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FS150R12KT4B11BOSA1

Infineon Technologies

FS150R12KT4B11BOSA1 by Infineon Technologies

FS150R12KT4B11BOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 6 elements, built-in diode, and thermistor. It has a max collector-emitter voltage of 1200V and a nominal turn-off time of 605ns. This power control transistor is designed for applications requiring fast switching speeds in bridge configurations.

Median Price

$103.955

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$20.070

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2

$20.070

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Verical

USA . 2 parts In-Stock

1+ parts

$20.070

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2

$20.070

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DigiKey

USA . 36 parts In-Stock

1+ parts

$114.260

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$114.260

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Chip1Stop

Japan . 10 parts In-Stock

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$197.000

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$197.000

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RS (Exports)

UK . 9 parts In-Stock

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$314.889

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$314.889

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Rochester

USA . 4 parts In-Stock

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$93.650

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$83.790

10k+ parts

$78.860

4

-

$93.650

$83.790

$78.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 169 parts In-Stock

1+ parts

$105.545

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$105.545

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Nova Conductors

Japan . 750 parts In-Stock

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$247.020

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750

$247.020

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Vyrian

USA . 3,639 parts In-Stock

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3,639

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IBS Electronics

USA . 20 parts In-Stock

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$142.087

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20

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$142.087

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 7,998 parts In-Stock

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$0.465

100+ parts

$0.446

1k+ parts

$0.428

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-

7,998

$0.465

$0.446

$0.428

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Aztec Data Supply Inc.

USA . 1,126 parts In-Stock

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$0.480

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1,126

$0.480

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$1.112

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$1.012

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$0.912

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10

$1.112

$1.012

$0.912

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Corohmni

South Africa . 66 parts In-Stock

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$1.584

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$1.584

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AZTECH Wire

Italy . 483 parts In-Stock

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$8.985

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$8.985

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Ampacity Inc.

Singapore . 8 parts In-Stock

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$94.430

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8

$94.430

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Semicontronic

India . 8 parts In-Stock

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$94.430

100+ parts

$92.069

1k+ parts

$91.597

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8

$94.430

$92.069

$91.597

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Corphita

USA . 818 parts In-Stock

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$99.990

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818

$99.990

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Continental Prestige Electronics

USA . 554 parts In-Stock

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$247.020

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$242.080

554

$247.020

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$242.080

Microchip USA

USA . 2,507 parts In-Stock

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$433.500

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$433.500

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Argo Parts USA

USA . 1,418 parts In-Stock

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Overview

Unlock the power of Infineon Technologies with the FS150R12KT4B11BOSA1 Insulated Gate Bipolar Transistor. This N-CHANNEL transistor offers exceptional quality and reliability, making it ideal for power control applications. With built-in diodes and a thermistor, this transistor provides seamless performance and efficiency. Experience the benefits of faster turn-off and turn-on times, maximizing your power management capabilities. Trust in the superior design and engineering of Infineon Technologies to take your projects to the next level. Elevate your power control solutions with the FS150R12KT4B11BOSA1 today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses and are more efficient compared to P-CHANNEL IGBTs, making this product suitable for high power applications.

Configuration: BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

The bridge configuration with built-in diode and thermistor provides enhanced protection and efficiency in power control applications.

Transistor Application: POWER CONTROL

Designed for power control applications, this IGBT offers high performance and reliability in managing power flow.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and installation in various systems and equipment.

Nominal Turn Off Time (toff): 605 ns

Fast turn off time ensures quick switching and reduces power dissipation, improving overall efficiency of the circuit.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating makes this IGBT suitable for high voltage applications requiring reliable power handling capabilities.

Nominal Turn On Time (ton): 165 ns

Quick turn on time contributes to high-speed operation and efficient power control in dynamic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FS150R12KT4B11BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

6

No. of Terminals:

35

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

605 ns

Nominal Turn On Time (ton):

165 ns

Trade Compliance

FS150R12KT4B11BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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