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FF1000R17IE4DPB2BOSA1

Infineon Technologies

FF1000R17IE4DPB2BOSA1 by Infineon Technologies

FF1000R17IE4DPB2BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 1700V max collector-emitter voltage. It features a series connected, center tap configuration with 2 elements and built-in diode for power control applications. This UL approved transistor has a nominal turn off time of 1910ns and turn on time of 830ns, making it ideal for high-power switching operations.

Median Price

$745.237

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34 parts In-Stock

1+ parts

$596.190

100+ parts

$560.420

1k+ parts

$524.650

10k+ parts

-

34

$596.190

$560.420

$524.650

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Verical

USA . 33 parts In-Stock

1+ parts

$745.237

100+ parts

$700.525

1k+ parts

$655.813

10k+ parts

-

33

$745.237

$700.525

$655.813

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DigiKey

USA . 64 parts In-Stock

1+ parts

$745.240

100+ parts

-

1k+ parts

-

10k+ parts

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64

$745.240

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-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 237 parts In-Stock

1+ parts

$732.004

100+ parts

-

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237

$732.004

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-

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Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$801.896

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-

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38

$801.896

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Vyrian

USA . 2,156 parts In-Stock

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2,156

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Distributors (Availability)

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Corohmni

South Africa . 264 parts In-Stock

1+ parts

$0.628

100+ parts

-

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-

10k+ parts

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264

$0.628

-

-

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Aztec Data Supply Inc.

USA . 23,594 parts In-Stock

1+ parts

$0.640

100+ parts

-

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23,594

$0.640

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Modulus Dynamics

Lithuania . 7,753 parts In-Stock

1+ parts

$1.693

100+ parts

$1.625

1k+ parts

$1.558

10k+ parts

-

7,753

$1.693

$1.625

$1.558

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AZTECH Wire

Italy . 776 parts In-Stock

1+ parts

$16.285

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776

$16.285

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$654.950

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1

$654.950

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Corphita

USA . 779 parts In-Stock

1+ parts

$693.477

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779

$693.477

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Microchip USA

USA . 2,012 parts In-Stock

1+ parts

$798.410

100+ parts

$798.410

1k+ parts

$798.410

10k+ parts

$798.410

2,012

$798.410

$798.410

$798.410

$798.410

Continental Prestige Electronics

USA . 1,817 parts In-Stock

1+ parts

$801.896

100+ parts

-

1k+ parts

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10k+ parts

$785.858

1,817

$801.896

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-

$785.858

Argo Parts USA

USA . 1,469 parts In-Stock

1+ parts

$801.896

100+ parts

$793.877

1k+ parts

$785.858

10k+ parts

$777.839

1,469

$801.896

$793.877

$785.858

$777.839

Netroflash

USA . 500 parts In-Stock

1+ parts

$801.896

100+ parts

$785.858

1k+ parts

-

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500

$801.896

$785.858

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QUARKTWIN TECHNOLOGY LTD

USA . 10,796 parts In-Stock

1+ parts

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10,796

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of advanced technology with the FF1000R17IE4DPB2BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT). Ideal for power control applications, this N-channel transistor offers a series connected, center tap configuration with built-in diode and thermistor, allowing for efficient performance and easy installation. Experience the benefits of fast turn-on and turn-off times, high voltage tolerance, and UL approval, making it a valuable choice for your electronic needs. Elevate your projects with the FF1000R17IE4DPB2BOSA1 and unleash its full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the components inside, making it a durable and reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-channel type allows for efficient power control, making this IGBT suitable for a variety of industrial applications requiring high power handling capabilities.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

This complex configuration offers enhanced performance and functionality, making it ideal for demanding power control applications where precision and reliability are crucial.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, this IGBT provides precise and efficient control over high power levels, making it a suitable choice for demanding industrial environments.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and installation, making it convenient to integrate this IGBT into existing systems or designs.

No. of Elements: 2

With two elements in the package, this IGBT offers increased power handling capacity and redundancy, ensuring reliable operation under heavy load conditions.

Nominal Turn Off Time (toff): 1910 ns

The fast turn-off time of 1910 ns allows for quick power switching, reducing heat generation and improving efficiency in power control applications.

No. of Terminals: 12

The 12 terminals provide ample connection points for easy integration into complex power control systems, offering flexibility and versatility in design and installation.

Package Style (Meter): FLANGE MOUNT

The flange mount style allows for secure attachment to a mounting surface, providing stability and heat dissipation for optimal performance in power control applications.

Maximum Collector-Emitter Voltage: 1700 V

With a high maximum collector-emitter voltage of 1700 V, this IGBT is capable of handling high power levels safely, making it suitable for a wide range of industrial applications.

Transistor Element Material: SILICON

The use of silicon as the transistor element material ensures high performance and reliability, making this IGBT a durable and long-lasting choice for power control applications.

Minimum Operating Temperature: -40 °C

The IGBT's ability to operate at temperatures as low as -40°C ensures reliable performance in harsh environmental conditions, making it a versatile and dependable choice for various industrial applications.

Terminal Position: UPPER

The upper terminal position allows for easy access and connection, simplifying installation and maintenance procedures for improved efficiency in power control applications.

Case Connection: ISOLATED

The isolated case connection provides electrical insulation and protection, reducing the risk of short circuits and ensuring safe operation in power control systems.

Nominal Turn On Time (ton): 830 ns

The fast turn-on time of 830 ns enables quick power activation, enhancing responsiveness and control in power control applications for improved performance and efficiency.

Reference Standard: UL APPROVED

Being UL approved, this IGBT meets stringent safety and quality standards, ensuring reliable and compliant operation in a variety of industrial applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF1000R17IE4DPB2BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1700 V

JESD-30 Code:

R-PUFM-X12

No. of Elements:

2

No. of Terminals:

12

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL APPROVED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1910 ns

Nominal Turn On Time (ton):

830 ns

Trade Compliance

FF1000R17IE4DPB2BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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