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IKD06N60RFAATMA1

Infineon Technologies

IKD06N60RFAATMA1 by Infineon Technologies

IKD06N60RFAATMA1 by Infineon Technologies is an N-CHANNEL IGBT with a max VCEsat of 2.5V and a max collector-emitter voltage of 600V. It is used for power control applications and has a small outline package style, making it suitable for surface mount designs.

Median Price

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3

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1k+

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Vyrian

USA . 3,612 parts In-Stock

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Digiode

USA . 969 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Modulus Dynamics

Lithuania . 12,916 parts In-Stock

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$0.790

100+ parts

$0.758

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$0.727

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12,916

$0.790

$0.758

$0.727

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Aztec Data Supply Inc.

USA . 12,169 parts In-Stock

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$1.769

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$1.769

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Corohmni

South Africa . 685 parts In-Stock

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$1.988

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685

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Ampacity Inc.

Singapore . 1,008 parts In-Stock

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$8.050

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$8.050

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AZTECH Wire

Italy . 509 parts In-Stock

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$17.732

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Semicontronic

India . 1,080 parts In-Stock

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$40.050

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$39.049

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$38.848

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$39.049

$38.848

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Continental Prestige Electronics

USA . 1,678 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Discover the IKD06N60RFAATMA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor (IGBT) that offers outstanding performance and reliability. With its N-CHANNEL polarity and built-in diode, this transistor is perfect for power control applications. Its small outline package shape and gull wing terminal form make it easy to install and use. Featuring a maximum collector-emitter voltage of 600V and a maximum collector current of 12A, this IGBT delivers exceptional power and efficiency. Trust in Infineon Technologies' expertise and choose the IKD06N60RFAATMA1 for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and protection, making it suitable for various applications in different environments.

Polarity or Channel Type: N-CHANNEL

With its N-channel polarity or channel type, this IGBT offers efficient power control capabilities and high-performance characteristics.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode in this IGBT simplifies the circuit design and provides enhanced convenience for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT delivers excellent performance and reliability in controlling high power levels efficiently.

Surface Mount: YES

With its surface mount capability, this IGBT can be easily mounted on circuit boards, saving valuable space and enabling convenient integration into electronic systems.

Maximum VCEsat: 2.5 V

The low maximum VCEsat of 2.5 V in this IGBT reduces power losses and improves overall efficiency, making it an ideal choice for power control applications where minimizing energy waste is crucial.

Package Shape: RECTANGULAR

The rectangular package shape of this IGBT allows for easy installation and integration into existing circuit designs, providing flexibility and compatibility with standard mounting methods.

Terminal Form: GULL WING

The gull wing terminal form of this IGBT ensures reliable electrical connections and simplifies soldering processes, enhancing the product's overall reliability and ease of use.

No. of Elements: 1

With a single element, this IGBT provides a straightforward and uncomplicated solution for power control applications, offering simplicity and ease of implementation.

Nominal Turn Off Time (toff): 149 ns

The relatively fast nominal turn-off time of 149 ns in this IGBT enables precise control and rapid switching, making it suitable for applications requiring fast response times.

No. of Terminals: 2

With only two terminals, this IGBT offers simplicity in circuit connections and reduces the complexity of circuit board layouts, optimizing design efficiency.

Maximum Power Dissipation (Abs): 100 W

The high maximum power dissipation of 100 W in this IGBT allows it to handle high power levels effectively, providing reliability and stability under demanding operating conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this IGBT enhances its portability and compatibility with different mounting systems, enabling it to be used in diverse applications with space constraints.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this IGBT can withstand high-temperature environments, making it suitable for applications that require efficient power control in extreme conditions.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage of 600 V in this IGBT enables it to handle high voltage levels, making it suitable for power control applications where voltage regulation is critical.

Transistor Element Material: SILICON

The use of silicon as the transistor element material in this IGBT ensures high performance, reliability, and compatibility with various circuit designs, making it a reliable choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a maximum gate-emitter voltage of 20 V, this IGBT offers a wide operating range, enabling precise control and efficient power regulation in different applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extremely cold environments, making this IGBT suitable for a wide range of operating conditions.

Maximum Collector Current (IC): 12 A

With a maximum collector current of 12 A, this IGBT can handle high current loads, making it suitable for power control applications that require efficient current regulation and switching.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

The high maximum gate-emitter threshold voltage of 5.7 V allows for precise control and accurate switching, ensuring reliable power control in various applications.

Terminal Position: SINGLE

With a single terminal position, this IGBT simplifies circuit connections and ensures ease of use and compatibility with standard mounting methods.

Case Connection: COLLECTOR

The case connection to the collector in this IGBT enhances thermal dissipation and provides efficient heat management, ensuring reliable performance and extending the product's lifespan.

Nominal Turn On Time (ton): 17 ns

The relatively fast nominal turn-on time of 17 ns in this IGBT enables quick activation and efficient switching, making it suitable for applications requiring rapid response times.

Reference Standard: AEC-Q101

Complying with the AEC-Q101 reference standard ensures the high quality, reliability, and automotive-grade performance of this IGBT, making it an excellent choice for automotive applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD06N60RFAATMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

149 ns

Nominal Turn On Time (ton):

17 ns

Maximum VCEsat:

2.5 V

Trade Compliance

IKD06N60RFAATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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