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FS15R06VE3B2BOMA1

Infineon Technologies

FS15R06VE3B2BOMA1 by Infineon Technologies

Infineon's FS15R06VE3B2BOMA1 is a N-CHANNEL IGBT with 6 elements, 600V max collector-emitter voltage, and 22A max collector current. Ideal for power control applications, it features a complex configuration, 260ns turn off time, and UL recognized standard.

Median Price

$18.742

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 66 parts In-Stock

1+ parts

-

100+ parts

$16.660

1k+ parts

$14.910

10k+ parts

$14.030

66

-

$16.660

$14.910

$14.030

Verical

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$20.825

1k+ parts

$18.637

10k+ parts

$17.538

39

-

$20.825

$18.637

$17.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 259 parts In-Stock

1+ parts

$17.632

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259

$17.632

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Vyrian

USA . 7,493 parts In-Stock

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7,493

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,743 parts In-Stock

1+ parts

$0.778

100+ parts

$0.747

1k+ parts

$0.716

10k+ parts

-

4,743

$0.778

$0.747

$0.716

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Corohmni

South Africa . 37 parts In-Stock

1+ parts

$1.914

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-

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37

$1.914

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AZTECH Wire

Italy . 371 parts In-Stock

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$11.670

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371

$11.670

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Ampacity Inc.

Singapore . 53 parts In-Stock

1+ parts

$15.780

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53

$15.780

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Corphita

USA . 426 parts In-Stock

1+ parts

$16.704

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426

$16.704

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Component Stockers USA

USA . 35 parts In-Stock

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$19.180

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35

$19.180

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Microchip USA

USA . 179 parts In-Stock

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$60.073

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179

$60.073

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Continental Prestige Electronics

USA . 884 parts In-Stock

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Argo Parts USA

USA . 184 parts In-Stock

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184

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the innovative FS15R06VE3B2BOMA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor that offers unmatched power control capabilities in a variety of applications. With its N-CHANNEL configuration and 600V maximum collector-emitter voltage, this transistor ensures reliable performance and efficiency. Ideal for complex power control tasks, this product boasts a quick turn-off time of 260ns and a nominal turn-on time of 29ns, making it a valuable asset for your projects. Trust Infineon Technologies for cutting-edge technology and superior quality components that deliver exceptional results every time.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have lower conduction losses than P-CHANNEL IGBTs, making them more efficient for power control applications.

Configuration: COMPLEX

Complex configurations offer more versatility in power control applications, allowing for intricate control of power output.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and reliable performance.

Maximum Collector-Emitter Voltage: 600 V

The high maximum voltage rating allows for use in high-power applications without risk of damage.

Maximum Collector Current (IC): 22 A

With a high collector current rating, this IGBT can handle high power loads effectively.

Nominal Turn On Time (ton): 29 ns

Fast turn on time allows for quick response in power control applications, improving efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS15R06VE3B2BOMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-XUFM-X15

Moisture Sensitivity Level (MSL):

1

No. of Elements:

6

No. of Terminals:

15

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

260 ns

Nominal Turn On Time (ton):

29 ns

Trade Compliance

FS15R06VE3B2BOMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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