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FGH40N60UFDTU

Onsemi

FGH40N60UFDTU by Onsemi

FGH40N60UFDTU by Onsemi is an N-CHANNEL IGBT with 600V VCE, 80A IC, and 290W Ptot. Ideal for power control applications due to its fast tf of 100ns and toff of 190ns. The package style is flange mount with a max operating temperature of 150°C.

Median Price

$4.090

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 210 parts In-Stock

1+ parts

$1.423

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$1.114

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$1.008

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210

$1.423

$1.114

$1.008

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Farnell

UK . 569 parts In-Stock

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$3.590

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$1.630

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$1.410

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569

$3.590

$1.630

$1.410

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DigiKey

USA . 1,655 parts In-Stock

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$4.090

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$2.252

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$1.549

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$1.396

1,655

$4.090

$2.252

$1.549

$1.396

Mouser Electronics

USA . 102 parts In-Stock

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$4.090

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Chip1Stop

Japan . 300 parts In-Stock

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$4.595

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$3.084

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Newark

USA . 387 parts In-Stock

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$4.760

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$2.720

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$2.520

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387

$4.760

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Element14

Singapore . 519 parts In-Stock

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$5.810

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$2.390

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$2.240

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519

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Flip Electronics (Authorized)

USA . 1,498 parts In-Stock

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Verical

USA . 231 parts In-Stock

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Rochester

USA . 231 parts In-Stock

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$1.410

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$1.260

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Distributors (In-Stock)

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Digiode

USA . 1,419 parts In-Stock

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$2.413

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Nova Conductors

Japan . 600 parts In-Stock

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TME

Poland . 370 parts In-Stock

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$3.420

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$3.420

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Maritex

Poland . 300 parts In-Stock

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$3.542

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$2.137

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$1.805

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300

$3.542

$2.137

$1.805

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Chip Stock

USA . 8,700 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,780 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,678 parts In-Stock

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Vyrian

USA . 481 parts In-Stock

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J & M Industries LLC

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NAC Semi

USA . 120 parts In-Stock

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$7.110

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Flip Electronics

USA . 92 parts In-Stock

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Microfarads

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Partservice

France . 28 parts In-Stock

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$3.443

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$3.443

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$3.443

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$3.443

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$3.443

Micros sp.j. W. Kędra i J. Lic

Poland . 28 parts In-Stock

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$3.688

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$3.688

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$3.688

28

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$3.688

Distributors (Availability)

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Modulus Dynamics

Lithuania . 21,723 parts In-Stock

1+ parts

$0.732

100+ parts

$0.732

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$0.732

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21,723

$0.732

$0.732

$0.732

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Aztec Data Supply Inc.

USA . 3,490 parts In-Stock

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$1.834

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Ampacity Inc.

Singapore . 349 parts In-Stock

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$2.160

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Semicontronic

India . 304 parts In-Stock

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$2.106

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$2.095

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Corphita

USA . 2,814 parts In-Stock

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Corohmni

South Africa . 225 parts In-Stock

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$2.540

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Continental Prestige Electronics

USA . 3,056 parts In-Stock

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$2.825

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$2.768

3,056

$2.825

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$2.768

Argo Parts USA

USA . 2,373 parts In-Stock

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$2.825

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$3.351

100+ parts

$3.083

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$2.889

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40

$3.351

$3.083

$2.889

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Component Stockers USA

USA . 470 parts In-Stock

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$4.540

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$3.080

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470

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$3.080

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Microchip USA

USA . 7,734 parts In-Stock

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$31.720

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Perfect Parts

USA . 65,812 parts In-Stock

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Kepictronics

USA . 23,850 parts In-Stock

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Robosynatics

Brazil . 12,292 parts In-Stock

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$1.584

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$1.551

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$1.551

12,292

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$1.584

$1.551

$1.551

Lucentia Tech

USA . 12,292 parts In-Stock

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$1.584

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$1.551

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$1.551

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$1.551

$1.551

Problanco Electronics

Mexico . 7,763 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,942 parts In-Stock

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Kulean Microsystems

USA . 5,435 parts In-Stock

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RC Electronics

USA . 5,074 parts In-Stock

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$2.990

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$2.730

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$2.640

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TANS Electronics

Latvia . 5,019 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,961 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$2.952

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$2.862

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$2.802

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Lixinc

USA . 1,619 parts In-Stock

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SupplyDigital Components

Austria . 1,399 parts In-Stock

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Supply Digital

USA . 1,334 parts In-Stock

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Authorized Procurement Solutions

USA . 332 parts In-Stock

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Eastek

USA . 300 parts In-Stock

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iodParts Technologies Inc.

India . 286 parts In-Stock

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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GreenTree Electronics

Israel . 180 parts In-Stock

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Overview

Discover the power of the FGH40N60UFDTU by Onsemi, a top-of-the-line Insulated Gate Bipolar Transistor designed for high-performance power control applications. With a single configuration and built-in diode, this transistor offers superior quality and reliability. From its maximum operating temperature of 150°C to its maximum collector current of 80A, this transistor delivers exceptional performance in a variety of settings. Trust Onsemi's reputation for excellence and choose the FGH40N60UFDTU for all your power control needs. Experience the value and benefits that only Onsemi can provide with this cutting-edge transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, which is ideal for applications where weight and reliability are important factors.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are known for their high efficiency and fast switching speeds, making them suitable for power control applications that require quick response times.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this IGBT a convenient option for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for handling high power levels efficiently and reliably.

Maximum Collector-Emitter Voltage: 600 V

With a high maximum voltage rating, this IGBT can handle high voltage levels, making it suitable for applications that require voltage regulation and control.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH40N60UFDTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

100 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

190 ns

Nominal Turn On Time (ton):

110 ns

Trade Compliance

FGH40N60UFDTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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