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FF1000R17IE4DB2BOSA1

Infineon Technologies

FF1000R17IE4DB2BOSA1 by Infineon Technologies

Infineon's FF1000R17IE4DB2BOSA1 IGBT features N-CHANNEL configuration with 2 elements, built-in diode, and thermistor. Ideal for power control applications with max VCEsat of 2.45V and max IC of 1390A. Operates in temp range -40 to 150°C, offering high power dissipation up to 6250W.

Median Price

$597.030

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$595.140

100+ parts

-

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-

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2

$595.140

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-

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Rochester

USA . 12 parts In-Stock

1+ parts

$597.030

100+ parts

$561.210

1k+ parts

$525.390

10k+ parts

-

12

$597.030

$561.210

$525.390

-

Verical

USA . 12 parts In-Stock

1+ parts

$812.288

100+ parts

$763.550

1k+ parts

$714.813

10k+ parts

-

12

$812.288

$763.550

$714.813

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 636 parts In-Stock

1+ parts

$645.126

100+ parts

-

1k+ parts

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636

$645.126

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-

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Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$984.955

100+ parts

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95

$984.955

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Vyrian

USA . 7,258 parts In-Stock

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7,258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 14,021 parts In-Stock

1+ parts

$0.478

100+ parts

$0.459

1k+ parts

$0.440

10k+ parts

-

14,021

$0.478

$0.459

$0.440

-

Aztec Data Supply Inc.

USA . 610 parts In-Stock

1+ parts

$0.560

100+ parts

-

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610

$0.560

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Corohmni

South Africa . 153 parts In-Stock

1+ parts

$1.617

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-

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153

$1.617

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AZTECH Wire

Italy . 231 parts In-Stock

1+ parts

$9.793

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231

$9.793

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Ampacity Inc.

Singapore . 9 parts In-Stock

1+ parts

$577.220

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9

$577.220

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Semicontronic

India . 9 parts In-Stock

1+ parts

$577.220

100+ parts

$562.790

1k+ parts

$559.903

10k+ parts

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9

$577.220

$562.790

$559.903

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Corphita

USA . 29 parts In-Stock

1+ parts

$611.172

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29

$611.172

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Component Stockers USA

USA . 23 parts In-Stock

1+ parts

$722.410

100+ parts

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23

$722.410

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Continental Prestige Electronics

USA . 6,158 parts In-Stock

1+ parts

$984.955

100+ parts

-

1k+ parts

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10k+ parts

$965.256

6,158

$984.955

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-

$965.256

Argo Parts USA

USA . 1,895 parts In-Stock

1+ parts

$984.955

100+ parts

$975.105

1k+ parts

$965.256

10k+ parts

$955.406

1,895

$984.955

$975.105

$965.256

$955.406

Overview

Looking for a reliable power control solution? Look no further than the FF1000R17IE4DB2BOSA1 from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With its N-CHANNEL configuration and innovative design featuring 2 elements with built-in diode and thermistor, this transistor offers superior performance and efficiency. Trust Infineon to provide you with a product that not only meets but exceeds your expectations, providing you with the power and reliability you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent insulation and protection for the components inside, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers efficient power control and high performance in a variety of applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Simplifies circuit design and allows for precise control over power distribution, enhancing overall system efficiency.

Transistor Application: POWER CONTROL

Ideal for managing and regulating power in industrial and electronic systems with high-power requirements.

Maximum VCEsat: 2.45 V

Low saturation voltage results in minimal power loss and heat generation, improving energy efficiency.

Package Shape: RECTANGULAR

Streamlined design facilitates easy installation and integration into existing setups.

No. of Elements: 2

Dual elements provide redundancy and added capacity for handling high current loads.

Nominal Turn Off Time (toff): 1400 ns

Fast turn-off time ensures quick response and precise control over power output.

No. of Terminals: 12

Sufficient terminals for connectivity and flexibility in circuit configurations.

Maximum Power Dissipation (Abs): 6250 W

High power dissipation capability allows for heavy-duty applications and continuous operation.

Package Style (Meter): FLANGE MOUNT

Enables secure and stable mounting for robust performance in demanding environments.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures reliable performance in varying environmental conditions.

Maximum Collector-Emitter Voltage: 1700 V

High voltage tolerance makes this component suitable for high-voltage applications.

Transistor Element Material: SILICON

Silicon offers superior electronic properties for enhanced performance and reliability.

Maximum Gate-Emitter Voltage: 20 V

Wide gate-emitter voltage range allows for precise control and modulation of power flow.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, making it suitable for use in cold environments or industrial applications.

Maximum Collector Current (IC): 1390 A

High current carrying capacity allows for efficient power handling and distribution.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Threshold voltage ensures optimal switching characteristics and performance.

Terminal Position: UPPER

Convenient terminal position for easy access and connectivity in circuit layouts.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference in operation.

Nominal Turn On Time (ton): 760 ns

Fast turn-on time enables rapid activation and control of power flow for efficient operation.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF1000R17IE4DB2BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PUFM-X12

No. of Elements:

2

No. of Terminals:

12

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1400 ns

Nominal Turn On Time (ton):

760 ns

Maximum VCEsat:

2.45 V

Trade Compliance

FF1000R17IE4DB2BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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