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IRGP4266DPBF

Infineon Technologies

IRGP4266DPBF by Infineon Technologies

Infineon's IRGP4266DPBF is an N-CHANNEL IGBT with tr of 90ns and tf of 80ns. It boasts a max power dissipation of 455W, ideal for high-power applications. With Vce(max) at 650V and Ic(max) at 140A, it's suitable for industrial motor drives and renewable energy systems.

Median Price

$9.475

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$11.930

100+ parts

$9.090

1k+ parts

$8.230

10k+ parts

$7.020

3

$11.930

$9.090

$8.230

$7.020

Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$7.020

1k+ parts

$6.280

10k+ parts

$5.910

38

-

$7.020

$6.280

$5.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 347 parts In-Stock

1+ parts

$7.420

100+ parts

-

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347

$7.420

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$8.048

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-

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68

$8.048

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Chip Stock

USA . 466 parts In-Stock

1+ parts

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466

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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25

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Vyrian

USA . 21 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$1.558

100+ parts

$1.418

1k+ parts

$1.278

10k+ parts

-

100

$1.558

$1.418

$1.278

-

Ampacity Inc.

Singapore . 21 parts In-Stock

1+ parts

$6.640

100+ parts

-

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21

$6.640

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Semicontronic

India . 21 parts In-Stock

1+ parts

$6.640

100+ parts

$6.474

1k+ parts

$6.441

10k+ parts

-

21

$6.640

$6.474

$6.441

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Corphita

USA . 816 parts In-Stock

1+ parts

$7.029

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-

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816

$7.029

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Modulus Dynamics

Lithuania . 3,557 parts In-Stock

1+ parts

$7.072

100+ parts

$6.789

1k+ parts

$6.506

10k+ parts

-

3,557

$7.072

$6.789

$6.506

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Corohmni

South Africa . 376 parts In-Stock

1+ parts

$7.072

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376

$7.072

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Continental Prestige Electronics

USA . 830 parts In-Stock

1+ parts

$8.048

100+ parts

-

1k+ parts

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10k+ parts

$7.887

830

$8.048

-

-

$7.887

AZTECH Wire

Italy . 302 parts In-Stock

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$14.111

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302

$14.111

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QUARKTWIN TECHNOLOGY LTD

USA . 29,651 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,123 parts In-Stock

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Microchip USA

USA . 5,047 parts In-Stock

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5,047

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Argo Parts USA

USA . 4,806 parts In-Stock

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4,806

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Alle Elektronik GmbH

Germany . 3,415 parts In-Stock

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3,415

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Perfect Parts

USA . 672 parts In-Stock

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672

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$7.887

1k+ parts

$7.646

10k+ parts

$7.485

500

-

$7.887

$7.646

$7.485

Overview

Unleash the power of the IRGP4266DPBF by Infineon Technologies, a leading manufacturer known for superior quality and innovation in Insulated Gate Bipolar Transistors (IGBT). Perfect for applications requiring high efficiency and reliability, this N-CHANNEL transistor offers maximum power dissipation of 455W and a maximum collector-emitter voltage of 650V. With quick rise and fall times of 90ns and 80ns respectively, this product excels in demanding environments. Elevate your projects with Infineon's IRGP4266DPBF and experience unmatched performance and durability.

Feature Benefit Bullets

Maximum Rise Time (tr) 90 ns

Faster rise time allows for quicker response and accurate switching performance in high-frequency applications.

Maximum Fall Time (tf) 80 ns

Fast fall time ensures efficient turn-off speed, reducing switching losses and improving overall efficiency.

Maximum Power Dissipation (Abs) 455 W

High power dissipation capability enables this IGBT to handle high power levels without overheating, making it suitable for demanding applications.

Maximum Operating Temperature 175 °C

With a high maximum operating temperature, this IGBT can withstand extreme conditions and maintain reliable performance in harsh environments.

Maximum Collector-Emitter Voltage 650 V

High collector-emitter voltage rating allows for operation in high voltage circuits without the risk of breakdown, ensuring safety and reliability in the application.

Maximum Gate-Emitter Voltage 20 V

The maximum gate-emitter voltage rating provides a safe operating margin and protection against voltage spikes, ensuring the longevity of the IGBT.

Maximum Collector Current (IC) 140 A

High collector current rating allows for handling large currents, making this IGBT suitable for high-power applications where current flow is significant.

Maximum Gate-Emitter Threshold Voltage 7.7 V

The gate-emitter threshold voltage specifies the minimum voltage required to turn on the IGBT, providing precise control and efficient switching in various applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IRGP4266DPBF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Fall Time (tf):

80 ns

Maximum Gate-Emitter Threshold Voltage:

7.7 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Rise Time (tr):

90 ns

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

IRGP4266DPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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