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IRG4PH50UDPBF

Infineon Technologies

IRG4PH50UDPBF by Infineon Technologies

IRG4PH50UDPBF by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a collector current of 45A. It has a nominal turn-off time of 570ns and turn-on time of 73ns, making it ideal for power control applications requiring fast switching speeds. The transistor comes in a rectangular package with through-hole terminals and built-in diode, suitable for flange mount installations.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$1.000

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500

$1.000

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 657 parts In-Stock

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657

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Digiode

USA . 106 parts In-Stock

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106

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Distributors (Availability)

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Bastille Electronics

Australia . 800 parts In-Stock

1+ parts

$1.000

100+ parts

$0.950

1k+ parts

$0.902

10k+ parts

$0.890

800

$1.000

$0.950

$0.902

$0.890

Modulus Dynamics

Lithuania . 24,096 parts In-Stock

1+ parts

$1.521

100+ parts

$1.460

1k+ parts

$1.399

10k+ parts

-

24,096

$1.521

$1.460

$1.399

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Aztec Data Supply Inc.

USA . 5,915 parts In-Stock

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$1.590

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5,915

$1.590

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Ampacity Inc.

Singapore . 1,263 parts In-Stock

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$7.050

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1,263

$7.050

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AZTECH Wire

Italy . 190 parts In-Stock

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$14.744

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190

$14.744

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Semicontronic

India . 725 parts In-Stock

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$56.050

100+ parts

$54.649

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$54.368

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725

$56.050

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$54.368

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Perfect Parts

USA . 12,646 parts In-Stock

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Kepictronics

USA . 9,250 parts In-Stock

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Futuretech Components

Singapore . 6,925 parts In-Stock

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Continental Prestige Electronics

USA . 5,226 parts In-Stock

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Argo Parts USA

USA . 3,031 parts In-Stock

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Microchip USA

USA . 2,166 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,487 parts In-Stock

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Corphita

USA . 224 parts In-Stock

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Advanced Electronics

New Zealand . 69 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Discover the power and efficiency of the IRG4PH50UDPBF Insulated Gate Bipolar Transistor by Infineon Technologies. With a maximum collector-emitter voltage of 1200V and a collector current of 45A, this N-Channel transistor offers unparalleled performance in power control applications. The single configuration with built-in diode ensures seamless integration, while the flange mount package style provides easy installation. Trust in the quality and reliability of Infineon Technologies to elevate your projects to new heights of success. Experience the difference with the IRG4PH50UDPBF - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good insulation and protection for the internal components of the IGBT, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them suitable for power control applications where performance is crucial.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and saves space, making this IGBT a cost-effective and convenient choice for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT is optimized for efficient power management and can handle high current and voltage levels.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and integration into various electronic systems, making it versatile and user-friendly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ensuring stable performance and ease of installation in different circuit boards and systems.

Nominal Turn Off Time (toff): 570 ns

The fast turn-off time of 570 ns enhances the switching speed of the IGBT, improving overall efficiency and reducing power loss in power control applications.

No. of Terminals: 3

Having 3 terminals allows for precise control and effective power management, making this IGBT suitable for a wide range of applications that require versatility and flexibility.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and secure mounting options, ensuring reliable operation even in demanding environments where vibration and other external factors may affect performance.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage of 1200 V, this IGBT can handle high voltage levels, making it ideal for power control applications that require robust and reliable performance.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high electrical conductivity and reliability, making it a suitable choice for the transistor element in this IGBT for efficient power control.

Maximum Collector Current (IC): 45 A

A maximum collector current of 45 A allows this IGBT to handle high power levels, making it suitable for demanding power control applications that require high current-carrying capacity.

Terminal Finish: MATTE TIN OVER NICKEL

The matte tin over nickel terminal finish provides corrosion resistance and ensures long-term reliability and stable performance in various operating conditions, enhancing the overall durability of the IGBT.

Terminal Position: SINGLE

Having a single terminal position simplifies the wiring and connections, making installation easier and reducing the chances of errors or malfunctions, ensuring a smooth operation in power control applications.

Case Connection: COLLECTOR

The case connection at the collector terminal enhances the thermal management of the IGBT, allowing for efficient heat dissipation and ensuring stable performance even in high-temperature environments.

Nominal Turn On Time (ton): 73 ns

The fast turn-on time of 73 ns improves the response time and efficiency of the IGBT, allowing for quick and precise power control operations in various applications that require rapid switching and high performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRG4PH50UDPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Additional Features:

ULTRA FAST

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN OVER NICKEL

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

570 ns

Nominal Turn On Time (ton):

73 ns

Trade Compliance

IRG4PH50UDPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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