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FD300R12KE3HOSA1

Infineon Technologies

FD300R12KE3HOSA1 by Infineon Technologies

Infineon's FD300R12KE3HOSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 480A max collector current, and 830ns turn off time. It is a single configuration with built-in diode, suitable for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$129.360

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 10 parts In-Stock

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$89.580

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10

$89.580

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Verical

USA . 5 parts In-Stock

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$114.969

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5

$114.969

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Arrow

USA . 9 parts In-Stock

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$128.920

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9

$128.920

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DigiKey

USA . 7 parts In-Stock

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$129.360

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7

$129.360

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Newark

USA . 8 parts In-Stock

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$133.240

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$133.240

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Chip1Stop

Japan . 10 parts In-Stock

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$137.000

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$137.000

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Element14

Singapore . 10 parts In-Stock

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$139.910

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$139.910

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Distributors (In-Stock)

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Digiode

USA . 267 parts In-Stock

1+ parts

$130.036

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267

$130.036

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Nova Conductors

Japan . 100 parts In-Stock

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$183.683

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Vyrian

USA . 3,191 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 175 parts In-Stock

1+ parts

$0.491

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175

$0.491

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$1.751

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$1.593

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$1.436

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1,000

$1.751

$1.593

$1.436

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Modulus Dynamics

Lithuania . 17,151 parts In-Stock

1+ parts

$1.960

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$1.882

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$1.803

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17,151

$1.960

$1.882

$1.803

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AZTECH Wire

Italy . 664 parts In-Stock

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$11.711

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$93.060

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$93.060

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Corphita

USA . 728 parts In-Stock

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$123.192

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Continental Prestige Electronics

USA . 6,971 parts In-Stock

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$180.888

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$177.270

6,971

$180.888

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$177.270

QUARKTWIN TECHNOLOGY LTD

USA . 25,398 parts In-Stock

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Microchip USA

USA . 4,991 parts In-Stock

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Argo Parts USA

USA . 4,143 parts In-Stock

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Bastille Electronics

Australia . 69 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Enhance your power electronics projects with the FD300R12KE3HOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this N-CHANNEL configuration with a built-in diode. Perfect for high-power applications, this rectangular package style transistor offers a maximum collector-emitter voltage of 1200V and a maximum collector current of 480A. With fast turn-on and turn-off times, this product ensures efficiency and reliability in your designs. Upgrade to the FD300R12KE3HOSA1 and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel IGBTs, making them a good choice for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and saves space, making this IGBT a convenient choice for applications where diode functionality is required.

Nominal Turn Off Time (toff): 830 ns

The fast turn-off time of 830 ns reduces switching losses and enhances the efficiency of the device, making it suitable for high-frequency applications.

Maximum Collector-Emitter Voltage: 1200 V

With a high maximum collector-emitter voltage of 1200 V, this IGBT can handle high voltage applications reliably and safely.

Maximum Collector Current (IC): 480 A

A high maximum collector current of 480 A allows the IGBT to handle high power levels effectively, making it suitable for heavy-duty applications.

Nominal Turn On Time (ton): 400 ns

The fast turn-on time of 400 ns enhances the switching speed of the IGBT, making it suitable for applications where quick response times are required.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD300R12KE3HOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

JESD-30 Code:

R-XUFM-X5

No. of Elements:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

830 ns

Nominal Turn On Time (ton):

400 ns

Trade Compliance

FD300R12KE3HOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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