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IKD04N60RAATMA1

Infineon Technologies

IKD04N60RAATMA1 by Infineon Technologies

IKD04N60RAATMA1 by Infineon is an N-Channel IGBT with VCEsat of 2.1V, toff of 342ns, and Pmax of 75W. Ideal for high-power applications requiring a max VCE of 600V, such as motor drives and power supplies. Operating temperatures range from -40°C to 175°C.

Median Price

$0.740

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,345 parts In-Stock

1+ parts

-

100+ parts

$0.740

1k+ parts

$0.614

10k+ parts

$0.547

6,345

-

$0.740

$0.614

$0.547

Verical

USA . 4,664 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.767

10k+ parts

$0.684

4,664

-

-

$0.767

$0.684

DigiKey

USA . 1,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.630

10k+ parts

-

1,681

-

-

$0.630

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

-

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-

10

$0.546

-

-

-

Digiode

USA . 408 parts In-Stock

1+ parts

$0.577

100+ parts

-

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-

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408

$0.577

-

-

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Vyrian

USA . 4,174 parts In-Stock

1+ parts

-

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4,174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,037 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

$0.400

-

-

-

Semicontronic

India . 4,049 parts In-Stock

1+ parts

$0.520

100+ parts

$0.507

1k+ parts

$0.504

10k+ parts

-

4,049

$0.520

$0.507

$0.504

-

Continental Prestige Electronics

USA . 5,221 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

-

10k+ parts

$0.535

5,221

$0.546

-

-

$0.535

Argo Parts USA

USA . 3,089 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

-

10k+ parts

$0.530

3,089

$0.546

-

-

$0.530

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.546

100+ parts

-

1k+ parts

$0.519

10k+ parts

$0.508

50

$0.546

-

$0.519

$0.508

Corphita

USA . 312 parts In-Stock

1+ parts

$0.546

100+ parts

-

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312

$0.546

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Modulus Dynamics

Lithuania . 2,223 parts In-Stock

1+ parts

$0.932

100+ parts

$0.895

1k+ parts

$0.857

10k+ parts

-

2,223

$0.932

$0.895

$0.857

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Corohmni

South Africa . 1,006 parts In-Stock

1+ parts

$1.104

100+ parts

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10k+ parts

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1,006

$1.104

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Ampacity Inc.

Singapore . 3,932 parts In-Stock

1+ parts

$1.120

100+ parts

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10k+ parts

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3,932

$1.120

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Microchip USA

USA . 2,384 parts In-Stock

1+ parts

$3.770

100+ parts

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10k+ parts

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2,384

$3.770

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Overview

Unlock the potential of your applications with the IKD04N60RAATMA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like this N-Channel device that offers exceptional performance and reliability. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of 342ns, this transistor is perfect for a wide range of power electronics applications. Experience the value and benefits that this product brings to your projects, from its high power dissipation capability to its wide operating temperature range. Trust Infineon for superior quality and innovation in every component.

Feature Benefit Bullets

Polarity or Channel Type: N-Channel

N-Channel IGBTs have higher input impedance and fast switching speeds, making them suitable for high-frequency applications.

Maximum VCEsat: 2.1 V

Low VCEsat reduces power dissipation and improves efficiency of the device.

Nominal Turn Off Time (toff): 342 ns

Fast turn-off time ensures quick switching and minimal switching losses.

Maximum Power Dissipation (Abs): 75 W

High power dissipation capability allows the device to handle high power loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range enables the IGBT to be used in various environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High maximum collector-emitter voltage makes the IGBT suitable for high voltage applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high voltage capability and better thermal performance.

Maximum Gate-Emitter Voltage: 20 V

Higher gate-emitter voltage provides robust turn-on and turn-off characteristics.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IGBT to operate in cold environments.

Maximum Collector Current (IC): 8 A

High collector current rating allows the IGBT to handle high current loads efficiently.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Lower gate-emitter threshold voltage ensures reliable turn-on and turn-off operation.

Nominal Turn On Time (ton): 20 ns

Fast turn-on time enables quick response and efficient power delivery.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD04N60RAATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

342 ns

Nominal Turn On Time (ton):

20 ns

Maximum VCEsat:

2.1 V

Trade Compliance

IKD04N60RAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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