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IRGP4650D-EPBF

Infineon Technologies

IRGP4650D-EPBF by Infineon Technologies

IRGP4650D-EPBF by Infineon Technologies is an N-CHANNEL IGBT with 42ns rise time, 54ns fall time, and 268W power dissipation. It operates at a max temp of 175°C and has a collector-emitter voltage of 600V. Ideal for high-power applications requiring fast switching capabilities.

Median Price

$4.820

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,489 parts In-Stock

1+ parts

-

100+ parts

$4.820

1k+ parts

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14,489

-

$4.820

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Rochester

USA . 14,146 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

14,146

-

$4.170

$3.730

$3.510

Verical

USA . 14,146 parts In-Stock

1+ parts

-

100+ parts

$5.213

1k+ parts

$4.662

10k+ parts

$4.388

14,146

-

$5.213

$4.662

$4.388

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.382

100+ parts

-

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100

$4.382

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-

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Digiode

USA . 592 parts In-Stock

1+ parts

$4.398

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-

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592

$4.398

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DigiKey Marketplace

USA . 14,489 parts In-Stock

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14,489

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Vyrian

USA . 14,289 parts In-Stock

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14,289

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Ashlea Components Ltd

UK . 309 parts In-Stock

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309

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,545 parts In-Stock

1+ parts

$0.359

100+ parts

-

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3,545

$0.359

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Corohmni

South Africa . 62 parts In-Stock

1+ parts

$0.848

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-

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62

$0.848

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Modulus Dynamics

Lithuania . 24,922 parts In-Stock

1+ parts

$1.112

100+ parts

$1.068

1k+ parts

$1.023

10k+ parts

-

24,922

$1.112

$1.068

$1.023

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$1.827

100+ parts

$1.663

1k+ parts

$1.498

10k+ parts

-

2,000

$1.827

$1.663

$1.498

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Ampacity Inc.

Singapore . 14,175 parts In-Stock

1+ parts

$3.940

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14,175

$3.940

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Semicontronic

India . 14,126 parts In-Stock

1+ parts

$3.940

100+ parts

$3.842

1k+ parts

$3.822

10k+ parts

-

14,126

$3.940

$3.842

$3.822

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Corphita

USA . 934 parts In-Stock

1+ parts

$4.167

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934

$4.167

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Continental Prestige Electronics

USA . 3,834 parts In-Stock

1+ parts

$4.382

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$4.294

3,834

$4.382

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$4.294

Argo Parts USA

USA . 3,254 parts In-Stock

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$4.382

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3,254

$4.382

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Netroflash

USA . 2,000 parts In-Stock

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$4.382

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2,000

$4.382

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QUARKTWIN TECHNOLOGY LTD

USA . 16,855 parts In-Stock

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16,855

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Microchip USA

USA . 10,692 parts In-Stock

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10,692

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A-Z Elektronik GmbH

Germany . 2,631 parts In-Stock

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2,631

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Lixinc

USA . 2,118 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,904 parts In-Stock

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1,904

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Alle Elektronik GmbH

Germany . 1,754 parts In-Stock

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1,754

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Metaverse IC Inc.

Canada . 300 parts In-Stock

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300

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Overview

Unlock the power of cutting-edge technology with the IRGP4650D-EPBF by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that provide superior performance and reliability. Ideal for a wide range of applications, this N-CHANNEL IGBT offers maximum power dissipation, high operating temperature, and exceptional collector-emitter voltage. Experience the value and benefits of Infineon's IRGP4650D-EPBF, where innovation meets excellence. Elevate your projects with this advanced solution today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them ideal for high power applications.

Maximum Rise Time (tr): 42 ns

The low rise time ensures quick switching of the transistor, leading to reduced power loss and improved efficiency.

Maximum Fall Time (tf): 54 ns

The fast fall time allows for efficient operation and minimizes switching losses, enhancing the overall performance of the IGBT.

Maximum Power Dissipation (Abs): 268 W

With a high power dissipation rating, this IGBT can handle significant amounts of power without overheating, ensuring reliability in demanding applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating allows the IGBT to operate in harsh environments without compromising performance, making it suitable for a wide range of industrial applications.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating enables the IGBT to handle high voltage levels, making it suitable for power electronics applications.

Maximum Gate-Emitter Voltage: 20 V

The gate-emitter voltage rating ensures reliable and consistent switching of the IGBT, maintaining stability in operation.

Maximum Collector Current (IC): 76 A

With a high collector current rating, this IGBT can handle large currents, making it suitable for high-power applications where high current levels are required.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The gate-emitter threshold voltage ensures proper turn-on and turn-off characteristics of the IGBT, enhancing its reliability and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGP4650D-EPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

54 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

42 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

IRGP4650D-EPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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