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IKP08N65H5XKSA1

Infineon Technologies

IKP08N65H5XKSA1 by Infineon Technologies

IKP08N65H5XKSA1 by Infineon Technologies is an N-CHANNEL IGBT with 650V VCEsat, 18A IC, and 70W power dissipation. Ideal for POWER CONTROL applications due to its built-in diode, 130ns turn-off time, and -40 to 175°C operating temperature range.

Median Price

$0.932

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 500 parts In-Stock

1+ parts

$0.246

100+ parts

-

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500

$0.246

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Chip1Stop

Japan . 500 parts In-Stock

1+ parts

$0.866

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-

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500

$0.866

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Newark

USA . 205 parts In-Stock

1+ parts

$0.932

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-

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205

$0.932

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Farnell

UK . 308 parts In-Stock

1+ parts

$1.630

100+ parts

$1.010

1k+ parts

$0.716

10k+ parts

-

308

$1.630

$1.010

$0.716

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Mouser Electronics

USA . 380 parts In-Stock

1+ parts

$2.310

100+ parts

$1.320

1k+ parts

$0.775

10k+ parts

$0.758

380

$2.310

$1.320

$0.775

$0.758

Element14

Singapore . 400 parts In-Stock

1+ parts

$3.120

100+ parts

$1.900

1k+ parts

$1.470

10k+ parts

$1.450

400

$3.120

$1.900

$1.470

$1.450

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.556

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-

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500

-

$0.556

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 936 parts In-Stock

1+ parts

$0.748

100+ parts

-

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936

$0.748

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$1.415

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15

$1.415

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Vyrian

USA . 5,171 parts In-Stock

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5,171

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$0.310

100+ parts

$0.295

1k+ parts

$0.295

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1,000

$0.310

$0.295

$0.295

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Ampacity Inc.

Singapore . 189 parts In-Stock

1+ parts

$0.660

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189

$0.660

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Corphita

USA . 596 parts In-Stock

1+ parts

$0.708

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596

$0.708

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Semicontronic

India . 166 parts In-Stock

1+ parts

$0.730

100+ parts

$0.712

1k+ parts

$0.708

10k+ parts

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166

$0.730

$0.712

$0.708

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Modulus Dynamics

Lithuania . 21,856 parts In-Stock

1+ parts

$1.467

100+ parts

$1.408

1k+ parts

$1.350

10k+ parts

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21,856

$1.467

$1.408

$1.350

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Aztec Data Supply Inc.

USA . 199 parts In-Stock

1+ parts

$1.870

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199

$1.870

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Corohmni

South Africa . 98 parts In-Stock

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$1.982

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98

$1.982

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QUARKTWIN TECHNOLOGY LTD

USA . 19,871 parts In-Stock

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Microchip USA

USA . 9,933 parts In-Stock

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Continental Prestige Electronics

USA . 6,834 parts In-Stock

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6,834

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RC Electronics

USA . 6,750 parts In-Stock

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$1.360

1k+ parts

$1.280

10k+ parts

$1.250

6,750

-

$1.360

$1.280

$1.250

Perfect Parts

USA . 3,444 parts In-Stock

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3,444

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iodParts Technologies Inc.

India . 3,444 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 848 parts In-Stock

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848

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$1.387

1k+ parts

$1.344

10k+ parts

$1.316

500

-

$1.387

$1.344

$1.316

Overview

Unlock the power of efficient energy control with the IKP08N65H5XKSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are designed for power control applications. With a maximum operating temperature of 175°C and a collector-emitter voltage of 650V, this N-channel transistor offers reliable performance and durability. Experience the benefits of fast turn-on and turn-off times, as well as a built-in diode for added convenience. Trust Infineon to provide you with the high-quality components you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the transistor, enhancing its durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower on-state voltage drops and faster switching speeds, making them suitable for high power applications.

Maximum VCEsat: 2.1 V

The low VCEsat of 2.1 V ensures efficient power control and minimal power loss in the transistor.

Nominal Turn Off Time (toff): 130 ns

The fast turn-off time of 130 ns allows for quick switching and response times in power control applications.

Maximum Power Dissipation (Abs): 70 W

With a high power dissipation of 70 W, this IGBT can handle significant power loads without overheating.

Maximum Collector-Emitter Voltage: 650 V

The high maximum collector-emitter voltage rating of 650 V makes this IGBT suitable for high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

The 20 V maximum gate-emitter voltage ensures safe and reliable operation of the transistor within the specified limits.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 175°C allows for use in various environmental conditions.

Maximum Collector Current (IC): 18 A

The high collector current rating of 18 A enables the transistor to handle large current loads with ease.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKP08N65H5XKSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

4.8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

130 ns

Nominal Turn On Time (ton):

16 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKP08N65H5XKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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