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FGH60T65SHD-F155

Onsemi

FGH60T65SHD-F155 by Onsemi

FGH60T65SHD-F155 by Onsemi is an N-CHANNEL IGBT with VCEsat of 2.1V and IC of 120A, ideal for POWER CONTROL applications. It has a toff of 165ns, ton of 85ns, and can operate at temperatures ranging from -55°C to 175°C.

Median Price

$6.020

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,530 parts In-Stock

1+ parts

$6.020

100+ parts

$3.416

1k+ parts

$2.422

10k+ parts

$2.349

1,530

$6.020

$3.416

$2.422

$2.349

Mouser Electronics

USA . 859 parts In-Stock

1+ parts

$6.020

100+ parts

$2.850

1k+ parts

$2.720

10k+ parts

-

859

$6.020

$2.850

$2.720

-

Chip1Stop

Japan . 280 parts In-Stock

1+ parts

$15.200

100+ parts

$6.830

1k+ parts

-

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-

280

$15.200

$6.830

-

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Verical

USA . 583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.638

10k+ parts

$2.475

583

-

-

$2.638

$2.475

Rochester

USA . 583 parts In-Stock

1+ parts

-

100+ parts

$2.360

1k+ parts

$2.110

10k+ parts

$1.980

583

-

$2.360

$2.110

$1.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,502 parts In-Stock

1+ parts

$4.836

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

$4.836

-

-

-

Vyrian

USA . 8,447 parts In-Stock

1+ parts

-

100+ parts

-

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8,447

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-

-

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Nova Conductors

Japan . 125 parts In-Stock

1+ parts

-

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-

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125

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-

-

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Flip Electronics

USA . 2 parts In-Stock

1+ parts

-

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-

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-

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2

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Sensible Micro Corp

USA . 2 parts In-Stock

1+ parts

-

100+ parts

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2

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-

-

-

Distributors (Availability)

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Ampacity Inc.

Singapore . 1,071 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,071

$2.070

-

-

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Corohmni

South Africa . 106 parts In-Stock

1+ parts

$2.440

100+ parts

-

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106

$2.440

-

-

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Corphita

USA . 698 parts In-Stock

1+ parts

$4.581

100+ parts

-

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698

$4.581

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Perfect Parts

USA . 170,066 parts In-Stock

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170,066

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Kepictronics

USA . 30,150 parts In-Stock

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30,150

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Futuretech Components

Singapore . 18,000 parts In-Stock

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18,000

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Microchip USA

USA . 10,358 parts In-Stock

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10,358

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Kulean Microsystems

USA . 8,007 parts In-Stock

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8,007

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-

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RC Electronics

USA . 7,928 parts In-Stock

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7,928

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-

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SupplyDigital Components

Austria . 2,495 parts In-Stock

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2,495

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Netroflash

USA . 2,050 parts In-Stock

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2,050

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Supply Digital

USA . 1,515 parts In-Stock

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1,515

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TANS Electronics

Latvia . 1,093 parts In-Stock

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1,093

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 410 parts In-Stock

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410

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Problanco Electronics

Mexico . 80 parts In-Stock

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80

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UHIMA Technologies

Türkiye . 8 parts In-Stock

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8

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Overview

Unleash the power of innovation with the FGH60T65SHD-F155 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in the category of Insulated Gate Bipolar Transistors (IGBT). This product offers unparalleled performance in power control applications, with a single configuration featuring a built-in diode. With a maximum collector-emitter voltage of 650V and a maximum operating temperature of 175°C, this IGBT ensures optimal efficiency and durability. Experience the value and benefits of superior technology with the FGH60T65SHD-F155 by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IGBT, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically offer lower conduction losses and higher efficiency compared to P-CHANNEL types, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency by allowing for easier implementation of reverse voltage protection.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT can handle high power dissipation and current levels effectively.

Maximum VCEsat: 2.1 V

Low VCEsat results in lower power losses and higher efficiency in operation, making this IGBT a cost-effective choice.

Maximum Power Dissipation (Abs): 349 W

With a high power dissipation capability, this IGBT can handle demanding power control applications with ease.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Maximum Collector-Emitter Voltage: 650 V

The high maximum voltage rating ensures that the IGBT can handle high voltage levels without breakdown, increasing its versatility.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH60T65SHD-F155 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

165 ns

Nominal Turn On Time (ton):

85 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGH60T65SHD-F155 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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