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FP100R06KE3

Infineon Technologies

FP100R06KE3 by Infineon Technologies

FP100R06KE3 by Infineon Technologies is an N-CHANNEL IGBT with 600V VCEsat, 100A IC, and 1.9V VCEsat. Its complex configuration makes it suitable for high-power applications like motor drives and inverters due to its 335W power dissipation capability.

Median Price

$165.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 11 parts In-Stock

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$129.120

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Chip1Stop

Japan . 6 parts In-Stock

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$202.000

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6

$202.000

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Digiode

USA . 706 parts In-Stock

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$143.364

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706

$143.364

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Chip Stock

USA . 245 parts In-Stock

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245

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Nova Conductors

Japan . 200 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 57 parts In-Stock

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Vyrian

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 1,567 parts In-Stock

1+ parts

$1.608

100+ parts

$1.544

1k+ parts

$1.479

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1,567

$1.608

$1.544

$1.479

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AZTECH Wire

Italy . 815 parts In-Stock

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$8.714

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815

$8.714

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Andel Nordic

Denmark . 1,327 parts In-Stock

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$41.290

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$28.901

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$28.901

1,327

$41.290

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$28.901

$28.901

Corphita

USA . 389 parts In-Stock

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$135.819

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A-Z Elektronik GmbH

Germany . 6,909 parts In-Stock

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Continental Prestige Electronics

USA . 6,490 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,606 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Argo Parts USA

USA . 633 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

USA . 45 parts In-Stock

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Overview

Experience next-level performance with the FP100R06KE3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled advantages in power electronics applications. From its N-CHANNEL polarity to its complex configuration, this product sets a new standard in efficiency. With a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V, this IGBT provides exceptional value and benefits to customers seeking superior power management solutions. Elevate your projects and unleash the full potential of your applications with the FP100R06KE3 from Infineon Technologies.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower ON-resistance and higher efficiency compared to P-CHANNEL IGBTs.

Maximum VCEsat: 1.9 V

Low VCEsat value indicates lower power loss and higher efficiency in the switching operation.

Configuration: COMPLEX

Complex configuration allows for better control and optimization of the switching characteristics and performance.

Maximum Power Dissipation (Abs): 335 W

High power dissipation capacity enables the device to handle larger loads and higher current levels effectively.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating allows the IGBT to be used in applications requiring higher voltage levels without breakdown.

Nominal Turn On Time (ton): 170 ns

Fast turn-on time ensures quick response and efficient switching for better performance in high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP100R06KE3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

820 ns

Nominal Turn On Time (ton):

170 ns

Maximum VCEsat:

1.9 V

Trade Compliance

FP100R06KE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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