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FF100R12RT4

Infineon Technologies

FF100R12RT4 by Infineon Technologies

Infineon FF100R12RT4 is a N-CHANNEL IGBT with 2 SERIES CONNECTED elements. It has a VCEsat of 2.15V and can handle up to 100A IC. Ideal for POWER CONTROL applications, this IGBT operates at a max temp of 175°C and features a built-in diode.

Median Price

$85.040

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 177 parts In-Stock

1+ parts

$85.040

100+ parts

$83.290

1k+ parts

-

10k+ parts

$83.250

177

$85.040

$83.290

-

$83.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 802 parts In-Stock

1+ parts

$80.788

100+ parts

-

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-

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802

$80.788

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Vyrian

USA . 297 parts In-Stock

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$85.040

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-

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297

$85.040

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Forefront Electronics and Design

USA . 4 parts In-Stock

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$98.000

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4

$98.000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 10,862 parts In-Stock

1+ parts

$1.741

100+ parts

$1.671

1k+ parts

$1.602

10k+ parts

-

10,862

$1.741

$1.671

$1.602

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Native Components

USA . 544 parts In-Stock

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$15.230

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-

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544

$15.230

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Northwest PG Solutions

USA . 2,094 parts In-Stock

1+ parts

$16.753

100+ parts

$15.078

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2,094

$16.753

$15.078

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Corphita

USA . 546 parts In-Stock

1+ parts

$76.536

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546

$76.536

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A-Z Elektronik GmbH

Germany . 9,505 parts In-Stock

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9,505

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Alle Elektronik GmbH

Germany . 4,356 parts In-Stock

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4,356

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Perfect Parts

USA . 730 parts In-Stock

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730

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Metaverse IC Inc.

Canada . 285 parts In-Stock

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285

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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Overview

Unleash the power of the FF100R12RT4 by Infineon Technologies, a top-quality Insulated Gate Bipolar Transistor (IGBT) that sets the standard for power control applications. With its innovative design featuring 2 series-connected elements with built-in diodes, this N-channel transistor offers unmatched performance and reliability. Experience seamless power management with a maximum collector-emitter voltage of 1200V and a maximum collector current of 100A. Trust in Infineon Technologies to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the FF100R12RT4 and unlock a world of possibilities.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher efficiency compared to P-channel IGBTs, making this product a good choice for power control applications.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for efficient power control and ensures reliable performance in series connected applications with built-in diode for reverse voltage protection.

Maximum VCEsat: 2.15 V

Low VCEsat value results in lower power dissipation and higher efficiency in power control applications.

Maximum Power Dissipation (Abs): 555 W

High maximum power dissipation allows for handling high power levels, making this product suitable for demanding applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage, this IGBT can be used in applications that require high voltage handling capabilities.

Maximum Collector Current (IC): 100 A

The high maximum collector current rating enables the IGBT to handle large current levels, making it suitable for high-power applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FF100R12RT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X5

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

5

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

490 ns

Nominal Turn On Time (ton):

185 ns

Maximum VCEsat:

2.15 V

Trade Compliance

FF100R12RT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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