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APT50GP60JDQ2

Microchip Technology

APT50GP60JDQ2 by Microchip Technology

APT50GP60JDQ2 by Microchip Technology is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and a max collector current of 100A. It is designed for power control applications, featuring a nominal turn off time of 200ns and a nominal turn on time of 55ns. The transistor comes in a rectangular package style with flange mount, making it suitable for high-power operations up to 329W at temperatures up to 150°C.

Median Price

$28.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$28.700

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VNN

France . 750 parts In-Stock

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750

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Vyrian

USA . 167 parts In-Stock

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AZTECH Wire

Italy . 822 parts In-Stock

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$15.992

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Continental Prestige Electronics

USA . 6,397 parts In-Stock

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$28.700

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$28.126

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Ampacity Inc.

Singapore . 1,509 parts In-Stock

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$43.050

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Microchip USA

USA . 5,337 parts In-Stock

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$74.566

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Argo Parts USA

USA . 4,832 parts In-Stock

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4,832

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Fulton Briggs Corp.

USA . 333 parts In-Stock

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333

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Overview

Boost the performance of your power control applications with the APT50GP60JDQ2 by Microchip Technology. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, thanks to its N-CHANNEL configuration and built-in diode. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of just 200ns, this transistor is perfect for high-power tasks. Whether you're working on industrial equipment or renewable energy systems, the APT50GP60JDQ2 provides the efficiency and durability you need to succeed. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the transistor, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type allows for efficient power control and high performance in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves overall efficiency of power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, making it ideal for controlling high power loads with precision.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into various electronic systems.

Nominal Turn Off Time (toff): 200 ns

Fast turn off time ensures quick response and efficient power control in dynamic systems.

No. of Terminals: 4

Having 4 terminals provides flexibility in circuit design and connectivity options.

Maximum Power Dissipation (Abs): 329 W

High power dissipation capability allows for handling large power loads without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers secure mounting and heat dissipation in electronic systems.

Maximum Operating Temperature: 150 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows for handling high voltage applications with safety and reliability.

Transistor Element Material: SILICON

Silicon material offers high performance and durability in electronic components, ensuring long-term reliability.

Maximum Gate-Emitter Voltage: 30 V

High gate-emitter voltage rating provides sufficient headroom for voltage spikes and fluctuations in the circuit.

Maximum Collector Current (IC): 100 A

High collector current rating allows for handling large current flows in power control applications with efficiency.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: UPPER

Upper terminal position allows for easy access and connection in circuit layouts.

Case Connection: ISOLATED

Isolated case connection ensures safety and protection against electrical shorts or interference in the circuit.

Nominal Turn On Time (ton): 55 ns

Fast turn on time ensures quick response and efficient power control in dynamic systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) APT50GP60JDQ2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Microchip Technology

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Voltage:

30 V

JESD-30 Code:

R-PUFM-X4

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

200 ns

Nominal Turn On Time (ton):

55 ns

Trade Compliance

APT50GP60JDQ2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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