximum collector-emitter voltage of 1200V and a maximum gate-emitter voltage of 20V, making it ideal for a wide range of industrial and automotive applications. Experience the value and benefits of superior technology with Onsemi's NGTB20N120IHRWG.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL IGBTs typically have lower conduction losses and faster switching speeds compared to P-CHANNEL IGBTs, making them more efficient for many applications.

Maximum Power Dissipation (Abs)

With a high maximum power dissipation, this IGBT can handle high power levels without overheating, making it suitable for demanding applications.

Maximum Operating Temperature

The high maximum operating temperature allows this IGBT to operate reliably in high-temperature environments, increasing its versatility.

Maximum Collector-Emitter Voltage

With a high maximum collector-emitter voltage, this IGBT can be used in high-voltage circuits and applications, ensuring robust performance.

Maximum Gate-Emitter Voltage

The low maximum gate-emitter voltage reduces losses in the gate drive circuit and improves efficiency in switching operations, enhancing overall performance.

Maximum Collector Current (IC)

With a high maximum collector current rating, this IGBT can handle large current flows, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage

The low gate-emitter threshold voltage ensures that the IGBT can turn on and off efficiently, reducing switching losses and improving overall efficiency.

Terminal Finish

Matte Tin (Sn) terminal finish provides good solderability and improves the reliability of connections, ensuring long-term performance and durability.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB20N120IHRWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Trade Compliance

NGTB20N120IHRWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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