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IRG4PSH71UDPBF

Infineon Technologies

IRG4PSH71UDPBF by Infineon Technologies

Infineon's IRG4PSH71UDPBF is an N-CHANNEL IGBT with 1200V max collector-emitter voltage and 99A max collector current. It features a built-in diode, 330ns fall time, and 810ns turn off time. Ideal for power control applications with a max power dissipation of 350W at up to 150°C operating temperature.

Median Price

$13.192

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$10.785

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700

$10.785

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Bristol Electronics

USA . 3 parts In-Stock

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$15.600

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3

$15.600

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Vyrian

USA . 1,175 parts In-Stock

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1,175

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Digiode

USA . 705 parts In-Stock

1+ parts

-

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705

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LIBRA Elektronik GmbH

Germany . 50 parts In-Stock

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50

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Velocity Electronics

USA . 34 parts In-Stock

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34

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Corohmni

South Africa . 90 parts In-Stock

1+ parts

$0.378

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90

$0.378

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Modulus Dynamics

Lithuania . 20,907 parts In-Stock

1+ parts

$0.394

100+ parts

$0.378

1k+ parts

$0.362

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-

20,907

$0.394

$0.378

$0.362

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Aztec Data Supply Inc.

USA . 2,418 parts In-Stock

1+ parts

$1.298

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$1.298

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Continental Prestige Electronics

USA . 4,789 parts In-Stock

1+ parts

$10.685

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$10.471

4,789

$10.685

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$10.471

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$10.785

100+ parts

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$10.246

10k+ parts

$10.030

2,000

$10.785

-

$10.246

$10.030

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$11.001

100+ parts

$11.001

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$11.001

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3,000

$11.001

$11.001

$11.001

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AZTECH Wire

Italy . 620 parts In-Stock

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$12.282

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620

$12.282

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Ampacity Inc.

Singapore . 237 parts In-Stock

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$42.050

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237

$42.050

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Semicontronic

India . 1,463 parts In-Stock

1+ parts

$46.050

100+ parts

$44.899

1k+ parts

$44.668

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1,463

$46.050

$44.899

$44.668

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,976 parts In-Stock

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Microchip USA

USA . 2,758 parts In-Stock

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2,758

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Perfect Parts

USA . 472 parts In-Stock

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472

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Corphita

USA . 308 parts In-Stock

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308

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unlock the power of Infineon Technologies with the IRG4PSH71UDPBF Insulated Gate Bipolar Transistor. This high-quality N-CHANNEL transistor, with a built-in diode, is perfect for power control applications. Its fast fall and turn-off times make it a reliable choice for your projects. With a maximum collector-emitter voltage of 1200V and a maximum power dissipation of 350W, this transistor offers exceptional performance and durability. Trust in Infineon Technologies to deliver top-notch products that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs are known for their high efficiency and fast switching speeds, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and saves space, making this IGBT a convenient option for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for efficient energy conversion and reliable performance.

Maximum Power Dissipation (Abs): 350 W

With a high power dissipation capability, this IGBT can handle large amounts of power without overheating, ensuring stable operation under heavy loads.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating allows this IGBT to be used in high voltage applications, making it versatile for various power control scenarios.

Maximum Collector Current (IC): 99 A

With a high collector current rating, this IGBT can handle large currents, making it suitable for power control applications that require high current handling capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PSH71UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST SWITCHING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Fall Time (tf):

330 ns

Maximum Gate-Emitter Threshold Voltage:

6 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-274AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

810 ns

Nominal Turn On Time (ton):

121 ns

Trade Compliance

IRG4PSH71UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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