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SGL50N60RUFDTU

Onsemi

SGL50N60RUFDTU by Onsemi

SGL50N60RUFDTU by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 600V and a max collector current of 80A. It is designed for MOTOR CONTROL applications, featuring a single configuration with built-in diode. With a package style of FLANGE MOUNT and terminal form THROUGH-HOLE, it offers fast switching times with turn-off time of 329ns and fall time of 160ns.

Median Price

$6.250

Lifecycle Status

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7

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1k+

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Rochester

USA . 220 parts In-Stock

1+ parts

-

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$5.400

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$4.830

10k+ parts

$4.540

220

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$5.400

$4.830

$4.540

Verical

USA . 220 parts In-Stock

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$7.100

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$7.100

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Digiode

USA . 2,207 parts In-Stock

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$5.719

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$5.719

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Nova Conductors

Japan . 50 parts In-Stock

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$6.655

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$6.655

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Vyrian

USA . 5,298 parts In-Stock

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Chip Stock

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Sensible Micro Corp

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Aztec Data Supply Inc.

USA . 1,370 parts In-Stock

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$1.900

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-

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1,370

$1.900

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Semicontronic

India . 220 parts In-Stock

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$5.120

100+ parts

$4.992

1k+ parts

$4.966

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-

220

$5.120

$4.992

$4.966

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Decca Corp

Germany . 80 parts In-Stock

1+ parts

$5.120

100+ parts

$5.018

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$4.967

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80

$5.120

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$4.967

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Corphita

USA . 2,157 parts In-Stock

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$5.418

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$5.418

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Corohmni

South Africa . 57 parts In-Stock

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$6.020

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57

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Continental Prestige Electronics

USA . 2,380 parts In-Stock

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$6.655

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$6.522

2,380

$6.655

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$6.522

Netroflash

USA . 50 parts In-Stock

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$6.655

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$6.322

10k+ parts

$6.189

50

$6.655

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$6.322

$6.189

Andel Nordic

Denmark . 3,721 parts In-Stock

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$7.009

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$6.728

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$6.728

3,721

$7.009

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$6.728

$6.728

Advanced Electronics

New Zealand . 19 parts In-Stock

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$7.720

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$7.102

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$6.655

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19

$7.720

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$6.655

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Ampacity Inc.

Singapore . 220 parts In-Stock

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$11.140

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AZTECH Wire

Italy . 850 parts In-Stock

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Lixinc

USA . 11,888 parts In-Stock

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TANS Electronics

Latvia . 7,085 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

Mexico . 3,178 parts In-Stock

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Supply Digital

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Kulean Microsystems

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Argo Parts USA

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Kepictronics

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UHIMA Technologies

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Microchip USA

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Overview

Unlock the potential of your motor control applications with the SGL50N60RUFDTU by Onsemi. This high-quality N-CHANNEL IGBT offers superior performance and reliability, making it the perfect choice for demanding industrial environments. With a maximum operating temperature of 150°C and a maximum collector-emitter voltage of 600V, this transistor ensures efficient power management and precise control. Trust Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your systems today and experience the benefits of top-notch quality and performance with the SGL50N60RUFDTU.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable performance and protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel design allows for lower conduction losses and higher efficiency, making it ideal for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances the overall efficiency of controlling motors.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and reliability in this specific use case.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate into different systems and applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy installation, enhancing the overall reliability of the transistor.

Maximum Fall Time (tf): 160 ns

Fast fall time allows for quick switching and efficient operation, improving overall performance in motor control applications.

Nominal Turn Off Time (toff): 329 ns

The nominal turn-off time ensures precise control and timing in motor control operations for reliable performance.

No. of Terminals: 3

Having 3 terminals allows for simple connectivity and integration into various motor control circuits.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capacity enables the transistor to handle heavy loads and sudden surges without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides stability and easy mounting options for secure placement in motor control systems.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the transistor can withstand heat and operate efficiently even in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating offers versatility and allows for use in a wide range of motor control applications.

Transistor Element Material: SILICON

Silicon construction ensures reliable performance, stability, and durability over an extended lifespan.

Maximum Gate-Emitter Voltage: 20 V

High gate-emitter voltage rating enhances the transistor's reliability and performance in motor control applications.

Maximum Collector Current (IC): 80 A

The high collector current rating allows the transistor to handle heavy loads and high-power applications effectively.

Maximum Gate-Emitter Threshold Voltage: 8 V

The gate-emitter threshold voltage ensures precise control and reliable operation in motor control circuits.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures secure and reliable connections for long-term performance.

Terminal Position: SINGLE

Single terminal positioning simplifies installation and connectivity, making it easy to incorporate the transistor into different systems.

Nominal Turn On Time (ton): 119 ns

Fast turn-on time enables quick response and precise control in motor control operations, enhancing overall efficiency and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) SGL50N60RUFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS, HIGH SPEED SWITCHING

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

160 ns

Maximum Gate-Emitter Threshold Voltage:

8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-264AA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

329 ns

Nominal Turn On Time (ton):

119 ns

Trade Compliance

SGL50N60RUFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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