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FS150R12KT4_B11

Infineon Technologies

FS150R12KT4_B11 by Infineon Technologies

FS150R12KT4_B11 by Infineon is an N-CHANNEL IGBT with 6 elements in a bridge configuration. It has a VCEsat of 2.2V, IC of 150A, and Pmax of 750W. Ideal for high-power applications requiring fast switching such as motor drives and power supplies due to its low on/off times and high collector-emitter voltage.

Median Price

$114.260

Lifecycle Status

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6

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1k+

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Mouser Electronics

USA . 37 parts In-Stock

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$114.260

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Digiode

USA . 486 parts In-Stock

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$118.712

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Nova Conductors

Japan . 500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 410 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 90 parts In-Stock

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Vyrian

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Modulus Dynamics

Lithuania . 6,557 parts In-Stock

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$0.735

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$0.706

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$0.676

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6,557

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AZTECH Wire

Italy . 753 parts In-Stock

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$11.790

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Ampacity Inc.

Singapore . 15 parts In-Stock

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$106.220

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Corphita

USA . 953 parts In-Stock

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$112.464

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Continental Prestige Electronics

USA . 6,935 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Perfect Parts

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Overview

Discover the unparalleled performance and reliability of the FS150R12KT4_B11 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Insulated Gate Bipolar Transistors (IGBT) for various applications. With built-in diode and thermistor, this N-CHANNEL transistor offers exceptional value and benefits to customers. From its maximum power dissipation of 750W to its maximum collector-emitter voltage of 1200V, this product is designed to exceed expectations. Upgrade your projects with the FS150R12KT4_B11 and experience the difference in performance and efficiency.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high current and voltage capabilities, making them suitable for a wide range of applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration allows for easy integration into power electronic circuits, while the built-in diode and thermistor enhance efficiency and reliability.

Maximum VCEsat: 2.2 V

Low VCEsat means lower power dissipation and higher efficiency in the circuit, which is beneficial for reducing heat generation and energy loss.

Package Shape: RECTANGULAR

Rectangular packages are easy to mount and provide a compact design, ideal for space-constrained applications.

Nominal Turn Off Time (toff): 605 ns

Fast turn-off time enhances switching performance and reduces power losses, improving the overall efficiency of the IGBT.

Maximum Power Dissipation (Abs): 750 W

High power dissipation capability allows for handling large currents and voltages without overheating, ensuring reliable operation in demanding environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this IGBT can withstand harsh conditions and maintain performance stability in extreme environments.

Maximum Collector-Emitter Voltage: 1200 V

The high voltage rating enables this IGBT to support high-power applications and voltage levels, making it suitable for industrial and automotive sectors.

Transistor Element Material: SILICON

Silicon-based IGBTs offer good thermal conductivity and high breakdown voltage, ensuring reliable performance in various power electronic systems.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage rating indicates the safe operating range for the control signal, preventing damage to the IGBT during switching operations.

Maximum Collector Current (IC): 150 A

High collector current rating allows this IGBT to handle large current flows, making it suitable for high-power applications such as motor control and inverters.

Terminal Position: UPPER

The upper terminal position simplifies connection to control circuits and facilitates easy integration into existing systems, reducing installation time and complexity.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents potential electrical hazards, making this IGBT suitable for applications where isolation is crucial.

Nominal Turn On Time (ton): 165 ns

Fast turn-on time enhances response speed and efficiency of the IGBT, enabling precise control and improved performance in power electronic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12KT4_B11 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

605 ns

Nominal Turn On Time (ton):

165 ns

Maximum VCEsat:

2.2 V

Trade Compliance

FS150R12KT4_B11 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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