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FP75R12KE3BOSA1

Infineon Technologies

FP75R12KE3BOSA1 by Infineon Technologies

FP75R12KE3BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements and a max collector-emitter voltage of 1200V. It has a nominal turn-off time of 610ns and a max collector current of 105A, making it suitable for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$132.541

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 23 parts In-Stock

1+ parts

$102.090

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-

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23

$102.090

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Chip1Stop

Japan . 10 parts In-Stock

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$161.000

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10

$161.000

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Verical

USA . 10 parts In-Stock

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$169.932

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10

$169.932

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Arrow

USA . 10 parts In-Stock

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$132.541

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10

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$132.541

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Rochester

USA . 5 parts In-Stock

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$84.740

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$75.820

10k+ parts

$71.360

5

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$84.740

$75.820

$71.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 950 parts In-Stock

1+ parts

$106.020

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950

$106.020

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TodayComponents

USA . 100 parts In-Stock

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$175.230

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$158.400

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100

$175.230

$158.400

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Nova Conductors

Japan . 50 parts In-Stock

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$186.065

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50

$186.065

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Vyrian

USA . 5,402 parts In-Stock

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5,402

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Chip Stock

USA . 131 parts In-Stock

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131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 47 parts In-Stock

1+ parts

$1.011

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47

$1.011

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Modulus Dynamics

Lithuania . 5,803 parts In-Stock

1+ parts

$1.532

100+ parts

$1.471

1k+ parts

$1.409

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5,803

$1.532

$1.471

$1.409

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Aztec Data Supply Inc.

USA . 320 parts In-Stock

1+ parts

$1.730

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320

$1.730

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AZTECH Wire

Italy . 416 parts In-Stock

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$9.950

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416

$9.950

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Ampacity Inc.

Singapore . 11 parts In-Stock

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$94.860

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11

$94.860

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Semicontronic

India . 11 parts In-Stock

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$94.860

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$92.488

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$92.014

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11

$94.860

$92.488

$92.014

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Corphita

USA . 869 parts In-Stock

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$100.440

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869

$100.440

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$186.065

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$176.762

10k+ parts

$173.040

2,000

$186.065

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$176.762

$173.040

Continental Prestige Electronics

USA . 657 parts In-Stock

1+ parts

$186.065

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$182.344

657

$186.065

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$182.344

QUARKTWIN TECHNOLOGY LTD

USA . 23,772 parts In-Stock

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Microchip USA

USA . 10,968 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Argo Parts USA

USA . 2,196 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unleash the power of cutting-edge technology with the FP75R12KE3BOSA1 from Infineon Technologies. As a leader in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. With a complex configuration and N-CHANNEL polarity, this product offers unparalleled performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, the FP75R12KE3BOSA1 provides maximum efficiency and durability for all your applications. Trust in Infineon to bring you the best in semiconductor solutions.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel IGBTs, making them more efficient in many applications.

Configuration: COMPLEX

Complex configuration allows for more precise control over the switching characteristics of the IGBT, resulting in improved performance and efficiency.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and connection, making it suitable for various industrial applications.

Nominal Turn Off Time (toff): 610 ns

Faster turn-off time helps in reducing losses and improving the overall efficiency of the IGBT.

No. of Terminals: 35

Higher number of terminals allow for more connections and control options, making it versatile for diverse applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for use in high voltage applications, enhancing versatility.

Transistor Element Material: SILICON

Silicon is a reliable and widely used material for transistor elements, providing good performance and longevity.

Maximum Collector Current (IC): 105 A

High collector current rating enables the IGBT to handle high power applications with ease.

Terminal Position: UPPER

Upper terminal position helps in easier mounting and connection, enhancing user-friendliness.

Case Connection: ISOLATED

Isolated case connection ensures safety and protection against electrical hazards.

Nominal Turn On Time (ton): 330 ns

Fast turn-on time improves the switching speed and efficiency of the IGBT, making it suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP75R12KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

330 ns

Trade Compliance

FP75R12KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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