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FGH60N60SFTU

Onsemi

FGH60N60SFTU by Onsemi

FGH60N60SFTU by Onsemi is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max power dissipation of 378W. It has a nominal turn-off time of 187ns, making it ideal for power control applications requiring fast switching speeds. The package style is flange mount with through-hole terminals, suitable for high-power applications in industrial settings.

Median Price

$4.132

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 219 parts In-Stock

1+ parts

$6.560

100+ parts

$4.460

1k+ parts

$3.390

10k+ parts

$3.060

219

$6.560

$4.460

$3.390

$3.060

Rochester

USA . 40,067 parts In-Stock

1+ parts

-

100+ parts

$3.220

1k+ parts

$2.880

10k+ parts

$2.710

40,067

-

$3.220

$2.880

$2.710

Verical

USA . 13,200 parts In-Stock

1+ parts

-

100+ parts

$4.025

1k+ parts

$3.600

10k+ parts

$3.388

13,200

-

$4.025

$3.600

$3.388

DigiKey

USA . 9,688 parts In-Stock

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$4.240

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9,688

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$4.240

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Distributors (In-Stock)

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Digiode

USA . 3,210 parts In-Stock

1+ parts

$3.392

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-

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3,210

$3.392

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Nova Conductors

Japan . 10 parts In-Stock

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$3.392

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-

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10

$3.392

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Vyrian

USA . 16,434 parts In-Stock

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16,434

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DigiKey Marketplace

USA . 9,888 parts In-Stock

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9,888

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ComSIT Distribution GmbH

Germany . 158 parts In-Stock

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158

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ComSIT USA

USA . 158 parts In-Stock

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158

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$1.093

100+ parts

-

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1,000

$1.093

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Ampacity Inc.

Singapore . 16,627 parts In-Stock

1+ parts

$3.030

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16,627

$3.030

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Corphita

USA . 674 parts In-Stock

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$3.213

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674

$3.213

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Corohmni

South Africa . 90 parts In-Stock

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$3.258

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90

$3.258

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Argo Parts USA

USA . 2,613 parts In-Stock

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$3.392

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2,613

$3.392

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QUARKTWIN TECHNOLOGY LTD

USA . 10,459 parts In-Stock

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10,459

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Continental Prestige Electronics

USA . 9,888 parts In-Stock

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$3.520

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9,888

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$3.520

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SupplyDigital Components

Austria . 7,876 parts In-Stock

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7,876

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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TANS Electronics

Latvia . 3,578 parts In-Stock

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Lixinc

USA . 2,855 parts In-Stock

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Problanco Electronics

Mexico . 2,458 parts In-Stock

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Kulean Microsystems

USA . 1,623 parts In-Stock

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Perfect Parts

USA . 1,512 parts In-Stock

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Supply Digital

USA . 829 parts In-Stock

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829

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Metaverse IC Inc.

Canada . 428 parts In-Stock

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UHIMA Technologies

Türkiye . 238 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$3.325

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$3.223

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$3.155

50

-

$3.325

$3.223

$3.155

Overview

Unleash the power of your electronics with the FGH60N60SFTU by Onsemi. Crafted with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance in power control applications. With a maximum collector-emitter voltage of 600V and a maximum gate-emitter threshold voltage of 6.5V, this N-CHANNEL transistor is designed to optimize efficiency and reliability. Whether you're looking to enhance the performance of your power systems or boost the capabilities of your electronic devices, the FGH60N60SFTU delivers exceptional value and unmatched benefits to meet your needs. Experience the difference with Onsemi - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for easier control and higher efficiency in power applications.

Maximum Power Dissipation (Abs): 378 W

High power dissipation capability ensures the product can handle heavy loads without overheating.

Maximum Collector-Emitter Voltage: 600 V

Allows for the handling of high voltage applications, increasing the versatility of the product.

Maximum Gate-Emitter Voltage: 20 V

Provides adequate voltage for gate control, allowing for precise switching in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH60N60SFTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Fall Time (tf):

62 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

187 ns

Nominal Turn On Time (ton):

66 ns

Trade Compliance

FGH60N60SFTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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