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IRG4BC30KD-SPBF

Infineon Technologies

IRG4BC30KD-SPBF by Infineon Technologies

IRG4BC30KD-SPBF by Infineon Technologies is an N-channel insulated gate bipolar transistor (IGBT) with a max collector-emitter voltage of 600V and a max collector current of 28A. It is commonly used in motor control applications due to its single configuration with built-in diode and small outline package style.

Median Price

$4.245

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 500 parts In-Stock

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$3.037

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$3.037

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Voyager Components

USA . 5 parts In-Stock

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$5.454

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$5.454

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Digiode

USA . 373 parts In-Stock

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Vyrian

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Modulus Dynamics

Lithuania . 7,866 parts In-Stock

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$0.721

100+ parts

$0.692

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$0.663

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7,866

$0.721

$0.692

$0.663

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Corohmni

South Africa . 548 parts In-Stock

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$0.792

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548

$0.792

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$1.313

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$1.195

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$1.077

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150

$1.313

$1.195

$1.077

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Aztec Data Supply Inc.

USA . 896 parts In-Stock

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$1.820

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$1.820

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Continental Prestige Electronics

USA . 6,899 parts In-Stock

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$3.037

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$2.976

6,899

$3.037

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$2.976

Netroflash

USA . 2,000 parts In-Stock

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$3.037

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$3.037

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Argo Parts USA

USA . 1,198 parts In-Stock

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$3.037

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AZTECH Wire

Italy . 581 parts In-Stock

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Semicontronic

India . 353 parts In-Stock

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$15.050

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$14.674

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$14.598

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353

$15.050

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$14.598

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Ampacity Inc.

Singapore . 947 parts In-Stock

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$34.050

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QUARKTWIN TECHNOLOGY LTD

USA . 24,601 parts In-Stock

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Lixinc

USA . 9,700 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Perfect Parts

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Corphita

USA . 720 parts In-Stock

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Microchip USA

USA . 272 parts In-Stock

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Overview

Experience the next level of motor control with the IRG4BC30KD-SPBF by Infineon Technologies. As a trusted manufacturer in the industry, Infineon Technologies brings you high-quality Insulated Gate Bipolar Transistors (IGBTs) that are designed to optimize performance and efficiency. With its single configuration and built-in diode, this IGBT offers seamless integration and enhanced functionality. Whether you're in the automotive or industrial sector, the IRG4BC30KD-SPBF is perfect for a wide range of motor control applications. Unlock the power of precision and reliability with Infineon Technologies' IRG4BC30KD-SPBF and revolutionize your motor control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and protection for long-term use, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

With its N-channel polarity, this IGBT can efficiently handle high voltages and currents, making it suitable for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration IGBT allows for better reverse recovery characteristics, enhancing overall performance and efficiency.

Transistor Application: MOTOR CONTROL

Designed specifically for motor control applications, this IGBT provides precise and reliable control over motors, making it an ideal choice for various industrial and automotive applications.

Surface Mount: YES

This IGBT's surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape of this IGBT offers a compact and space-saving design, making it suitable for applications with limited board area.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, reducing the risk of electrical failures and improving overall performance.

No. of Elements: 1

This IGBT consists of a single element, simplifying the circuit design and reducing complexity, ultimately leading to improved system reliability.

Maximum Fall Time (tf): 120 ns

With a maximum fall time of 120 ns, this IGBT provides fast switching speeds, ensuring efficient motor control and reducing energy losses.

Nominal Turn Off Time (toff): 370 ns

The nominal turn-off time of 370 ns allows for precise control and quick response during the switching off process, enhancing overall system performance.

No. of Terminals: 2

With just two terminals, this IGBT offers easy and straightforward connection options, simplifying the overall circuit design.

Maximum Power Dissipation (Abs): 100 W

The maximum power dissipation of 100 W ensures that this IGBT can handle high-power applications without overheating, ensuring reliability and longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this IGBT allows for efficient utilization of board space, making it suitable for compact electronic devices.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can withstand high-temperature environments, making it suitable for various industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The maximum collector-emitter voltage of 600 V enables this IGBT to handle high voltage levels, making it suitable for power electronics applications.

Transistor Element Material: SILICON

Built with silicon as the transistor element material, this IGBT offers excellent performance, reliability, and superior thermal characteristics.

Maximum Gate-Emitter Voltage: 20 V

With a maximum gate-emitter voltage of 20 V, this IGBT ensures reliable and effective gate control, enabling precise switching operations.

Maximum Collector Current (IC): 28 A

The maximum collector current of 28 A allows this IGBT to handle high current levels, making it suitable for demanding applications.

Maximum Gate-Emitter Threshold Voltage: 6 V

The maximum gate-emitter threshold voltage of 6 V ensures precise gate control and enhances the overall efficiency of the IGBT.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin finish over nickel terminals provides excellent solderability and robust connections, ensuring reliable and consistent performance.

Terminal Position: SINGLE

With a single terminal position, this IGBT offers simplicity and ease of installation, minimizing the risk of wiring errors and improving overall reliability.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this IGBT can withstand higher humidity levels during storage and assembly, ensuring quality and reliability.

Case Connection: COLLECTOR

The case connection at the collector enhances the overall performance and reliability of this IGBT, allowing for efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

This IGBT can withstand a maximum time of 30 seconds at the peak reflow temperature, ensuring proper soldering during assembly without compromising performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this IGBT can withstand high-temperature soldering processes, ensuring reliable and durable connections.

Nominal Turn On Time (ton): 100 ns

The nominal turn-on time of 100 ns enables quick and precise switching operations, making it suitable for applications requiring fast responses.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4BC30KD-SPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

120 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

370 ns

Nominal Turn On Time (ton):

100 ns

Trade Compliance

IRG4BC30KD-SPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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