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IKD04N60RFBTMA1

Infineon Technologies

IKD04N60RFBTMA1 by Infineon Technologies

IKD04N60RFBTMA1 by Infineon is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 8A max collector current, and 216ns turn-off time. Ideal for power control applications due to its 75W max power dissipation, small outline package style, and built-in diode configuration.

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3

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1k+

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Vyrian

USA . 812 parts In-Stock

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Digiode

USA . 210 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Modulus Dynamics

Lithuania . 1,252 parts In-Stock

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$0.774

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$0.743

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$0.712

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Corohmni

South Africa . 90 parts In-Stock

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$1.187

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Aztec Data Supply Inc.

USA . 239 parts In-Stock

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Semicontronic

India . 1,515 parts In-Stock

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$2.050

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$1.999

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$1.988

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AZTECH Wire

Italy . 218 parts In-Stock

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$10.627

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Ampacity Inc.

Singapore . 425 parts In-Stock

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$45.050

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Continental Prestige Electronics

USA . 5,285 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Unlock the power of efficient and reliable power control with the IKD04N60RFBTMA1 from Infineon Technologies. As a leading manufacturer in Insulated Gate Bipolar Transistors, Infineon delivers top-quality products like this N-CHANNEL transistor with a built-in diode, perfect for a variety of applications. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of 216ns, this transistor offers high performance in a small outline package. Trust Infineon to provide advanced technology and superior quality for all your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Offers high efficiency and fast switching speeds, making it suitable for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance and efficient power management.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Facilitates efficient placement on circuit boards and optimizes space utilization.

Nominal Turn Off Time (toff): 216 ns

Ensures fast turn-off time, reducing power loss and improving overall efficiency.

Maximum Power Dissipation (Abs): 75 W

Capable of handling high power levels, suitable for applications requiring high power output.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, suitable for harsh environments.

Maximum Collector-Emitter Voltage: 600 V

Offers a high voltage rating, making it suitable for high voltage applications.

Transistor Element Material: SILICON

Provides high reliability and performance, ensuring long-lasting operation.

Maximum Gate-Emitter Voltage: 20 V

Allows for safe and reliable operation within specified voltage limits.

Maximum Collector Current (IC): 8 A

Capable of handling high current levels, suitable for power control applications.

Maximum Gate-Emitter Threshold Voltage: 5.7 V

Ensures proper gate control and switching characteristics, improving overall performance.

Terminal Position: SINGLE

Simplifies connection and installation, reducing the chances of errors during circuit assembly.

Case Connection: COLLECTOR

Provides a reliable connection point, ensuring efficient current flow and thermal management.

Nominal Turn On Time (ton): 18 ns

Offers fast turn-on time, enabling quick response and high-speed switching capabilities.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKD04N60RFBTMA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

216 ns

Nominal Turn On Time (ton):

18 ns

Trade Compliance

IKD04N60RFBTMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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